Accelerated Reliability Methodologies for Electronic Components: A Case Study

Author(s):  
Nick Strifas ◽  
John Fraysse ◽  
Massimo Ruzzene

The procedures of estimating the time to failure from accelerated test data are reviewed in this study. An accelerated life test approach which provides the desired reliability results for a fiber optic sensor in shorter times than would be possible with a test performed under normal stress conditions is presented. Utilizing ReliaSoft ALTA software the statistical and life distribution that describe the time to failure of the sensor is determined and the desired reliability results are calculated using the level probability density function.

2015 ◽  
Vol 21 (1) ◽  
pp. 112-132 ◽  
Author(s):  
Preeti Wanti Srivastava ◽  
Deepmala Sharma

Purpose – Acceptance sampling plans are designed to decide about acceptance or rejection of a lot of products on the basis of sample drawn from it. Accelerating the life test helps in obtaining information about the lifetimes of high reliability products quickly. The purpose of this paper is to formulate an optimum time censored acceptance sampling plan based on ramp-stress accelerated life test (ALT) for items having log-logistic life distribution. The log-logistic life distribution has been found appropriate for highly reliable components such as power system components and insulating materials. Design/methodology/approach – The inverse power relationship has been used to model stress-life relationship. It is meant for analyzing data for which the accelerated stress is nonthermal in nature, and frequently used as an accelerating stress for products such as capacitors, transformers, and insulators. The method of maximum likelihood is used for estimating design parameters. The optimal test plan is obtained by minimizing variance of test-statistic that decides on acceptability or rejectibility of lot. The optimal test plan finds optimal sample size, stress rates, sample proportion allocated to each stress and lot acceptability constant such that producer’s risk and consumer’s risk is satisfied. Findings – Asymptotic variance plays a pivotal role in determining the sample size required for a sampling plan for deciding the acceptance/rejection of a lot. The sample size is minimized by optimally designing a ramp-stress ALT so that the asymptotic variance is minimized. Originality/value – The model suggested is of use to quality control and reliability engineers dealing with highly reliable items.


2019 ◽  
Vol 9 (16) ◽  
pp. 3208
Author(s):  
M.A. Zamora-Antuñano ◽  
O. Mendoza-Herbert ◽  
M. Culebro-Pérez ◽  
A. Rodríguez-Morales ◽  
Juvenal Rodríguez-Reséndiz ◽  
...  

In this research, we investigated the development and design of the Accelerated Life Test (ALT) and its approach to the waste of material. The development of a reliability model is based on the moment at which failure appears. The faults detected in welding joints during this research prevented proper current flow within electronic components and this interruption of current is considered a critical system failure. Minitab v18 was used to process data. Through statistical analysis, it was determined that the sample size was adequate with a 95% level of significance. A Shapiro Wilk analysis was carried out to determine the normality of the data, where a p-value of 0.1349 was obtained, which indicates that the data are normal. A Weibull analysis was applied, and it was observed that the data adjusted to the regression analysis and Weibull’s reliability distribution. The results showed that failure phenomena can occur during electronic assembly due to the values of R being too high and too close to each other. Significant issues included the welding alloy, temperature, and the interaction between the welding alloy and vibration. It is observed that with high temperature, the number of faults in the solder alloy used for tin and lead and for tin, silver, and copper were lower. 17 electronic assemblies with measures of 2 cm × 2 cm were fabricated, where components such as leads and electric resistance were used. The objective of analyzing this is to obtain the characteristics of the soldering alloy. Electronic components of this type are used worldwide in all types of electronic components, including: TVs, cell phones, tablet, computers, resistors, diodes, LEDs, and capacitors. For this work, the components were built based on an LED and a diode.


2013 ◽  
Vol 347-350 ◽  
pp. 129-132
Author(s):  
Zhong Zhen Chen ◽  
Lu Tie Xu

Accelerated life test was an important means to obtain storage reliability index of missile-borne photoelectric system. Because of difficulty to continuously test, the number of failure samples in the test range could be only got. Whether distribution intervals, logarithmic distribution or new failure time estimation method proposed in this paper such as range median distribution and the uniform distribution of the index had their applicable limitations. On the basis of comparison to Monte Carlo numerical simulation method, the characteristics of the applicability of the estimation method based on Weibull distribution were explored.


2010 ◽  
Author(s):  
Ian M. Soukup ◽  
Joseph H. Beno ◽  
Richard J. Hayes ◽  
James T. Heisler ◽  
Jason R. Mock ◽  
...  

2011 ◽  
Vol 211-212 ◽  
pp. 1002-1006 ◽  
Author(s):  
R. Jiang

This paper presents an approach to analyze accelerated life testing (ALT) data involving two failure modes. The approach first transforms the ALT dataset into two new datasets that correspond to individual failure modes. Each transformed dataset is modeled using a two-step procedure, and the resulted models associated with individual failure modes are combined into a competing risk model. The approach is illustrated using the ALT data of industrial heaters from the literature. The analysis shows that the shape parameter of the life distribution can change with stress level.


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