Effect of Bonding Structure and Heater Design on Performance Enhancement of FEEDS Embedded Manifold-Microchannel Cooling

2017 ◽  
Author(s):  
Daniel Bae ◽  
Raphael Mandel ◽  
Michael Ohadi
Keyword(s):  
Heat Flux ◽  
Fluid Pressure ◽  
High Heat ◽  
Working Fluid ◽  
Uniform Heat Flux ◽  
High Heat Flux ◽  
Bonding Structure ◽  
Uniform Heat ◽  
Manifold Microchannel

This work presents the design and characterization of a two-phase, embedded manifold-microchannel (MMC) system for cooling of high heat flux electronics. The study uses a thin-Film Evaporation and Enhanced fluid Delivery System (FEEDS) MMC cooler for high heat flux cooling of electronics. The work builds upon our group’s earlier work in this area with a particular focus on the use of an improved bonding structure and implementation of uniform heat flux heaters that collectively contribute to enhanced performance of the system. In many MMC systems targeted for high heat flux applications microchannels and manifolds are fabricated separately due to different dimensions and tolerances required for each. However, assembly of the system often leaves a gap between the channels and the manifold, thus causing the working fluid to leak through the top of the microfins leading to decreased cooler performance. The effect of this gap is parametrized and analyzed with ANSYS Fluent CFD simulations and discussed in this paper. The findings show that even a few microns wide gap can cause a noticeable degradation of the MMC system performance. Imperfect assembly and the deformation of a microchannel chip due to working fluid pressure can cause gaps, indicating the necessity of uniform and hermetic bonding between the manifold and the tips of the microfins. Furthermore, this work presents the need for better heater designs to enable uniform and high heat flux to the heat transfer surface. Serpentine heaters are often used to mimic electronics in a laboratory environment, but there is a lack of study on the performance characterization of the heaters themselves. In the current work, the performance of a conventional serpentine heater is characterized using ANSYS thermo-electric modeling software. The results show that conventional serpentine heaters are insufficient at providing uniform heat flux in applications where there is a lack of heat spreading-such as in the current embedded cooler — showing deviations ranging over 200 % of the nominal value. The deviations are caused by the many bends present in a serpentine pattern where current density concentrations vary significantly. Two alternate designs are proposed, and numerical simulations show that these new heater designs are capable of providing uniform heat flux, not deviating more than 20% from the nominal heat flux value. The conventional and newly proposed heaters are fabricated, tested, and analyzed with a working FEEDS system.

A Numerical Model of a Reciprocating-Mechanism Driven Heat Loop for Two-Phase High Heat Flux Cooling

2016 ◽  
Vol 8 (4) ◽  
Author(s):  
Olubunmi Popoola ◽  
Ayobami Bamgbade ◽  
Yiding Cao
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Numerical Model ◽  
Performance Optimization ◽  
Numerical Study ◽  
High Heat ◽  
Working Fluid ◽  
High Heat Flux ◽  
Two Phase ◽  
Transfer Device

An effective design option for a cooling system is to use a two-phase pumped cooling loop to simultaneously satisfy the temperature uniformity and high heat flux requirements. A reciprocating-mechanism driven heat loop (RMDHL) is a novel heat transfer device that could attain a high heat transfer rate through a reciprocating flow of the two-phase working fluid inside the heat transfer device. Although the device has been tested and validated experimentally, analytical or numerical study has not been undertaken to understand its working mechanism and provide guidance for the device design. The objective of this paper is to develop a numerical model for the RMDHL to predict its operational performance under different working conditions. The developed numerical model has been successfully validated by the existing experimental data and will provide a powerful tool for the design and performance optimization of future RMDHLs. The study also reveals that the maximum velocity in the flow occurs near the wall rather than at the center of the pipe, as in the case of unidirectional steady flow. This higher velocity near the wall may help to explain the enhanced heat transfer of an RMDHL.

Flow Boiling Enhancement in Microchannels With Diffusion Bonded Wire Mesh

2007 ◽  
Author(s):  
Hailei Wang ◽  
Richard Peterson
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Flow Boiling ◽  
Nucleate Boiling ◽  
High Heat ◽  
Wire Mesh ◽  
Working Fluid ◽  
High Heat Flux ◽  
Vapor Quality ◽  
Heating Wall

Flow boiling and heat transfer enhancement in four parallel microchannels using a dielectric working fluid, HFE 7000, was investigated. Each channel was 1000 μm wide and 510 μm high. A unique channel surface enhancement technique via diffusion bonding a layer of conductive fine wire mesh onto the heating wall was developed. According to the obtained flow boiling curves for both the bare and mesh channels, the amount of wall superheat was significantly reduced for the mesh channel at all stream-wise locations. This indicated that the nucleate boiling in the mesh channel was enhanced due to the increase of nucleation sites the mesh introduced. Both the nucleate boiling dominated and convective evaporation dominated regimes were identified. In addition, the overall trend for the flow boiling heat transfer coefficient, with respect to vapor quality, was increasing until the vapor quality reached approximately 0.4. The critical heat flux (CHF) for the mesh channel was also significantly higher than that of the bare channel in the low vapor quality region. Due to the fact of how the mesh was incorporated into the channels, no pressure drop penalty was identified for the mesh channels. Potential applications for this kind of mesh channel include high heat-flux electronic cooling systems and various energy conversion systems.

Nucleate Boiling of Dielectric Liquids on Hydrophobic Patterned Surfaces

2014 ◽  
Author(s):  
Nihal E. Joshua ◽  
Denesh K. Ajakumar ◽  
Huseyin Bostanci
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Nucleate Boiling ◽  
High Heat ◽  
Copper Surface ◽  
Dielectric Liquid ◽  
Working Fluid ◽  
Patterned Surfaces ◽  
High Heat Flux ◽  
Dielectric Liquids

This study experimentally investigated the effect of hydrophobic patterned surfaces in nucleate boiling heat transfer. A dielectric liquid, HFE-7100, was used as the working fluid in the saturated boiling tests. Dielectric liquids are known to have highly-wetting characteristics. They tend to fill surface cavities that would normally trap vapor/gas, and serve as active nucleation sites during boiling. With the lack of these vapor filled cavities, boiling of a dielectric liquid leads to high incipience superheats and accompanying temperature overshoots. Heater samples in this study were prepared by applying a thin Teflon (AF400, Dupont) coating on 1-cm2 smooth copper surfaces following common photolithography techniques. Matching size thick film resistors, attached onto the copper samples, generated heat and simulated high heat flux electronic devices. Tests investigated the heater samples featuring circular pattern sizes between 40–100 μm, and corresponding pitch sizes between 80–200 μm. Additionally, a plain, smooth copper surface was tested to obtain reference data. Based on data, hydrophobic patterned surfaces effectively eliminated the temperature overshoot at boiling incipience, and considerably improved nucleate boiling performance in terms of heat transfer coefficient and critical heat flux over the reference surface. Hydrophobic patterned surfaces therefore demonstrated a practical surface modification method for heat transfer enhancement in immersion cooling applications.

scholarly journals Thermal Assessment of Nano-Particulate Graphene-Water/Ethylene Glycol (WEG 60:40) Nano-Suspension in a Compact Heat Exchanger

Energies ◽  
2019 ◽  
Vol 12 (10) ◽  
pp. 1929 ◽  
Author(s):  
M. Sarafraz ◽  
Mohammad Safaei ◽  
Zhe Tian ◽  
Marjan Goodarzi ◽  
Enio Bandarra Filho ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Ethylene Glycol ◽  
Thermal Performance ◽  
Evaluation Criteria ◽  
High Heat ◽  
Operating Conditions ◽  
Working Fluid ◽  
High Heat Flux ◽  
Micro Channel

In the present study, we report the results of the experiments conducted on the convective heat transfer of graphene nano-platelets dispersed in water-ethylene glycol. The graphene nano-suspension was employed as a coolant inside a micro-channel and heat-transfer coefficient (HTC) and pressure drop (PD) values of the system were reported at different operating conditions. The results demonstrated that the use of graphene nano-platelets can potentially augment the thermal conductivity of the working fluid by 32.1% (at wt. % = 0.3 at 60 °C). Likewise, GNP nano-suspension promoted the Brownian motion and thermophoresis effect, such that for the tests conducted within the mass fractions of 0.1%–0.3%, the HTC of the system was improved. However, a trade-off was identified between the PD value and the HTC. By assessing the thermal performance evaluation criteria (TPEC) of the system, it was identified that the thermal performance of the system increased by 21% despite a 12.1% augmentation in the PD value. Furthermore, with an increment in the fluid flow and heat-flux applied to the micro-channel, the HTC was augmented, showing the potential of the nano-suspension to be utilized in high heat-flux thermal applications.

Thermal Conductivity and Operating Temperature Effect on the Interline Region in a Micro/Miniature Heat Pipe

2008 ◽  
Author(s):  
Hani H. Sait ◽  
Steve M. Demsky ◽  
HongBin Ma
Keyword(s):  
Thin Film ◽  
Thermal Conductivity ◽  
Heat Flux ◽  
Operating Temperature ◽  
High Heat ◽  
Working Fluid ◽  
High Heat Flux ◽  
Thin Film Evaporation ◽  
Film Evaporation ◽  
Frictional Shear Stress

An analytical model describing thin film evaporation is developed that includes the effects of surface tension, frictional shear stress, wetting characteristics and disjoining pressure. The effects of thermal conductivity of working fluids and operating temperature on the evaporating thin film region are also studied. The results indicate that when the thermal conductivity of the working fluid increases, a high heat flux can be removed from the evaporating thin film region. The operating temperature affects the thin film evaporation. The higher the operating temperature, the more heat flux can be removed from the region. The information of thin film evaporation presented in the paper results in a better understanding of heat transfer mechanism occurring in micro heat pipes.

Qualification and post-mortem characterization of tungsten mock-ups exposed to cyclic high heat flux loading

2013 ◽  
Vol 88 (9-10) ◽  
pp. 1858-1861 ◽  
Author(s):  
G. Pintsuk ◽  
I. Bobin-Vastra ◽  
S. Constans ◽  
P. Gavila ◽  
M. Rödig ◽  
...  
Keyword(s):  
Heat Flux ◽  
High Heat ◽  
High Heat Flux ◽  
Post Mortem

Working Fluid Inventory Effect on Heat Transfer Performance of a Grooved Micro Heat Pipe

2013 ◽  
Vol 589-590 ◽  
pp. 559-564
Author(s):  
Xi Bing Li ◽  
Yun Shi Ma ◽  
Xun Wang ◽  
Ming Li
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Heat Pipe ◽  
Heat Transfer Performance ◽  
Mathematic Model ◽  
High Heat ◽  
Working Fluid ◽  
High Heat Flux ◽  
Transfer Performance ◽  
Flux Concentration

As a highly efficient heat transfer component, a micro heat pipe (MHP) has been widely applied to the situations with high heat flux concentration. However, a MHPs heat transfer performance is affected by many factors, among which, working fluid inventory has great influence on the security, reliability and frost resistance of its heat transfer performance. In order to determine the appropriate working fluid inventory for grooved MHPs, this paper first analyzed the working principle, major heat transfer limits and heat flux distribution law of grooved MHPs in electronic chips with high heat flux concentration, then established a mathematic model for the working fluid inventory in grooved MHPs. Finally, with distilled water being the working fluid, a series of experimental investigations were conducted at different temperatures to test the heat transfer performances of grooved MHPs, which were perfused with different inventories and with different adiabatic section lengths. The experimental results show that when the value of α is roughly within 0.40±0.05, a grooved MHP can acquire its best heat transfer performance, and the working fluid inventory can be determined by the proposed mathematic model. Therefore this study solves the complicated problem of determining appropriate working fluid inventory for grooved MHPs.

Characterization of CT Plasmas on a Magnetized Coaxial Plasma Gun Device and its Application to Pulse High Heat Flux Simulation Tests

2016 ◽  
Vol 136 (3) ◽  
pp. 147-154 ◽  
Author(s):  
Ikko Sakuma ◽  
Yusuke Kikuchi ◽  
Wataru Isono ◽  
Takumi Nakazono ◽  
Masato Nakane ◽  
...  
Keyword(s):  
Heat Flux ◽  
High Heat ◽  
High Heat Flux ◽  
Plasma Gun

Use of Liquid Film Evaporation in Biporous Media to Achieve High Heat Flux Over Large Areas

2005 ◽  
Author(s):  
Tadej Semenic ◽  
Ying-Yu Lin ◽  
Ivan Catton
Keyword(s):  
Heat Flux ◽  
Test Chamber ◽  
Heat Removal ◽  
High Heat ◽  
Working Fluid ◽  
Interface Temperature ◽  
High Heat Flux ◽  
Film Evaporation ◽  
Powder Diameter ◽  
Better Than

Boiling characteristics of three biporous and one monoporous sintered wick are tested. The monoporous wick has the same wick thickness as a comparable biporous wick. Diameters of the clusters of the comparable biporous wick are equal to the powder diameter of the monoporous wick. A second biporous wick has the same configuration as the first, but is sintered in a thicker layer. The third biporous wick that is tested has smaller cluster sizes then the first two. All three biporous wicks have clusters sintered from powder with the same size distribution. The results demonstrate the advantages of a biporous capillary structure. All biporous wicks reached higher critical heat flux (CHF) then the monoporous wick. Experiments show that larger clusters are better than smaller. Comparing two different wick thicknesses, we can see that even though there is a dryout region inside the thick wick, it is still able to continuously remove heat at constant superheat. No sudden changes in superheat are seen. This process of heat removal is not possible with the thin wick. The working fluid in all runs is methanol. 4-mm thick wick with powder diameter ranging from 53 to 63 microns and cluster diameter ranging from 500 to 707microns is able to remove 377W/cm2 at temperature difference 110°C. A partial pressure inside the test chamber at this heat flux is 0.68atm and the interface temperature 167°C.

Heat Transfer Characterization of a High Heat Flux Oxy-Fuel Direct Power Extraction Combustor

2017 ◽  
Author(s):  
Luisa A. Cabrera ◽  
Jad Aboud ◽  
Manuel J. Hernandez ◽  
Brian Lovich ◽  
Ahsan R. Choudhuri ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
High Heat ◽  
High Heat Flux ◽  
Direct Power ◽  
Power Extraction
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