First Synergy Effects of SPS and PEG-4000 on the Bottom-Up Filling in Electroless Copper Plating

2010 ◽  
Vol 157 (10) ◽  
pp. D546 ◽  
Author(s):  
Xu Wang ◽  
Zhifeng Yang ◽  
Na Li ◽  
Zonghuai Liu ◽  
Zupei Yang ◽  
...  
Keyword(s):  
Copper Plating ◽  
Electroless Copper Plating ◽  
Bottom Up ◽  
Peg 4000 ◽  
Synergy Effects ◽  
Electroless Copper

Electroless Copper Plating of Titanium Condenser Tubes for Biofouling Control

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Author(s):  
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Rani P. George ◽  
Alagarsamy Karthik ◽  
Dasnamoorthy Ramachandran ◽  
Uthandi Kamachi Mudali
Keyword(s):  
Copper Plating ◽  
Electroless Copper Plating ◽  
Electroless Copper ◽  
Biofouling Control

Novel fabrication of low-cost Ti–Cu alloy by electroless copper plating and vacuum sintering

Vacuum ◽  
2021 ◽  
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Luming Zeng ◽  
Wucheng Ding ◽  
Tongxiang Liang
Keyword(s):  
Low Cost ◽  
Copper Plating ◽  
Vacuum Sintering ◽  
Electroless Copper Plating ◽  
Cu Alloy ◽  
Electroless Copper

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2007 ◽  
Vol 68 (1) ◽  
pp. 150-155 ◽  
Author(s):  
Rutao Liu ◽  
Wansong Zong ◽  
Canzhu Gao ◽  
Zhenxing Chi ◽  
Lijun Zhang
Keyword(s):  
Copper Plating ◽  
Electroless Copper Plating ◽  
Electroless Copper
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