Atomic layer deposition of high-quality Pt thin film as an alternative interconnect replacing Cu
2020 ◽
Vol 38
(3)
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pp. 032404
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2016 ◽
Vol 157
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pp. 757-764
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2014 ◽
Vol 2
(36)
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pp. 15044-15051
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2014 ◽
Vol 118
(16)
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pp. 8722-8722
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