Geometry Effects on Two-Phase Flow Regimes in a Diabatic Manifolded Microgap Channel

2017 ◽  
Author(s):  
David C. Deisenroth ◽  
Avram Bar-Cohen ◽  
Michael Ohadi
Keyword(s):  
Heat Flux ◽  
Mass Flux ◽  
Electronics Cooling ◽  
Flow Regimes ◽  
High Heat ◽  
Heat Fluxes ◽  
High Heat Flux ◽  
Two Phase ◽  
Channel Geometry ◽  
Cooling Channels

Two-phase cooling has become an increasingly attractive option for thermal management of high-heat flux electronics. Cooling channels embedded directly on the back of the heat source (chip) facilitate two-phase boiling/evaporation effectiveness, eliminating many thermal resistances generated by more traditional, remote chip-cooling approaches. Accordingly, manifold-microchannel flow paths in embedded cooling systems can allow very high heat fluxes with low junction temperatures. But, the effect of the feeding manifold design, channel geometry, and the associated shear, stagnation zones, and centripetal accelerations with varying heat flux and mass flux are not well understood. This study builds upon our previous work and elucidates effects of channel geometry, mass flux, and outlet quality on the boiling/evaporation flow regimes in a manifolded microgap channel.

A Review of Two-Phase Forced Cooling in Three-Dimensional Stacked Electronics: Technology Integration

2015 ◽  
Vol 137 (4) ◽  
Author(s):  
Craig Green ◽  
Peter Kottke ◽  
Xuefei Han ◽  
Casey Woodrum ◽  
Thomas Sarvey ◽  
...  
Keyword(s):  
Heat Flux ◽  
Heat Sink ◽  
Three Dimensional ◽  
High Heat ◽  
Heat Fluxes ◽  
Thermal Design ◽  
High Heat Flux ◽  
Two Phase ◽  
Forced Cooling ◽  
Fluidic Routing

Three-dimensional (3D) stacked electronics present significant advantages from an electrical design perspective, ranging from shorter interconnect lengths to enabling heterogeneous integration. However, multitier stacking exacerbates an already difficult thermal problem. Localized hotspots within individual tiers can provide an additional challenge when the high heat flux region is buried within the stack. Numerous investigations have been launched in the previous decade seeking to develop cooling solutions that can be integrated within the 3D stack, allowing the cooling to scale with the number of tiers in the system. Two-phase cooling is of particular interest, because the associated reduced flow rates may allow reduction in pumping power, and the saturated temperature condition of the coolant may offer enhanced device temperature uniformity. This paper presents a review of the advances in two-phase forced cooling in the past decade, with a focus on the challenges of integrating the technology in high heat flux 3D systems. A holistic approach is applied, considering not only the thermal performance of standalone cooling strategies but also coolant selection, fluidic routing, packaging, and system reliability. Finally, a cohesive approach to thermal design of an evaporative cooling based heat sink developed by the authors is presented, taking into account all of the integration considerations discussed previously. The thermal design seeks to achieve the dissipation of very large (in excess of 500 W/cm2) background heat fluxes over a large 1 cm × 1 cm chip area, as well as extreme (in excess of 2 kW/cm2) hotspot heat fluxes over small 200 μm × 200 μm areas, employing a hybrid design strategy that combines a micropin–fin heat sink for background cooling as well as localized, ultrathin microgaps for hotspot cooling.

Experimental Characterization of Two-Phase Cooling of Power Electronics in Thermosiphon and Forced Convection Modes

2021 ◽  
Vol 143 (3) ◽  
Author(s):  
Fabio Battaglia ◽  
Farah Singer ◽  
David C. Deisenroth ◽  
Michael M. Ohadi
Keyword(s):  
Heat Flux ◽  
Thermal Resistance ◽  
Power Electronics ◽  
Forced Convection ◽  
Heat Removal ◽  
High Heat ◽  
Heat Fluxes ◽  
High Heat Flux ◽  
Two Phase ◽  
Total Thermal Resistance

Abstract In this paper, we present the results of an experimental study involving low thermal resistance cooling of high heat flux power electronics in a forced convection mode, as well as in a thermosiphon (buoyancy-driven) mode. The force-fed manifold microchannel cooling concept was utilized to substantially improve the cooling performance. In our design, the heat sink was integrated with the simulated heat source, through a single solder layer and substrate, thus reducing the total thermal resistance. The system was characterized and tested experimentally in two different configurations: the passive (buoyancy-driven) loop and the forced convection loop. Parametric studies were conducted to examine the role of different controlling parameters. It was demonstrated that the thermosiphon loop can handle heat fluxes in excess of 200 W/cm2 with a cooling thermal resistance of 0.225 (K cm2)/W for the novel cooling concept and moderate fluctuations in temperature. In the forced convection mode, a more uniform temperature distribution was achieved, while the heat removal performance was also substantially enhanced, with a corresponding heat flux capacity of up to 500 W/cm2 and a thermal resistance of 0.125 (K cm2)/W. A detailed characterization leading to these significant results, a comparison between the performance between the two configurations, and a flow visualization in both configurations are discussed in this paper.

On the Operational Parameters Effects on Two-Phase Pressure Drop Characteristics of Reentrant Copper Microchannels

2016 ◽  
Author(s):  
Daxiang Deng ◽  
Qingsong Huang ◽  
Yanlin Xie ◽  
Wei Zhou ◽  
Xiang Huang ◽  
...  
Keyword(s):  
Heat Flux ◽  
Pressure Drop ◽  
Mass Flux ◽  
Heat Sink ◽  
Flow Boiling ◽  
Heat Fluxes ◽  
High Heat Flux ◽  
Two Phase ◽  
Cooling Systems ◽  
Phase Pressure

Two-phase boiling in advanced microchannel heat sinks offers an efficient and attractive solution for heat dissipation of high-heat-flux devices. In this study, a type of reentrant copper microchannels was developed for heat sink cooling systems. It consisted of 14 parallel Ω-shaped reentrant copper microchannels with a hydraulic diameter of 781μm. Two-phase pressure drop characteristics were comprehensively accessed via flow boiling tests. Both deionized water and ethanol tests were conducted at inlet subcooling of 10°C and 40°C, mass fluxes of 125–300kg/m2·s, and a wide range of heat fluxes and vapor qualities. The effects of heat flux, mass flux, inlet subcoolings and coolants on the two-phase pressure drop were systematically explored. The results show that the two-phase pressure drop of reentrant copper microchannels generally increased with increasing heat fluxes and vapor qualities. The role of mass flux and inlet temperatures was dependent on the test coolant. The water tests presented smaller pressure drop than the ethanol ones. These results provide critical experimental information for the development of microchannel heat sink cooling systems, and are of considerable practical relevance.

Experimental and Analytical Studies of Reciprocating-Mechanism Driven Heat Loops (RMDHLs)

2008 ◽  
Vol 130 (7) ◽  
Author(s):  
Yiding Cao ◽  
Mingcong Gao
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Electronics Cooling ◽  
High Heat ◽  
Working Fluid ◽  
High Heat Flux ◽  
Two Phase ◽  
Condenser Section ◽  
Analytical Studies ◽  
Evaporator Section

This paper conducts experimental and analytical studies of a novel heat-transfer device, reciprocating-mechanism driven heat loop (RMDHL) that facilitates two-phase heat transfer while eliminating the so-called cavitation problem commonly encountered by a conventional pump. A RMDHL normally includes a hollow loop having an interior flow passage, an amount of working fluid filled within the loop, and a reciprocating driver. The hollow loop has an evaporator section, a condenser section, and a liquid reservoir. The reciprocating driver is integrated with the liquid reservoir and facilitates a reciprocating flow of the working fluid within the loop, so that liquid is supplied from the condenser section to the evaporator section under a substantially saturated condition and the so-called cavitation problem associated with a conventional pump is avoided. The reciprocating driver could be a solenoid-operated reciprocating driver for electronics cooling applications and a bellows-type reciprocating driver for high-temperature applications. Experimental study has been undertaken for a solenoid-operated heat loop in connection with high heat flux thermal management applications. Experimental results show that the heat loop worked very effectively and a heat flux as high as 300W∕cm2 in the evaporator section could be handled. A working criterion has also been derived, which could provide a guidance for the design of a RMDHL.

Development of an R245fa for Electronics Cooling System for High Heat Flux Applications

2009 ◽  
Author(s):  
Farhad Saffaraval ◽  
Amir Jokar
Keyword(s):  
Heat Flux ◽  
Heat Exchanger ◽  
Cooling System ◽  
Electronics Cooling ◽  
High Heat ◽  
Working Fluid ◽  
High Heat Flux ◽  
Two Phase ◽  
Microchannel Heat Exchanger ◽  
Mass Flow Rates

The objective of this study is to experimentally explore thermodynamic performance of R245fa, as a low-pressure and environmentally-friendly refrigerant, in a microchannel heat exchanger. This heat exchanger is used in an electronics cooling application with high-power density. Due to the large amount of latent heat that is released during evaporation process, the two-phase microchannel coolers are able to remove much more energy compared to single-phase cooling systems. In this study, R245fa is used as the working fluid in a refrigeration pump loop that mainly includes an evaporator, a condenser, a refrigerant pump, and a pressure regulator valve. The goal is to obtain optimal mass flow rates and system pressures while the temperatures in evaporator and condenser are kept constant for specific conditions. The results obtained from this study are then compared to the results previously obtained for water as the working fluid in a similar cooling system. It is expected the evaporative cooling through the microchannel heat exchanger be a viable and effective solution, especially for higher heat flux applications.

High-Flux Thermal Management With Supercritical Fluids

2016 ◽  
Vol 138 (12) ◽  
Author(s):  
Brian M. Fronk ◽  
Alexander S. Rattner
Keyword(s):  
Heat Flux ◽  
Thermal Management ◽  
Heat Sink ◽  
Electronics Cooling ◽  
Heat Fluxes ◽  
Working Fluid ◽  
Management Approach ◽  
High Heat Flux ◽  
Two Phase ◽  
Pump Design

A novel thermal management approach is explored, which uses supercritical carbon dioxide (sCO2) as a working fluid to manage extreme heat fluxes in electronics cooling applications. In the pseudocritical region, sCO2 has extremely high volumetric thermal capacity, which can enable operation with low pumping requirements, and without the potential for two-phase critical heat flux (CHF) and flow instabilities. A model of a representative microchannel heat sink is evaluated with single-phase liquid water and FC-72, two-phase boiling R-134a, and sCO2. For a fixed pumping power, sCO2 is found to yield lower heat-sink wall temperatures than liquid coolants. Practical engineering challenges for supercritical thermal management systems are discussed, including the limits of predictive heat transfer models, narrow operating temperature ranges, high working pressures, and pump design criteria. Based on these findings, sCO2 is a promising candidate working fluid for cooling high heat flux electronics, but additional thermal transport research and engineering are needed before practical systems can be realized.

scholarly journals Two-phase cooling system with controlled pulsations

2019 ◽  
Vol 196 ◽  
pp. 00021
Author(s):  
Karapet Eloyan ◽  
Alexey Kreta ◽  
Egor Tkachenko
Keyword(s):  
Heat Flux ◽  
Gas Flow ◽  
Cooling System ◽  
High Heat ◽  
Heat Fluxes ◽  
High Heat Flux ◽  
Two Phase ◽  
Forced Circulation ◽  
Evaporative Cooling System ◽  
Large Heat

One of the promising ways of removing large heat fluxes from the surface of heat-stressed elements of electronic devices is the use of evaporating thin layer of liquid film, moving under the action of the gas flow in a flat channel. In this work, a prototype of evaporative cooling system for high heat flux removal with forced circulation of liquid and gas coolants with controlled pulsation, capable to remove heat flux of up to 1,5 kW/cm2 and higher was presented. For the first time the regime with controlled pulsation is used. Due to pulsations, it is possible to achieve high values of critical heat flux due to a brief increase in the flow rate of the liquid, which allows to "wash off" large dry spots and prevent the occurrence of zones of flow and drying.

Vapor-Venting, Micromachined Heat Exchanger for Electronics Cooling

2007 ◽  
Author(s):  
Milnes P. David ◽  
Tarun Khurana ◽  
Carlos Hidrovo ◽  
Beth L. Pruitt ◽  
Kenneth E. Goodson
Keyword(s):  
Heat Flux ◽  
Heat Exchanger ◽  
Heat Exchangers ◽  
High Efficiency ◽  
Electronics Cooling ◽  
High Heat ◽  
High Heat Flux ◽  
Water Mixture ◽  
Hydrophobic Membrane ◽  
Two Phase

The increasing complexity of modern integrated circuits and need for high-heat flux removal with low junction temperatures motivates research in a wide variety of cooling and refrigeration technologies. Two-phase liquid cooling is especially attractive due to high efficiency and low thermal resistances. While two-phase microfluidic cooling offers important benefits in required flow rate and pump size, there are substantial challenges related to flow stability and effective superheating. This work investigates the use of hydrophobic membrane to locally vent the vapor phase in microfluidic heat exchangers. Previous work has demonstrated selective venting of gas in microstructures and we extend this concept to two-phase heat exchangers. This paper details the design, fabrication and preliminary testing of the novel heat exchanger. Proof-of-concept of the device, carried out using an isothermal air-water mixture, found the air-mass venting efficiency exceeding 95%. Two-phase, thermal operation of the heat exchanger found the pressure-drop to be smaller compared to a two-phase, non-venting model. The paper also includes a discussion of design challenges such as membrane leakage and optical inaccessibility. The favorable results demonstrated in this first-generation, vapor-venting, micromachined, heat exchanger motivates further study of this and other novel microstructures aimed at mitigating the negative effects of phase-change. With continued research and optimization, we believe two-phase cooling is a viable solution for high heat flux generating electronics.

Sign in / Sign up

Export Citation Format

Share Document