An Experimental Study of TMAH Etching Silicon for MEMS

Author(s):  
Feiyan Chen ◽  
Guoqing Hu ◽  
Baihai Wu

In the process of Micro-Electrical-Mechanical System (MEMS), the anisotropic wet chemical etching rate of the silicon wafer is very important for fabricating MEMS to determine the fabricating method, processing and etching time. The etching rates of the silicon wafer in the TMAH solution with the different temperature are obtained in this paper. The micro-fabrication technology and micro-fabrication process are also discussed. In the same time, all experimental data are put forward in details.

2012 ◽  
Vol 2012 ◽  
pp. 1-8 ◽  
Author(s):  
Chien-Wei Liu ◽  
Chin-Lung Cheng ◽  
Bau-Tong Dai ◽  
Chi-Han Yang ◽  
Jun-Yuan Wang

Nanostructured solar cells with coaxial p-n junction structures have strong potential to enhance the performances of the silicon-based solar cells. This study demonstrates a radial junction silicon nanowire (RJSNW) solar cell that was fabricated simply and at low cost using wet chemical etching. Experimental results reveal that the reflectance of the silicon nanowires (SNWs) declines as their length increases. The excellent light trapping was mainly associated with high aspect ratio of the SNW arrays. A conversion efficiency of ∼7.1% and an external quantum efficiency of ∼64.6% at 700 nm were demonstrated. Control of etching time and diffusion conditions holds great promise for the development of future RJSNW solar cells. Improving the electrode/RJSNW contact will promote the collection of carries in coaxial core-shell SNW array solar cells.


2004 ◽  
Vol 2004.5 (0) ◽  
pp. 111-112
Author(s):  
Noritaka KAWASEGI ◽  
Noboru MORITA ◽  
Noboru TAKANO ◽  
Kiwamu ASHIDA ◽  
Jun TANIGUCHI ◽  
...  

2004 ◽  
Vol 2004.5 (0) ◽  
pp. 139-140
Author(s):  
Noritaka KAWASEGI ◽  
Noboru MORITA ◽  
Shigeru YAMADA ◽  
Noboru TAKANO ◽  
Tatsuo OYAMA ◽  
...  

2011 ◽  
Vol 34 (7) ◽  
pp. 1689-1692
Author(s):  
A. Mefoued ◽  
M. Fathi ◽  
J. Bhatt ◽  
A. Messaoud ◽  
B. Palahouane ◽  
...  

2012 ◽  
Vol 49 (2) ◽  
pp. 45-50
Author(s):  
O. Shiman ◽  
V. Gerbreders ◽  
E. Sledevskis ◽  
A. Bulanovs

Selective Wet-Etching of Amorphous/Crystallized Sb-Se Thin Films The paper is focused on the development of an in situ real-time method for studying the process of wet chemical etching of thin films. The results of studies demonstrate the adequate etching selectivity for all thin film SbxSe100-x (x = 0, 20, 40, 50, 100) compositions under consideration. Different etching rates for the as-deposited and laser exposed areas were found to depend on the sample composition. The highest achieved etching rate was 1.8 nm/s for Sb40Se60 samples.


Author(s):  
Dongmei Meng ◽  
Joe Rupley ◽  
Chris McMahon

Abstract This paper presents decapsulation solutions for devices bonded with Cu wire. By removing mold compound to a thin layer using a laser ablation tool, Cu wire bonded packages are decapsulated using wet chemical etching by controlling the etch time and temperature. Further, the paper investigates the possibilities of decapsulating Cu wire bonded devices using full wet chemical etches without the facilitation of laser ablation removing much of mold compound. Additional discussion on reliability concerns when evaluating Cu wirebond devices is addressed here. The lack of understanding of the reliability of Cu wire bonded packages creates a challenge to the FA engineer as they must develop techniques to help understanding the reliability issue associated with Cu wire bonding devices. More research and analysis are ongoing to develop appropriate analysis methods and techniques to support the Cu wire bonding device technology in the lab.


Small ◽  
2020 ◽  
Vol 16 (51) ◽  
pp. 2007045
Author(s):  
Mei Sun ◽  
Bocheng Yu ◽  
Mengyu Hong ◽  
Zhiwei Li ◽  
Fengjiao Lyu ◽  
...  

Author(s):  
Albert Grau-Carbonell ◽  
Sina Sadighikia ◽  
Tom A. J. Welling ◽  
Relinde J. A. van Dijk-Moes ◽  
Ramakrishna Kotni ◽  
...  

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