Bottom-up fill mechanisms of electroless copper plating with addition of mercapto alkyl carboxylic acid

2006 ◽  
Vol 24 (2) ◽  
pp. 803 ◽  
Author(s):  
Zenglin Wang ◽  
Zhijuan Liu ◽  
Hongyan Jiang ◽  
Xiu Wei Wang
Keyword(s):  
Carboxylic Acid ◽  
Copper Plating ◽  
Electroless Copper Plating ◽  
Bottom Up ◽  
Electroless Copper

First Synergy Effects of SPS and PEG-4000 on the Bottom-Up Filling in Electroless Copper Plating

2010 ◽  
Vol 157 (10) ◽  
pp. D546 ◽  
Author(s):  
Xu Wang ◽  
Zhifeng Yang ◽  
Na Li ◽  
Zonghuai Liu ◽  
Zupei Yang ◽  
...  
Keyword(s):  
Copper Plating ◽  
Electroless Copper Plating ◽  
Bottom Up ◽  
Peg 4000 ◽  
Synergy Effects ◽  
Electroless Copper

Electroless Copper Plating of Titanium Condenser Tubes for Biofouling Control

2016 ◽  
Vol 6 (1) ◽  
pp. 65-73
Author(s):  
Balakrishnan Anandkumar ◽  
Rani P. George ◽  
Alagarsamy Karthik ◽  
Dasnamoorthy Ramachandran ◽  
Uthandi Kamachi Mudali
Keyword(s):  
Copper Plating ◽  
Electroless Copper Plating ◽  
Electroless Copper ◽  
Biofouling Control

Novel fabrication of low-cost Ti–Cu alloy by electroless copper plating and vacuum sintering

Vacuum ◽  
2021 ◽  
pp. 110330
Author(s):  
Chunming Wang ◽  
Luming Zeng ◽  
Wucheng Ding ◽  
Tongxiang Liang
Keyword(s):  
Low Cost ◽  
Copper Plating ◽  
Vacuum Sintering ◽  
Electroless Copper Plating ◽  
Cu Alloy ◽  
Electroless Copper

New and clean strategy for the determination of Cu2+ in electroless copper plating baths

2007 ◽  
Vol 68 (1) ◽  
pp. 150-155 ◽  
Author(s):  
Rutao Liu ◽  
Wansong Zong ◽  
Canzhu Gao ◽  
Zhenxing Chi ◽  
Lijun Zhang
Keyword(s):  
Copper Plating ◽  
Electroless Copper Plating ◽  
Electroless Copper
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