Determination of Interfacial Fracture Toughness for Thin Film Coating Materials

2005 ◽  
Author(s):  
John Jy-An Wang ◽  
Ian G. Wright ◽  
Michael J. Lance ◽  
Ken C. Liu
Keyword(s):  
Thin Film ◽  
Fracture Toughness ◽  
Lattice Mismatch ◽  
Coefficient Of Thermal Expansion ◽  
Testing Procedure ◽  
Interface Fracture ◽  
Material Interfaces ◽  
Coating Materials ◽  
Interface Fracture Toughness

A material configuration of central importance in composite materials or in protective coating technology is a thin film of one material deposited onto a substrate of a different material. Fabrication of such a structure inevitably gives rise to stress in the film due to lattice mismatch, differing coefficient of thermal expansion, chemical reactions, or other physical effects. Therefore, in general, the weakest link in this composite system often resides at the interface between the thin film and substrate. In order to make multi-layered electronic devices and structural composites with long-term reliability, the fracture behavior of the material interfaces must be known. This project is intended to address the problems associated with interface fracture toughness evaluation and offers an innovative testing procedure for the determination of interface fracture toughness applicable to thin coating materials in general.

A New Approach for Bimaterial Interface Fracture Toughness Evaluation

2008 ◽  
Vol 130 (1) ◽  
Author(s):  
John Jy-An Wang ◽  
Ian G. Wright ◽  
Michael J. Lance ◽  
Ken C. Liu
Keyword(s):  
Thin Film ◽  
Fracture Toughness ◽  
Lattice Mismatch ◽  
Coefficient Of Thermal Expansion ◽  
Test Method ◽  
Interface Fracture ◽  
Bimaterial Interface ◽  
Material Interfaces ◽  
Coating Materials ◽  
Interface Fracture Toughness

A material configuration of central importance in composite materials or in protective coating technology is a thin film of one material deposited onto a substrate of a different material. Fabrication of such a structure inevitably gives rise to stress in the film due to lattice mismatch, differing coefficient of thermal expansion, chemical reactions, or other physical effects. Therefore, in general, the weakest link in this composite system often resides at the interface between the thin film and the substrate. In order to make multilayered electronic devices and structural composites with long-term reliability, the fracture behavior of the material interfaces must be known. This project offers an innovative testing procedure of using a spiral notch torsion bar method for the determination of interface fracture toughness that is applicable to thin coating materials in general. The feasibility study indicated that this approach for studying thin film interface fracture is repeatable and reliable, and the demonstrated test method closely adheres to and is consistent with classical fracture mechanics theory.

An Innovative Technique for Bi-Material Interface Toughness Research

2004 ◽  
Author(s):  
John Jy-An Wang ◽  
Ian G. Wright ◽  
Ken C. Liu ◽  
Roy L. Xu
Keyword(s):  
Thin Film ◽  
Fracture Toughness ◽  
Fracture Mechanics ◽  
Coefficient Of Thermal Expansion ◽  
Testing Procedure ◽  
Interface Fracture ◽  
Fracture Toughness Test ◽  
Coating Materials ◽  
Testing Procedures ◽  
Interface Fracture Toughness

A material configuration of central importance in microelectronics, optoelectronics, and thermal barrier coating technology is a thin film of one material deposited onto a substrate of a different material. Fabrication of such a structure inevitably gives rise to stress in the film due to lattice mismatch, differing coefficient of thermal expansion, chemical reactions, or other physical effects. Therefore, in general, the weakest link in this composite system often resides at the interface between the thin film and substrate. In order to make multi-layered electronic devices and structural composites with long-term reliability, the fracture behavior of the material interfaces must be known. Unfortunately, none of the state-of-the-art testing methods for evaluating interface fracture toughness is fully conformed to fracture mechanics theory, as is evident from the severe scatter in the existing data, and the procedure dependence in thin film/coating evaluation methods. This project is intended to address the problems associated with this deficiency and offers an innovative testing procedure for the determination of interface fracture toughness applicable to thin coating materials in general. Phase I of this new approach and the associated bi-material fracture mechanics development proposed for evaluating interface fracture toughness are described herein. The effort includes development of specimen configuration and related instrumentation set-up, testing procedures, and postmortem examination. A spiral notch torsion fracture toughness test (SNTT) system was utilized. The objectives of the testing procedure described are to enable the development of new coating materials by providing a reliable method for use in assessing their performance.

A new approach for evaluating thin film interface fracture toughness

2006 ◽  
Vol 426 (1-2) ◽  
pp. 332-345 ◽  
Author(s):  
Jy-An John Wang ◽  
Ian G. Wright ◽  
Michael J. Lance ◽  
Ken C. Liu
Keyword(s):  
Thin Film ◽  
Fracture Toughness ◽  
Interface Fracture ◽  
New Approach ◽  
Interface Fracture Toughness ◽  
Film Interface

scholarly journals INTERFACE FRACTURE TOUGHNESS ASSESSMENT OF SOLDER JOINTS USING DOUBLE CANTILEVER BEAM TEST

2010 ◽  
Vol 24 (01n02) ◽  
pp. 164-174 ◽  
Author(s):  
SHANE ZHI YUAN LOO ◽  
PUAY CHENG LEE ◽  
ZAN XUAN LIM ◽  
NATALIA YANTARA ◽  
TONG YAN TEE ◽  
...  
Keyword(s):  
Fracture Toughness ◽  
Solder Joint ◽  
Energy Release Rate ◽  
Release Rate ◽  
Double Cantilever Beam ◽  
Interface Reaction ◽  
Critical Energy ◽  
Interface Fracture ◽  
Critical Energy Release Rate ◽  
Interface Fracture Toughness

In the current work, a test scheme to evaluate solder joint interface fracture toughness using double cantilever beam (DCB) test has been successfully demonstrated. The obtained results, in terms of critical energy release rate, predict the joint failure based on the principle of fracture mechanics. The results can be used as a materials property in the reliability design of various types of solder-ball joined packages. DCB specimens made of 99.9 wt% copper were selected in the current work. Eutectic Sn -37 Pb and lead-free Sn -3.5 Ag -0.5 Cu solders were used to join two pieces of the copper beams with controlled solder thickness. The test record showed steady propagation of the crack along the solder / copper interface, which verifies the viability of such a testing scheme. Interface fracture toughness for as-joined, extensively-reflowed and thermally aged samples has been measured. Both the reflow treatment and the thermal aging lead to degradation of the solder joint fracture resistance. Reflow treatment was more damaging as it induces much faster interface reaction. Fractographic analysis established that the fracture has a mixed micromechanism of dimple and cleavage. The dimples are formed as a result of the separation between the hard intermetallic compound (IMC) particles and the soft solder material, while the cleavage is formed by the brittle split of the IMCs. When the IMC thickness is increased due to extended interface reaction, the proportion of IMC cleavage failure increases, and this was reflected in the decrease of the critical energy release rate.

Determination of Mechanical Properties of Thin Film on Silicon Wafer

2003 ◽  
Author(s):  
Enboa Wu ◽  
Albert J. D. Yang ◽  
Ching-An Shao ◽  
C. S. Yen
Keyword(s):  
Thin Film ◽  
Mechanical Properties ◽  
Thermal Expansion ◽  
Young’S Modulus ◽  
Silicon Wafer ◽  
Coefficient Of Thermal Expansion ◽  
Young's Modulus ◽  
Poisson Ratio ◽  
Bulk State

Nondestructive determination of Young’s modulus, coefficient of thermal expansion, Poisson ratio, and thickness of a thin film has long been a difficult but important issue as the film of micrometer order thick might behave differently from that in the bulk state. In this paper, we have successfully demonstrated the capability of determining all these four parameters at one time. This novel method includes use of the digital phase-shifting reflection moire´ (DPRM) technique to record the slope of wafer warpage under temperature drop condition. In the experiment, 1-um thick aluminum was sputtered on a 6-in silicon wafer. The convolution relationship between the measured data and the mechanical properties was constructed numerically using the conventional 3D finite element code. The genetic algorithm (GA) was adopted as the searching tool for search of the optimal mechanical properties of the film. It was found that the determined data for Young’s modulus (E), Coefficient of Thermal Expansion (CTE), Poisson ratio (ν), and thickness (h) of the 1.00 um thick aluminum film were 104.2Gpa, 38.0 ppm/°C, 0.38, and 0.98 um, respectively, whereas that in the bulk state were measured to be E=71.4 Gpa, CTE=23.0 ppm/°C, and ν=0.34. The significantly larger values on the Young’s modulus and the coefficient of thermal expansion determined by this method might be attributed to the smaller dislocation density due to the thin dimension and formation of the 5-nm layer of Al2O3 formed on top of the 1-um thick sputtered film. The Young’s Modulus and the Poisson ratio of this nano-scale Al2O3 film were then determined. Their values are consistent with the physical intuition of the microstructure.

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