Atomic layer deposition of high-quality Pt thin film as an alternative interconnect replacing Cu

2020 ◽  
Vol 38 (3) ◽  
pp. 032404
Author(s):  
Seung-Min Han ◽  
Dip K. Nandi ◽  
Yong-Hwan Joo ◽  
Toshiyuki Shigetomi ◽  
Kazuharu Suzuki ◽  
...  
Author(s):  
Yoon Kyeung Lee ◽  
Chanyoung Yoo ◽  
Woohyun Kim ◽  
Jeongwoo Jeon ◽  
Cheol Seong Hwang

Atomic layer deposition (ALD) is a thin film growth technique that uses self-limiting, sequential reactions localized at the growing film surface. It guarantees exceptional conformality on high-aspect-ratio structures and controllability...


2013 ◽  
Vol 542 ◽  
pp. 219-224 ◽  
Author(s):  
Väino Sammelselg ◽  
Ivan Netšipailo ◽  
Aleks Aidla ◽  
Aivar Tarre ◽  
Lauri Aarik ◽  
...  

2014 ◽  
Vol 2 (36) ◽  
pp. 15044-15051 ◽  
Author(s):  
Erik Østreng ◽  
Knut Bjarne Gandrud ◽  
Yang Hu ◽  
Ola Nilsen ◽  
Helmer Fjellvåg

Atomic layer deposition (ALD) has been used to prepare nano-structured cathode films for Li-ion batteries of V2O5 from VO(thd)2 and ozone at 215 °C.


2014 ◽  
Vol 64 (9) ◽  
pp. 15-21 ◽  
Author(s):  
G. Y. Cho ◽  
S. Noh ◽  
Y. H. Lee ◽  
S. Ji ◽  
S. W. Cha

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