A Simplified Branch-and-Price Mechanism for a Three-Machine Dynamic PCB Assembly

2014 ◽  
Vol 598 ◽  
pp. 398-403 ◽  
Author(s):  
M.T. Yazdani Sabouni ◽  
Rasaratnam Logendran
Keyword(s):  
Printed Circuit Board ◽  
Setup Time ◽  
Circuit Board ◽  
Price Mechanism ◽  
Branch And Price ◽  
Printed Circuit ◽  
Pcb Assembly ◽  
Complete Form ◽  
Optimal Approach ◽  
Machine Problem

A dynamic Printed Circuit Board (PCB) assembly system along with the most complete form of setup time in this assembly is introduced in this paper. An effective Branch-and-Price mechanism is employed to develop a lower bound for the three-machine problem. However, solving the sub problems remains computationally difficult because of their NP-hard nature. An optimal approach is established, which makes solving the sub problems computationally feasible.

Modeling of Errors Counting System for PCB Soldered in the Wave Soldering Technology

2014 ◽  
Vol 874 ◽  
pp. 139-143 ◽  
Author(s):  
Jacek Pietraszek ◽  
Aneta Gądek-Moszczak ◽  
Tomasz Toruński
Keyword(s):  
Quality Assurance ◽  
Experimental Design ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Counting System ◽  
Printed Circuit ◽  
Pcb Assembly ◽  
Wave Soldering ◽  
Soldering Technology ◽  
Through Hole

PartnerTech provides printed circuit board (PCB) assembly on request. Wired elements are assembled in through-hole technology and soldered on the wave soldering machine. The PCB with inserted elements is passed across the pumped wave of melted solder. Typically this process is accompanied by some class of defects like cracks, cavities, wrong solder thickness and poor conductor. In PartnerTech Ltd. another type of defects was observed: dispersion of small droplets of solder around holes. Quality assurance department plans to optimize the process in order to reduce the number of defects. In the first stage, it was necessary to develop a methodology for counting defects. This paper presents experimental design and analysis related to this project.

A Virtual Prototyping Framework for Electronics Manufacturing

Manufacturing ◽  
2002 ◽  
Author(s):  
J. Cecil ◽  
A. Kanchanapiboon
Keyword(s):  
Life Cycle ◽  
Printed Circuit Board ◽  
Virtual Prototyping ◽  
Circuit Board ◽  
Electronics Manufacturing ◽  
Functional Evaluation ◽  
Surface Mount Technology ◽  
Team Members ◽  
Printed Circuit ◽  
Pcb Assembly

This paper presents a framework for supporting virtual prototyping related activities in the domain of printed circuit board (PCB) assembly. The focus of discussion is restricted to Surface Mount Technology (SMT) based processes only. In general, Virtual Prototyping enables the conceptualization, evaluation and validation of proposed ideas, plans and solutions. Using a virtual prototyping framework, cross functional evaluation and analysis can be facilitated where designers, manufacturing engineers, testing and other life-cycle team members can communicate effectively as well as identify and eliminate problems, which may arise later in the downstream manufacturing and testing activities.

Unique Failure Modes from use of Sn-Pb and Lead-Free (mixed metallurgies) in PCB Assembly: Case Study

2005 ◽  
Author(s):  
Frank Toth ◽  
Gary F. Shade
Keyword(s):  
Printed Circuit Board ◽  
Failure Modes ◽  
Circuit Board ◽  
Lead Free ◽  
Printed Circuit ◽  
Pcb Assembly ◽  
New Process ◽  
Solder Pastes

Abstract Printed Circuit Board (PCB) assemblies are moving toward lead-free (LF) alloys and away from the traditional Sn-Pb alloy [1]. This change is creating new and unique failure modes as the process adapts to accommodate the higher temperatures of the new process [2]. In addition, mis-processed lots are more likely due to the complexity of assembling a mix of Sn-Pb and leadfree solders, components, PCBs, solder pastes, and fluxes. This case study helps to highlight the challenge and provides an example of what can happen, how to detect it, and how the defects can cause reliability failures.

Modeling of Order Oriented Planning for Printed Circuit Board Assembly Line

2015 ◽  
Vol 789-790 ◽  
pp. 1245-1251
Author(s):  
Ullah Saif ◽  
Zai Lin Guan ◽  
Zong Dong He ◽  
Cong He ◽  
Cao Jun
Keyword(s):  
Assembly Line ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Mixed Integer ◽  
Assembly Planning ◽  
Sequencing Problem ◽  
Printed Circuit ◽  
Pcb Assembly ◽  
Planning Problems ◽  
Model Sequencing

Printed circuit board (PCB) assembly planning problem has been given lot of attention to efficiently manage the orders of different PCB products. However, little effort has been paid to describe its comprehensive model which can demonstrate all the planning problems collectively considering in the surface mount technology (SMT) lines. A mixed integer model for PCB assembly line which includes the integration of different levels of the planning problems and considered component allocation problem (line balancing), PCB model sequencing problem (mixed model sequencing problem), feeder arrangement problem and component placement sequencing problem on different SMT machines collectively. Current research is significant to solve different planning problems of the PCB assembly line simultaneously to get the overall global solution of the problem in future.

Optimizing the Performance of Chip Shooter Machine Based on Ant Colony Algorithm

2012 ◽  
Vol 224 ◽  
pp. 47-50
Author(s):  
Xuan Du ◽  
Gang Yu
Keyword(s):  
Optimization Problem ◽  
Ant Colony Algorithm ◽  
Printed Circuit Board ◽  
Ant Colony ◽  
Circuit Board ◽  
Component Placement ◽  
Printed Circuit ◽  
Pcb Assembly ◽  
Communication Function ◽  
Feeder Arrangement

The component placement sequence and feeder arrangement are two critical factors determining the assembly time of chip-shooter machine (CS). In addition, the different size of component and different arrangement strategy affect the feeder arrangement and component placement sequence. Based on the engineering analysis, an integrated optimization model of printed circuit board (PCB) assembly for CS machine is established. According to the parallel placement character of CS machine, "Max-Min Ant Colony Algorithm with Communication function (MMAC)" is designed based on traditional Ant Colony Algorithm. The idea that two ants with different duties collaborate to solve the optimization problem is presented. Guide ants optimize placement sequence while executant ants optimize feeder arrangement according to the components placement sequence. The component placement sequence and feeder arrangement are optimized simultaneously

Printed Circuit Board Assembly Optimization Based on Genetic Algorithm with Model Constraints of Polychromatic Sets

2011 ◽  
Vol 58-60 ◽  
pp. 1938-1943
Author(s):  
Xuan Du ◽  
Zi Fan Fang ◽  
Yi Zhang
Keyword(s):  
Genetic Algorithm ◽  
Optimization Problem ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Simple Modification ◽  
Printed Circuit ◽  
Pcb Assembly ◽  
Fitness Value ◽  
Constraint Model ◽  
Polychromatic Sets Theory

Aimed at the optimization problem of printed circuit board (PCB) assembly workshop (WPCBA) with multiple assembly machines and tasks, combined with polychromatic sets and genetic algorithm (GA), an optimization method is presented to optimize PCB assignment, component allocation and PCB assembly sequence problem simultaneously. On the basis of the polychromatic sets theory, numerical contour matrix is presented to describe the constraint of machine and operation sequence for WPCBA optimization problem and formulate the constraint model. Constraint model guarantees that GA searches optimal result in the effective solution space and simplify the calculation of fitness value. Moreover, if the machine and assembly task are changed, through a simple modification of constraint model, the WPCBA problem would be optimized conveniently. Computational results indicate that the solution efficiency of WPCBA optimization problem can be improved significantly and the dynamical optimization can be implemented.

Optimization of Printed Circuit Board Assignment and Component Allocation in Assembly Line

2010 ◽  
Vol 97-101 ◽  
pp. 2455-2458
Author(s):  
Xuan Du ◽  
Zong Bin Li ◽  
Guo Hui Zhang
Keyword(s):  
Assembly Line ◽  
Printed Circuit Board ◽  
Solution Space ◽  
Circuit Board ◽  
Printed Circuit ◽  
Pcb Assembly ◽  
Fitness Value ◽  
Component Allocation ◽  
Constraint Model ◽  
Polychromatic Sets Theory

The assembly optimization problem of multiple printed circuit board (PCB) tasks is analyzed, and an optimal model is formulated to balance the workload in decoupled PCB assembly line. Combined with polychromatic sets and genetic algorithm (GA), an integrated methodology is developed to solve the PCB assignment and component allocation simultaneously. Based on polychromatic sets theory, a 3D numerical contour matrix is presented to describe the characters of PCB, component and machine and the constraint of machine and process, and a constraint model is formulated. Constraint model guarantees that GA searches in the available solution space and simplify the calculation of fitness value and GA operation. Computational results indicate that the approach presented in this paper is useful and effective.

An Yield Model for Electronics Assembly

2005 ◽  
Author(s):  
N. Gnanasambandam ◽  
M. Munikrishnan ◽  
V. Poyyapakkam ◽  
P. Borgesen ◽  
K. Srihari
Keyword(s):  
Flip Chip ◽  
Printed Circuit Board ◽  
Solder Bump ◽  
Circuit Board ◽  
Design Stage ◽  
Manufacturing Cost ◽  
Electronic Components ◽  
Yield Model ◽  
Printed Circuit ◽  
Pcb Assembly

Managing assembly yield in the Printed Circuit Board (PCB) assembly process is crucial in reducing the overall manufacturing cost of a product. Being faced with electronic components that have high interconnect (pin or solder bump) count, density, and complexity, it is extremely important to streamline the manufacturing losses arising from misplaced or poorly assembled components. In order to achieve this goal, yield models are utilized to anticipate and evaluate problems and their causes. This activity could be potentially implemented at the design stage or at least much before the product reaches the manufacturing floor. This research examines some important factors that affect area array (BGA, CSP, flip chip) assembly yields, taking a two-pronged approach to modeling. Achievable yield is classified into placement and assembly components and is estimated using a simulation model.

Improvement of Printed Circuit Board Assembly Process in 2.4GHz RF Circuit Products

2008 ◽  
Author(s):  
Mu-Chun Wang ◽  
Zhen-Ying Hsieh ◽  
Ting-Yu Yang ◽  
Chia-Hao Tu ◽  
Shuang-Yuan Chen
Keyword(s):  
Printed Circuit Board ◽  
Good Method ◽  
Circuit Board ◽  
Thermal Dissipation ◽  
Electronic Components ◽  
Printed Circuit Board Assembly ◽  
Process Technology ◽  
Printed Circuit ◽  
Pcb Assembly ◽  
Functional Product

The semiconductor process technology and the circuit design concept are continuously improved at the recent era. The product cost is gradually decreased, too. The commercial electronic products generally cover ICs, external components and printed circuit board (PCB). After the circuit layout blueprints are completed, engineers will transfer them into PCB as a prototype. The next step is to integrate some contributed electronic components to form a functional product. This second step is called as PCB assembly (PCBA). However, the bigger copper area on PCB will provide a good thermal dissipation. This effect will degrade the solderability and increase the contact resistance while the electronic components are integrated on PCB. The product performance, therefore, is deteriorated. Contriving some special empty boundary shapes neighboring the connected pins of integrated electronic components to soften the thermal dissipation ability of copper layer on printed circuit substrate is a good method. We design some useful patterns to conquer this issue and increase the PCB assembly yield from 70% to 95%. The other efforts are to study the flow rate of isolated ink in PCBA production line and suitably control the solder temperature. Because some electronic components are composed by plastic materials, higher temperature will damage the external shapes of them and the PCB has the bending possibility. These two beneficial efforts also contribute the assembly yield well in 2.4GHz radio-frequency (RF) products.

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