Intermetallic compound formation inhibiting electromigration-based micro/nanowire growth

Author(s):  
Yasuhiro Kimura ◽  
Yang Ju
2020 ◽  
Vol 272 ◽  
pp. 127891 ◽  
Author(s):  
Li Pu ◽  
Yingxia Liu ◽  
Yong Yang ◽  
Quanfeng He ◽  
Ziqing Zhou ◽  
...  

1998 ◽  
Vol 13 (1) ◽  
pp. 37-44 ◽  
Author(s):  
C. Y. Liu ◽  
K. N. Tu

We have investigated the wetting angle, side band growth, and intermetallic compound formation of seven SnPb alloys on Cu ranging from pure Sn to pure Pb. The wetting angle has a minimum near the middle composition and increases toward pure Sn and pure Pb, but the side band growth has a maximum near the middle composition. The intermetallic compounds formed are Cu6Sn5 and Cu3Sn for the eutectic and high-Sn alloys, yet for the high-Pb alloys, only Cu3Sn can be detected. While no intermetallic compound forms between Cu and pure Pb, the latter nevertheless wets the former with an angle of 115°. The driving force of a wetting reaction, which may be affected by the free energy gain in compound formation, is discussed by assuming that rate of compound formation is fast.


2003 ◽  
Vol 319 (3-4) ◽  
pp. 424-428 ◽  
Author(s):  
Pengchao Si ◽  
Xiufang Bian ◽  
Wang Li ◽  
Junyan Zhang ◽  
Zhongxi Yang

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