Mechanism of crack initiation and propagation of re-entrant auxetic honeycombs under thermal shock

2021 ◽  
pp. 1-13
Author(s):  
Zheng Li ◽  
B.L. Wang ◽  
Kaifa Wang

Abstract Thermal shock multiple cracking behaviors of re-entrant auxetic honeycombs with a negative Poisson's ratio are investigated, and the crack initiation and propagation behavior are discussed. An effective macro continuum model is developed to detect the effects of cracking density and microstructures of auxetic honeycombs on the thermal stress and intensity. The microscale tensile stresses in the struts ahead of the crack as functions of the corresponding thermal stress intensity factor (SIF) at the macroscale are evaluated by employing a macro-micro model. Then, a lower-bound method is proposed to assess the critical thermal load of auxetic honeycombs by combining the macro-micro model and the macro continuum model. A significant increase in both transient thermal stress and intensity as the growing cell-wall angle is demonstrated. Results for the maximum thermal SIF as well as the maximum tensile stress in the middle of cracks are calculated as functions of crack density and length. With the identical SIF, the microscale tensile stresses ahead of the crack in honeycombs with smaller cell-wall angles are greater than that in mediums with larger angles due to the more significant crack tip opening displacement. Critical thermal load prediction reveals that the honeycombs with smaller cell-wall angles generally possess more excellent thermal shock resistance. Also, the varying failure modes of different auxetic honeycomb strips under specific thermal load are predicted. The corresponding crack initiation and propagation mechanisms are revealed.

Coatings ◽  
2019 ◽  
Vol 9 (11) ◽  
pp. 697 ◽  
Author(s):  
Kawai ◽  
Kakisawa ◽  
Kubo ◽  
Yamaguchi ◽  
Yokoi ◽  
...  

For design of multi-layered environmental barrier coatings (EBCs), it is essential to assure mechanical reliability against interface crack initiation and propagation induced by thermal stress owing to a misfit of the coefficients of thermal expansion between the coating layers and SiC/SiC substrate. We conducted finite element method (FEM) analyses to evaluate energy release rate (ERR) for interface cracks and performed experiment to obtain interface fracture toughness to assess mechanical reliability of an EBC with a function of thermal barrier (T/EBC; SiC/SiAlON/mullite/Yb-silicate gradient composition layer/Yb2SiO5 with porous segment structure) on an SiC/SiC substrate under thermal stress due to cooling in fabrication process. Our FEM analysis revealed that a thinner SiAlON layer and a thicker mullite layer are most suitable to reduce ERRs for crack initiation at the SiC/SiAlON, SiAlON/mullite and mullite/Yb2Si2O7 interfaces. Interface fracture tests of the T/EBC with layer thicknesses within the proposed range exhibited fracture at the SiC/SiAlON and SiAlON/mullite interfaces. We also estimated the approximate fracture toughness for the SiC/SiAlON and SiAlON/mullite interfaces and lower limit of fracture toughness for the mullite/Yb2Si2O7 interface. Comparison between ERR and fracture toughness indicates that the fabricated T/EBC possesses sufficient mechanical reliability against interface crack initiation and propagation.


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