Lattice relaxation and misfit dislocations in nonlinearly graded InxGa1 − xAs/GaAs (001) and GaAs1 − yPy/GaAs (001) metamorphic buffer layers

Author(s):  
Tedi Kujofsa ◽  
John E. Ayers
2015 ◽  
Vol 24 (03n04) ◽  
pp. 1520009 ◽  
Author(s):  
Tedi Kujofsa ◽  
John E. Ayers

The inclusion of metamorphic buffer layers (MBL) in the design of lattice-mismatched semiconductor heterostructures is important in enhancing reliability and performance of optical and electronic devices. These metamorphic buffer layers usually employ linear grading of composition, and materials including InxGa1-xAs and GaAs1-yPy have been used. Non-uniform and continuously graded profiles are beneficial for the design of partially-relaxed buffer layers because they reduce the threading dislocation density by allowing the distribution of the misfit dislocations throughout the metamorphic buffer layer, rather than concentrating them at the interface where substrate defects and tangling can pin dislocations or otherwise reduce their mobility as in the case of uniform compositional growth. In this work we considered heterostructures involving a linearly-graded (type A) or step-graded (type B) buffer layer grown on a GaAs (001) substrate. For each structure type we present minimum energy calculations and compare the cases of cation (Group III) and anion (Group V) grading. In addition, we studied the (i) average and surface in-plane strain and (ii) average misfit dislocation density for heterostructures with various thickness and compositional profile. Moreover, we show that differences in the elastic stiffness constants give rise to significantly different behavior in these two commonly-used buffer layer systems.


2021 ◽  
Vol 63 (1) ◽  
pp. 85
Author(s):  
Д.В. Побат ◽  
В.А. Соловьев ◽  
М.Ю. Чернов ◽  
С.В. Иванов

Here we report on computing of the distribution of the equilibrium misfit dislocation density ρ(z) as well as the elastic strain ε(z) along the grow direction for metamorphic buffer layer InAlAs/GaAs(001) with high In content (x ≤ 0.87) and different design of composition profile: step-, linear- and convex-graded. For the computation, an approach based on the iterative finding the system total energy minimum have been used. It was shown, that the significant difference between different types of the buffer layer is observed for the ρ(z) distribution rather than for ε(z). In contrast to traditionally used step- and linear-graded metamorphic buffer layers, which are characterized by homogenous spreading of misfit dislocations, the main part of such dislocations in the convex-graded composition profile is concentrated at the bottom part of the buffer layer near to heterointerface InAlAs/GaAs, and the dislocation density drop by more than one order of magnitude along the layer thickness reaching near the surface the minimal value among the buffer types. Despite the fact, that the significant effect of interaction between misfit dislocations is not taken into account in the computation, the results obtained allowed one to determine the main features of the ρ(z) and ε(z) distributions in the different InAlAs metamorphic buffer layers, which were previously obtained experimentally. Thus, such an approach can be effectively utilized for the development of the metamorphic heterostructure based devices.


2018 ◽  
Vol 27 (03n04) ◽  
pp. 1840023
Author(s):  
Tedi Kujofsa ◽  
Minglei Cai ◽  
Xinkang Chen ◽  
Md Tanvirul Islam ◽  
John E. Ayers

Metamorphic semiconductor devices such as high electron mobility transistors (HEMTs), light-emitting diodes (LEDs), laser diodes, and solar cells are grown on mismatched substrates and typically exhibit a high degree of lattice relaxation. In order to minimize the incorporation of threading defects it is common to use a linearly-graded buffer layer to accommodate the mismatch between the substrate and device layers. However, some work has suggested that buffer layers with non-linear grading could offer superior performance in terms of limiting the surface density of threading defects. In this work, we have compared S-graded buffer layers with different orders and thicknesses. To do so we calculated the expected surface threading dislocation density for each buffer design assuming a GaAs (001) substrate. The threading dislocation densities were calculated using the LMD model, in which the coefficient for second-order annihilation and coalescence reactions between threading dislocations is considered to be equal to the length of misfit dislocations.


2014 ◽  
Vol 8 (2) ◽  
pp. 25-32 ◽  
Author(s):  
Luke J. Mawst ◽  
Thomas Earles ◽  
TaeWan Kim ◽  
Kevin Schulte ◽  
Jeremy D. Kirch ◽  
...  

1988 ◽  
Vol 126 ◽  
Author(s):  
M. Razeghi ◽  
M. Defour ◽  
F. Omnes ◽  
J. Nagle ◽  
P. Maurel ◽  
...  

ABSTRACTHigh quality GaAs and InP have been grown on silicon substrates, using low pressure metalorganic chemical vapor deposition technique. The growth temperature is 550°C and the growth rate 100 A/min.Photoluminescence, X-ray diffraction and electrochemical profiling verified the high quality of these layers. The use of superlattices as buffer layers, (GaAs/GaInP) in the case of GaAs/Si and (GaInAsP/InP) in the case of InP/Si, decreased the amount of misfit dislocations in the epitaxial layer. Carrier concentrations as low as 5.1015 cm−3 have been measured by electrochemical profiling.


1986 ◽  
Vol 67 ◽  
Author(s):  
Jhang Woo Lee

ABSTRACTData is presented on the optimization of several molecular beam epitaxial growth processes to provide low dislocation density and high mobility GaAs single crystals on (100) Si wafers. The substrate tilt angle, the growth temperature, and the first buffer layer structure, were investigated Tor this purpose. Using Hall measurements the GaAs layers grown on 2 or 3-degree tilt (100) Si showed consistently high mobilities which are equivalent to the homoepitaxial GaAs mobility. Transmission electron microscopy (TEM) revealed that on tilted (100) Si substrates most of the misfit dislocations were confined within the first 50 Å GaAs layer by forming a type of edge dislocation at the Si surface step edges. Also low temperature grown buffer layers always gave better morphologies and lower etch pit densities while keeping the high mobilities on overgrown GaAs layers.


2013 ◽  
Vol 102 (20) ◽  
pp. 201111 ◽  
Author(s):  
Y. Y. Cao ◽  
Y. G. Zhang ◽  
Y. Gu ◽  
X. Y. Chen ◽  
L. Zhou ◽  
...  

2011 ◽  
Vol 315 (1) ◽  
pp. 96-101 ◽  
Author(s):  
J. Kirch ◽  
T.W. Kim ◽  
J. Konen ◽  
L.J. Mawst ◽  
T.F. Kuech ◽  
...  

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