Interface Crack in a Three-Phase Composite Constitutive Model

1991 ◽  
Vol 58 (2) ◽  
pp. 428-434 ◽  
Author(s):  
H. A. Luo ◽  
Y. Chen
Keyword(s):  
Stress Intensity ◽  
Interface Crack ◽  
Stress Intensity Factors ◽  
Crack Opening ◽  
Material Model ◽  
Complex Stress ◽  
Intensity Factors ◽  
Reinforced Composite ◽  
Three Phase ◽  
Shaped Crack

An arc-shaped crack in fiber-reinforced composite material is the subject of this paper. A three-phase composite cylinder is taken as the material model to take into account the effect of surrounding fibers. Using Muskhelishvili’s complex variable method, an exact elastic solution is derived based on the conventional crack opening assumption. The complex stress intensity factors for the interface crack, in the sense defined by Hutchinson, Mear, and Rice, are determined. Some numerical examples are given. It is shown that, as the volume concentration of the fiber is increased, the magnitude of the complex stress intensity factors varies considerably.

scholarly journals Crack Paralleling an Interface Between Dissimilar Materials

1987 ◽  
Vol 54 (4) ◽  
pp. 828-832 ◽  
Author(s):  
J. W. Hutchinson ◽  
M. E. Mear ◽  
J. R. Rice
Keyword(s):  
Stress Intensity ◽  
Interface Crack ◽  
Stress Intensity Factors ◽  
Dissimilar Materials ◽  
Complex Stress ◽  
External Loading ◽  
Universal Relation ◽  
Intensity Factors ◽  
Elastic Solids ◽  
Complex Stress Intensity Factor

A crack paralleling a bonded plane interface between two dissimilar isotropic elastic solids is considered. When the distance of the crack from the interface is small compared to the crack length itself and to other length scales characterizing the geometry, a simple universal relation exists between the Mode I and Mode II stress intensity factors and the complex stress intensity factor associated with the corresponding problem for the crack lying on the interface. In other words, if the influence of external loading and geometry on the interface crack is known, then this information can immediately be used to generate the stress intensity factors for the sub-interface crack. Conditions for cracks to propagate near and parallel to, but not along, an interface are derived.

The Interface Crack in a Combined Tension-Compression and Shear Field

1979 ◽  
Vol 46 (2) ◽  
pp. 345-348 ◽  
Author(s):  
Maria Comninou ◽  
D. Schmueser
Keyword(s):  
Shear Stress ◽  
Stress Intensity ◽  
Interface Crack ◽  
Stress Intensity Factors ◽  
Crack Opening ◽  
Intensity Factors ◽  
Contact Zones ◽  
Frictionless Contact ◽  
Applied Tension ◽  
Crack Tips

The interface crack was analyzed in two recent papers which considered applied tension and shear fields separately. The unrealistic oscillatory singularities and the ensuing material interpenetration were eliminated in these solutions by assuming small frictionless contact zones near the crack tips. The present paper presents a solution for the interface crack under combined normal and shear tractions. Both tensile and compressive normal tractions are considered and numerical results of the extents of the contact zones, shear stress-intensity factors, and interface crack opening profiles are presented.

Calculation of Stress Intensity Factors and Crack Opening Displacements for Cracks Subjected to Complex Stress Fields

2003 ◽  
Vol 125 (3) ◽  
pp. 260-266 ◽  
Author(s):  
A. Kiciak ◽  
G. Glinka ◽  
D. J. Burns
Keyword(s):  
Stress Intensity ◽  
Stress Intensity Factors ◽  
Fatigue Cracks ◽  
Crack Opening ◽  
Complex Stress ◽  
Pressure Vessels ◽  
Stress Fields ◽  
Function Technique ◽  
Weight Functions ◽  
Intensity Factors

Fatigue cracks in shot peened and case hardened notched machine components and high-pressure vessels are subjected to the stress fields induced by the external load and the residual stress resulting from the surface treatment or autofrettage. Both stress fields are usually nonuniform and available handbook stress intensity factor solutions are in most cases unavailable for such configurations, especially in the case of two-dimensional surface breaking cracks such as semi-elliptical and quarter-elliptical cracks at notches. The method presented in the paper makes it possible to calculate stress intensity factors for such cracks and complex stress fields by using the generalized weight function technique. It is also shown that the generalized weight functions make it possible to calculate the crack opening displacement field often used in the determination of the critical load or the critical crack size.

Weight Functions for an External Longitudinal Semi-Elliptical Surface Crack in a Thick-Walled Cylinder

1997 ◽  
Vol 119 (1) ◽  
pp. 74-82 ◽  
Author(s):  
A. Kiciak ◽  
G. Glinka ◽  
D. J. Burns
Keyword(s):  
Stress Intensity ◽  
Stress Intensity Factors ◽  
Surface Crack ◽  
Complex Stress ◽  
Weight Functions ◽  
Stress Distributions ◽  
Intensity Factors ◽  
Reference Stress ◽  
Pressurized Cylinder ◽  
Walled Cylinder

Mode I weight functions were derived for the deepest and surface points of an external radial-longitudinal semi-elliptical surface crack in a thick-walled cylinder with the ratio of the internal radius to wall thickness, Ri/t = 1.0. Coefficients of a general weight function were found using the method of two reference stress intensity factors for two independent stress distributions, and from properties of weight functions. Stress intensity factors calculated using the weight functions were compared to the finite element data for several different stress distributions and to the boundary element method results for the Lame´ hoop stress in an internally pressurized cylinder. A comparison to the ASME Pressure Vessel Code method for deriving stress intensity factors was also made. The derived weight functions enable simple calculations of stress intensity factors for complex stress distributions.

Reliability Evaluation of Flip Chip Using Stress Intensity Factors of an Interface Crack

2003 ◽  
Author(s):  
Won-Keun Kim ◽  
Toru Ikeda ◽  
Noriyuki Miyazaki
Keyword(s):  
Stress Intensity ◽  
Interface Crack ◽  
Stress Intensity Factors ◽  
Flip Chip ◽  
Liquid Crystal Display ◽  
Dissimilar Materials ◽  
Circuit Board ◽  
Electrical Performance ◽  
Intensity Factors ◽  
Adhesive Film

Anisotropic Conductive Adhesive Film (ACF) has been used for electronic assemblies such as the connection between a Liquid Crystal Display (LCD) panel and a flexible print circuit board (FPC). ACF is expected to be a key technology for flip chip packaging and chip size packaging. The goal of our work is to provide an optimum design scheme to achieve the best combination of electrical performance and mechanical reliability for electronic packages using the ACF. This study presents an evaluation technology for the delamination of the ACF connections. We utilized the stress intensity factors of an interface crack between jointed dissimilar materials. The evaluation technology presented herein was found to provide reliability of an electronic package using the ACF connection during the solder reflow process.

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