Customized illumination aperture filter design for through-pitch focus latitude enhancement of deep submicron contact hole printing

2002 ◽  
Vol 1 (3) ◽  
pp. 296 ◽  
Author(s):  
Shuo-Yen Chou
1991 ◽  
Vol 138 (4) ◽  
pp. 241 ◽  
Author(s):  
T.C. Chen
Keyword(s):  

Author(s):  
Qiusheng WANG ◽  
Xiaolan GU ◽  
Yingyi LIU ◽  
Haiwen YUAN

Author(s):  
J. Kulanayagam ◽  
J.H. Hagmann ◽  
K.F. Hoffmann ◽  
S. Dickmann
Keyword(s):  

Author(s):  
Sweta Pendyala ◽  
Dave Albert ◽  
Katherine Hawkins ◽  
Michael Tenney

Abstract Resistive gate defects are unusual and difficult to detect with conventional techniques [1] especially on advanced devices manufactured with deep submicron SOI technologies. An advanced localization technique such as Scanning Capacitance Imaging is essential for localizing these defects, which can be followed by DC probing, dC/dV, CV (Capacitance-Voltage) measurements to completely characterize the defect. This paper presents a case study demonstrating this work flow of characterization techniques.


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