Liquid Cooling Utilizing a Hybrid Microchannel/Multi-Jet Heat Sink: A Component Level Study of Commercial Product

2020 ◽  
Author(s):  
Cong Hiep Hoang ◽  
Mohammad Tradat ◽  
Yaman Manaserh ◽  
Bharath Ramakrisnan ◽  
Srikanth Rangarajan ◽  
...  
Keyword(s):  
Heat Flux ◽  
Flow Rate ◽  
Heat Sink ◽  
High Heat ◽  
Inlet Temperature ◽  
High Heat Flux ◽  
Micro Channel ◽  
Water Coolant ◽  
Liquid Cooling ◽  
Pin Fins

Abstract The miniaturization of microelectronic devices and an increasing demand for faster computing results in high heat flux applications. By adopting direct liquid cooling, the high heat flux and high-power demands can be met. In this paper, thermo-hydraulic performance of a commercial hybrid micro-channel/multi-jet heat sink with water coolant was analyzed in detail. The copper microchannel heat sink with 3 mm fin height, fin thickness of 0.1 mm and channel width of 0.1 mm was used for removing heat flux from the chip surface area of 1″ × 1″(6.45 cm2). Water coolant was directed to microchannel fins by multiple slot jets, continuously providing impingement flow. A three-dimensional numerical simulation using commercial software 6sigmaET is carried out and validated with experimental results. The effects of the coolant inlet temperature and flow rate on the thermo-hydraulic performance was studied. CFD simulation was performed at inlet temperature of 29 °C, 36 °C, 50 °C and 60 °C. Flow rate was varied from 0.7 LPM to 3 LPM. Geometry optimization was performed, considering process of cutting the microchannel into pin fins. It was observed that the thermal resistance of pin-fins/multi-jet heat sink was reduced by 29.4 % as compared to original microchannel/multi-jet heat sink and without changing pressure drop significantly. In this specific heat sink design, the combination of multiple jets and pin fins leads to improvement of thermal performance as compared to micro-channel/multi-jet combination.

scholarly journals Numerical study of the geometrically graded micro-channel heat sink for high heat flux application

2017 ◽  
Vol 142 ◽  
pp. 4016-4021 ◽  
Author(s):  
Nor Haziq Naqiuddin ◽  
Lip Huat Saw ◽  
Ming Chian Yew ◽  
Ming Kun Yew ◽  
Farazila Yusof
Keyword(s):  
Heat Flux ◽  
Heat Sink ◽  
Numerical Study ◽  
High Heat ◽  
High Heat Flux ◽  
Micro Channel

STABLE, CALM, AND HIGH-HEAT-FLUX HEAT REMOVAL USING A POROUS-MICRO-CHANNEL

2017 ◽  
Author(s):  
Tomio Okawa ◽  
Junki Ohashi ◽  
Ryo Hirata ◽  
Koji Enoki
Keyword(s):  
Heat Flux ◽  
Heat Removal ◽  
High Heat ◽  
High Heat Flux ◽  
Micro Channel

Investigation of On-Chip Hot Spot Cooling Using Microchannel Heat Sink

2013 ◽  
Vol 455 ◽  
pp. 466-469
Author(s):  
Yun Chuan Wu ◽  
Shang Long Xu ◽  
Chao Wang
Keyword(s):  
Heat Flux ◽  
Heat Sink ◽  
Hot Spots ◽  
Hot Spot ◽  
High Heat ◽  
High Heat Flux ◽  
Microchannel Heat Sink ◽  
Three Dimensional Model ◽  
Spot Cooling ◽  
On Chip

With the increase of performance demands, the nonuniformity of on-chip power dissipation becomes greater, causing localized high heat flux hot spots that can degrade the processor performance and reliability. In this paper, a three-dimensional model of the copper microchannel heat sink, with hot spot heating and background heating on the back, was developed and used for numerical simulation to predict the hot spot cooling performance. The hot spot is cooled by localized cross channels. The pressure drop, thermal resistance and effects of hot spot heat flux and fluid flow velocity on the cooling of on-chip hot spots, are investigated in detail.

Development of Cooling System for a Large Area at High Heat Flux by Using Flow Boiling in Narrow Channels

2009 ◽  
Author(s):  
Shinichi Miura ◽  
Yukihiro Inada ◽  
Yasuhisa Shinmoto ◽  
Haruhiko Ohta
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Flow Rate ◽  
Mass Velocity ◽  
Cooling System ◽  
Volumetric Flow Rate ◽  
High Heat ◽  
High Heat Flux ◽  
Gap Size ◽  
Heated Channel

Advance of an electronic technology has caused the increase of heat generation density for semiconductors densely integrated. Thermal management becomes more important, and a cooling system for high heat flux is required. It is extremely effective to such a demand using flow boiling heat transfer because of its high heat removal ability. To develop the cooling system for a large area at high heat flux, the cold plate structure of narrow channels with auxiliary unheated channel for additional liquid supply was devised and confirmed its validity by experiments. A large surface of 150mm in heated length and 30mm in width with grooves of an apex angle of 90 deg, 0.5mm depth and 1mm in pitch was employed. A structure of narrow rectangular heated channel between parallel plates with an unheated auxiliary channel was employed and the heat transfer characteristics were examined by using water for different combinations of gap sizes and volumetric flow rates. Five different liquid distribution modes were tested and their data were compared. The values of CHF larger than 1.9×106W/m2 for gap size of 2mm under mass velocity based on total volumetric flow rate and on the cross section area of main heated channel 720kg/m2s or 1.7×106W/m2 for gap size of 5mm under 290kg/m2s were obtained under total volumetric flow rate 4.5×10−5m3/s regardless of the liquid distribution modes. Under several conditions, the extensions of dry-patches were observed at the upstream location of the main heated channel resulting burnout not at the downstream but at the upstream. High values of CHF larger than 2×106W/m2 were obtained only for gap size of 2mm. The result indicates that higher mass velocity in the main heated channel is more effective for the increase in CHF. It was clarified that there is optimum flow rate distribution to obtain the highest values of CHF. For gap size of 2mm, high heat transfer coefficient as much as 7.4×104W/m2K were obtained at heat flux 1.5×106W/m2 under mass velocity 720kg/m2s based on total volumetric flow rate and on the cross section area of main heated channel. Also to obtain high heat transfer coefficient, it is more useful to supply the cooling liquid from the auxiliary unheated channel for additional liquid supply in the transverse direction perpendicular to the flow in the main heated channel.

Sign in / Sign up

Export Citation Format

Share Document