Thermal Characterization of Two Opposing Carbon Nanotube Arrays Using Diffraction-Limited Infrared Microscopy

2005 ◽  
Author(s):  
Xuejiao Hu ◽  
Matt Panzer ◽  
Kenneth E. Goodson
Keyword(s):  
Thermal Resistance ◽  
Contact Region ◽  
Thermal Characterization ◽  
Interface Structure ◽  
Infrared Microscopy ◽  
Carbon Nanotube Arrays ◽  
Cnt Arrays ◽  
Significant Temperature ◽  
Resistance Value

Due to their extremely high thermal conductivity, carbon nanotubes (CNTs) have received many research interests for thermal management applications. An advanced thermal interface structure made by two opposing, partially over-lapped CNT arrays is designed for thermally connecting two contact surfaces. The performance of this interface structure is thermally characterized using diffraction-limited infrared microscopy. Significant temperature discontinuities are found at the end of the CNT-CNT contact region, which indicates a large thermal resistance between CNTs. Due to this inter-tube resistance, the thermal performance of the CNT-based interface structure is far below expectation, with a thermal resistance value of about 3.8 × 10−4 K·m2/W. Possible mechanisms of heat transfer between CNTs, which result in the large inter-tube resistance, are discussed.

Infrared Microscopy Thermal Characterization of Opposing Carbon Nanotube Arrays

2006 ◽  
Vol 129 (1) ◽  
pp. 91-93 ◽  
Author(s):  
X. Jack Hu ◽  
Matthew A. Panzer ◽  
Kenneth E. Goodson
Keyword(s):  
Thermal Resistance ◽  
Contact Region ◽  
Thermal Characterization ◽  
Interface Structure ◽  
Infrared Microscopy ◽  
Carbon Nanotube Arrays ◽  
Cnt Arrays ◽  
Significant Temperature ◽  
Resistance Value

Carbon nanotubes (CNTs) have received much recent research interest for thermal management applications due to their extremely high thermal conductivity. An advanced thermal interface structure made of two opposing, partially overlapped CNT arrays is designed for thermally connecting two contact surfaces. The performance of this interface structure is thermally characterized using diffraction-limited infrared microscopy. Significant temperature discontinuities are found at the CNT-CNT contact region, which indicates a large thermal resistance between CNTs. Due to this intertube resistance, the thermal performance of the CNT-based interface structure is far below expectation (with a thermal resistance value about 3.8×10−4Km2∕W).

Characterization and Benchmarking of the Low Intertier Thermal Resistance of Three-Dimensional Hybrid Cu/Dielectric Wafer-to-Wafer Bonding

2017 ◽  
Vol 139 (1) ◽  
Author(s):  
Herman Oprins ◽  
Vladimir Cherman ◽  
Tomas Webers ◽  
Abdellah Salahouelhadj ◽  
Soon-Wook Kim ◽  
...  
Keyword(s):  
Thermal Resistance ◽  
Wafer Bonding ◽  
Three Dimensional ◽  
Measurement Data ◽  
Thermal Characterization ◽  
Test Chip ◽  
Thermal Test ◽  
Wafer Pair ◽  
Transient Measurement

In this paper, we present the design of a passive test chip with thermal test structures in the Metal 1 layer of the back-end of line (BEOL) for the experimental thermal characterization of the intertier thermal resistance of wafer-pairs fabricated by three-dimensional (3D) hybrid Cu/dielectric wafer-to-wafer (W2W) bonding. The thermal test structures include heater elements and temperature sensors. The steady-state or transient measurement data are combined with a modeling study to extract the thermal resistance of the bonded interface for the fabricated bonded wafer pair. The extracted thermal resistance of the die–die interface created by hybrid wafer-to-wafer bonding is compared to literature data for die-to-die (D2D) or die-to-wafer (D2W) stacking with microbumps. The low thermal resistance of the thin bonded dielectric interface indicates that hybrid Cu/dielectric bonding is a promising technology to create 3D chip stacks with a low thermal die-to-die resistance.

Research on Thermal Resistance of Power MOSFET Based on the Structure Function

2013 ◽  
Vol 380-384 ◽  
pp. 3388-3391
Author(s):  
Xiao Chao ◽  
Li Xin Wang
Keyword(s):  
Thermal Resistance ◽  
Structure Function ◽  
Frequency Domain ◽  
Wiener Filter ◽  
Thermal Characterization ◽  
Filter Method ◽  
Frequency Domain Method ◽  
Power Mosfet ◽  
Popular Method

The research of thermal resistance, an important parameter for the thermal characterization of Power MOSFET device, is gaining increasing importance. Structure function, a novel and popular method, can be used to analyse the thermal characterization of Power MOSFET. In this paper, Wiener filter, a frequency-domain method of performing deconvolution that produces the structure function, is proposed. This method is applied to a Power MOSFET device in a TO-39 package. The thermal resistance of this Power MOSFET device was analysed from the structure function based on Wiener filter method.

Dynamic Operation of a MEMS Thermal Switch

2006 ◽  
Author(s):  
J. H. Cho ◽  
C. D. Richards ◽  
D. F. Bahr ◽  
R. F. Richards ◽  
J. Jiao
Keyword(s):  
Liquid Metal ◽  
Thermal Resistance ◽  
The Other ◽  
Nanotube Arrays ◽  
Heating Rates ◽  
Conductive Material ◽  
Thermal Switch ◽  
Carbon Nanotube Arrays ◽  
Fabrication And Characterization

In this paper we present the design, fabrication, and characterization of a MEMS thermal switch. Three switch designs are considered: one in which the conductive material is in the form of liquid-metal micro droplets, one in which the conductive material consists of aligned carbon nanotube arrays, and one in which solid silicon contacts are used. The ratio of thermal resistance in the on and off conditions is used to characterize performance. Based on these measurements the switch incorporating liquid-metal droplets is superior to the other two switches. The liquid-metal switch has a thermal resistance off to on ratio of 168 and can provide heating rates of 905 °C/s.

Random pseudo promptings applied to the thermal characterization of a wet porous material

1999 ◽  
Vol 6 (1) ◽  
pp. 101-108 ◽  
Author(s):  
E. Delacre ◽  
D. Defer ◽  
E. Antczak ◽  
B. Duthoit
Keyword(s):  
Porous Material ◽  
Thermal Characterization

Photoacoustic thermal characterization of the dehydration process of Agar-SiO2emulsions

2005 ◽  
Vol 125 ◽  
pp. 177-180
Author(s):  
T. Lopez ◽  
M. Picquart ◽  
G. Aguirre ◽  
Y. Freile ◽  
D. H. Aguilar ◽  
...  
Keyword(s):  
Thermal Characterization ◽  
Dehydration Process
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