A Virtual Prototyping Framework for Electronics Manufacturing

Manufacturing ◽  
2002 ◽  
Author(s):  
J. Cecil ◽  
A. Kanchanapiboon

This paper presents a framework for supporting virtual prototyping related activities in the domain of printed circuit board (PCB) assembly. The focus of discussion is restricted to Surface Mount Technology (SMT) based processes only. In general, Virtual Prototyping enables the conceptualization, evaluation and validation of proposed ideas, plans and solutions. Using a virtual prototyping framework, cross functional evaluation and analysis can be facilitated where designers, manufacturing engineers, testing and other life-cycle team members can communicate effectively as well as identify and eliminate problems, which may arise later in the downstream manufacturing and testing activities.

2014 ◽  
Vol 874 ◽  
pp. 139-143 ◽  
Author(s):  
Jacek Pietraszek ◽  
Aneta Gądek-Moszczak ◽  
Tomasz Toruński

PartnerTech provides printed circuit board (PCB) assembly on request. Wired elements are assembled in through-hole technology and soldered on the wave soldering machine. The PCB with inserted elements is passed across the pumped wave of melted solder. Typically this process is accompanied by some class of defects like cracks, cavities, wrong solder thickness and poor conductor. In PartnerTech Ltd. another type of defects was observed: dispersion of small droplets of solder around holes. Quality assurance department plans to optimize the process in order to reduce the number of defects. In the first stage, it was necessary to develop a methodology for counting defects. This paper presents experimental design and analysis related to this project.


2014 ◽  
Vol 7 (11) ◽  
pp. 3674-3682 ◽  
Author(s):  
Jingping Liu ◽  
Cheng Yang ◽  
Haoyi Wu ◽  
Ziyin Lin ◽  
Zhexu Zhang ◽  
...  

A multilayer printed circuit board (PCB) can be fabricated using commercially available printing paper, which shows comparable functionalities with the conventional organic PCBs but 100 times lower environmental impact.


Author(s):  
Frank Toth ◽  
Gary F. Shade

Abstract Printed Circuit Board (PCB) assemblies are moving toward lead-free (LF) alloys and away from the traditional Sn-Pb alloy [1]. This change is creating new and unique failure modes as the process adapts to accommodate the higher temperatures of the new process [2]. In addition, mis-processed lots are more likely due to the complexity of assembling a mix of Sn-Pb and leadfree solders, components, PCBs, solder pastes, and fluxes. This case study helps to highlight the challenge and provides an example of what can happen, how to detect it, and how the defects can cause reliability failures.


2014 ◽  
Vol 598 ◽  
pp. 398-403 ◽  
Author(s):  
M.T. Yazdani Sabouni ◽  
Rasaratnam Logendran

A dynamic Printed Circuit Board (PCB) assembly system along with the most complete form of setup time in this assembly is introduced in this paper. An effective Branch-and-Price mechanism is employed to develop a lower bound for the three-machine problem. However, solving the sub problems remains computationally difficult because of their NP-hard nature. An optimal approach is established, which makes solving the sub problems computationally feasible.


2015 ◽  
Vol 789-790 ◽  
pp. 1245-1251
Author(s):  
Ullah Saif ◽  
Zai Lin Guan ◽  
Zong Dong He ◽  
Cong He ◽  
Cao Jun

Printed circuit board (PCB) assembly planning problem has been given lot of attention to efficiently manage the orders of different PCB products. However, little effort has been paid to describe its comprehensive model which can demonstrate all the planning problems collectively considering in the surface mount technology (SMT) lines. A mixed integer model for PCB assembly line which includes the integration of different levels of the planning problems and considered component allocation problem (line balancing), PCB model sequencing problem (mixed model sequencing problem), feeder arrangement problem and component placement sequencing problem on different SMT machines collectively. Current research is significant to solve different planning problems of the PCB assembly line simultaneously to get the overall global solution of the problem in future.


2012 ◽  
Vol 224 ◽  
pp. 47-50
Author(s):  
Xuan Du ◽  
Gang Yu

The component placement sequence and feeder arrangement are two critical factors determining the assembly time of chip-shooter machine (CS). In addition, the different size of component and different arrangement strategy affect the feeder arrangement and component placement sequence. Based on the engineering analysis, an integrated optimization model of printed circuit board (PCB) assembly for CS machine is established. According to the parallel placement character of CS machine, "Max-Min Ant Colony Algorithm with Communication function (MMAC)" is designed based on traditional Ant Colony Algorithm. The idea that two ants with different duties collaborate to solve the optimization problem is presented. Guide ants optimize placement sequence while executant ants optimize feeder arrangement according to the components placement sequence. The component placement sequence and feeder arrangement are optimized simultaneously


2011 ◽  
Vol 58-60 ◽  
pp. 1938-1943
Author(s):  
Xuan Du ◽  
Zi Fan Fang ◽  
Yi Zhang

Aimed at the optimization problem of printed circuit board (PCB) assembly workshop (WPCBA) with multiple assembly machines and tasks, combined with polychromatic sets and genetic algorithm (GA), an optimization method is presented to optimize PCB assignment, component allocation and PCB assembly sequence problem simultaneously. On the basis of the polychromatic sets theory, numerical contour matrix is presented to describe the constraint of machine and operation sequence for WPCBA optimization problem and formulate the constraint model. Constraint model guarantees that GA searches optimal result in the effective solution space and simplify the calculation of fitness value. Moreover, if the machine and assembly task are changed, through a simple modification of constraint model, the WPCBA problem would be optimized conveniently. Computational results indicate that the solution efficiency of WPCBA optimization problem can be improved significantly and the dynamical optimization can be implemented.


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