A Study on Repetitive Drop Test Method and for Electronic Component

2007 ◽  
Author(s):  
Qiang Yu ◽  
Masato Fujita ◽  
Tsuyoki Shibata ◽  
Takayoshi Katahira ◽  
Masaki Shiratori
Keyword(s):  
High Stress ◽  
Fem Simulation ◽  
Strain Analysis ◽  
Test Method ◽  
Drop Test ◽  
Electronic Components ◽  
Flat Bottom ◽  
Supporting Condition ◽  
Board Level ◽  
Load Conditions

In recent years, mobile phones have been miniaturized, so electronic components with high I/O count have been changed from QFP/SOIC to BGA/LGA. However BGA/LGA tends to have weak reliability for drop impact, and the drop reliability needs to be improved. For that, board level drop reliability has an important role in order to evaluate drop reliability for electronic components excluding influence from phone mechanics. This study focuses on the characterization of the test methods using experimental test, strain analysis and FEM simulation. In this paper, board level drop test shows drop a fixture with a component assembled on PWB. The drop test using a fixture with a flat bottom lacked of repeatability of failed drop count, and it was improved by adding hemisphere at the center on fixture bottom to reduce the influence by variation of falling posture angle, and strain analysis and the drop experimental proved it, too. The deformations of the fixture influence the test results, because the deformation of fixture caused high stress on solder joints. For that, the method to exclude the influence of fixture deformation was studied, and it was found that the influence can be decreased by supporting condition of PWB with a free-sliding end or the new design of the fixture. On the other hand, the effect of height of drop, mass of fixture, and supporting condition on the drop test, can be thought as the acceleration factors for the dropping load conditions. The drop tests were done in many load conditions. The results were analyzed by strain analysis and FEM simulation. As a result, an accelerating ratio can be evaluated by predicting the effect of these factors, and effective dropping test can be conduct without increasing the dropping height exceedingly.

Reliability Characterization of Organic Solderability Preservatives (OSP) of IC Packages by Drop and Cyclic Bend Test

2005 ◽  
Vol 297-300 ◽  
pp. 893-898
Author(s):  
Seung Mo Kim ◽  
Eun Sook Shon ◽  
Yoon Hyun Ka ◽  
Yong Joon Kim ◽  
Jin Young Kim ◽  
...  
Keyword(s):  
Standard Test ◽  
Test Method ◽  
Drop Test ◽  
Bend Test ◽  
The Other ◽  
Rate Performance ◽  
Electronic Components ◽  
Cyclic Frequency ◽  
The One

Cyclic bend test and drop test were carried out as a second level reliability test method in order to characterize the joint performance between electronic components and board. Two types of package substrates were used for the test. The one was NiAu plated, and the other one was organic solderability preservatives (OSP) finished. Drop test was done in accordance with JEDEC standard test method [1]. Drop impact and duration time was 1,500G and 0.5ms, respectively. Cyclic bend test was performed with Amkor internal specification because there is no international standard for the test. The Amkor internal specification was edited based on the IPC/JEDEC specification [2]. Board deflection and cyclic frequency was 3mm and 1Hz, respectively. NiAu substrate showed better mean life performance about by 30% in cyclic bend test. OSP substrate showed the same or better failure rate performance in drop test. Typical solder joint failures and intermetalic crack were found by failure analysis.

Application of Orthogonal Test in Numerical Simulation of Glass Lens Molding

2012 ◽  
Vol 497 ◽  
pp. 245-249
Author(s):  
Dao Cheng Zhang ◽  
Ke Jun Zhu ◽  
Yong Jian Zhu ◽  
Shao Hui Yin ◽  
Jian Wu Yu
Keyword(s):  
Process Parameters ◽  
Orthogonal Experiment ◽  
Fem Simulation ◽  
Orthogonal Test ◽  
Test Method ◽  
Testing Time ◽  
Molding Process ◽  
Glass Lens ◽  
Lens Molding ◽  
Process Factors

Glass lens molding is a high-volume fabrication method for producing optical components. In this paper, combined with the orthogonal test method and finite element method (FEM) simulation, the coupled thermo-mechanical analysis was carried out to analyze the key process factors. In order to reduce the testing time, an orthogonal test with three sets of level factors and three parameters is conducted to obtain the optimal molding process parameters. The result shows that the most significant parameter is molding velocity, the other effect parameters are molding temperature and friction coefficient. According to the previous analysis of orthogonal experiment, it is shown that the best optimal finishing process parameters were A2B1C1.

Numerical Model to Simulate the Drop Test of Printed Circuit Board (PCB)

2011 ◽  
Vol 423 ◽  
pp. 26-30
Author(s):  
S. Assif ◽  
M. Agouzoul ◽  
A. El Hami ◽  
O. Bendaou ◽  
Y. Gbati
Keyword(s):  
Solder Joint ◽  
Printed Circuit Board ◽  
Drop Test ◽  
Dynamic Responses ◽  
Circuit Board ◽  
Joint Stress ◽  
Printed Circuit ◽  
Increasing Demand ◽  
Improved Model ◽  
Board Level

Increasing demand for smaller consumer electronic devices with multi-function capabilities has driven the packaging architectures trends for the finer-pitch interconnects, thus increasing chances of their failures. A simulation of the Board Level Drop-Test according to JEDEC (Joint Electron Device Council) is performed to evaluate the solder joint reliability under drop impact test. After good insights to the physics of the problem, the results of the numerical analysis on a simple Euler-Bernoulli beam were validated against analytical analysis. Since the simulation has to be performed on ANSYS Mechanical which is an implicit software, two methods were proposed, the acceleration-input and the displacement-input. The results are the same for both methods. Therefore, the simulation is carried on the real standard model construction of the board package level2. Then a new improved model is proposed to satisfy shape regular element and accuracy. All the models are validated to show excellent first level correlation on the dynamic responses of Printed Circuit Board, and second level correlation on solder joint stress. Then a static model useful for quick design analysis and optimization’s works is proposed and validated. Finally, plasticity behavior is introduced on the solder ball and a non-linear analysis is performed.

The Study on Fatigue Life of Interconnect with Respect to Geometrical Shape of Supporting Structure and Load Conditions in MEMS

2005 ◽  
Vol 297-300 ◽  
pp. 539-544
Author(s):  
Jae Joon Shim ◽  
Geun Jo Han ◽  
Kwang Young Kim ◽  
Doo Pyo Yun ◽  
Chul Ho Ok ◽  
...  
Keyword(s):  
Fatigue Life ◽  
Critical Temperature ◽  
Thermal Load ◽  
Fem Simulation ◽  
Geometrical Shape ◽  
Operating Life ◽  
Batch Production ◽  
Supporting Structure ◽  
External Conditions ◽  
Load Conditions

Recently, application of semiconductor sensors has widely spreaded into various industries becasuse those have several merits like easy miniaturization and batch production etc. But external conditions such as thermal and repetitive load have a bad effect on sensors’s lifetime. Therefore, lots of studies related with the fatigue of microelectromechnical systems (MEMS) have been conducted. Especially, this paper was focused on fatigue life of aluminum interconnect in the supporting structure of sensor under cyclic thermal load and on the approximation equation defining the critical temperature to ensure required operating life using FEM simulation.

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