Impacts of SiO2 sidewall roughness on light coupling efficiency for silicon photonics ICs (Conference Presentation)

2018 ◽  
Author(s):  
Keizo Kinoshita ◽  
Tsuyoshi Horikawa ◽  
Masataka Noguchi ◽  
Takahiro Nakamura ◽  
Tohru Mogami
Sensors ◽  
2019 ◽  
Vol 19 (15) ◽  
pp. 3383 ◽  
Author(s):  
Yu Xin ◽  
Gregory Pandraud ◽  
Yongmeng Zhang ◽  
Paddy French

In this paper, we propose a novel vertical SU-8 waveguide for evanescent analyte sensing. The waveguide is designed to possess a vertical and narrow structure to generate evanescent waves on both sides of the waveguide’s surface, aimed at increasing the sensitivity by enlarging the sensing areas. We performed simulations to monitor the influence of different parameters on the waveguide’s performance, including its height and width. E-beam lithography was used to fabricate the structure, as this one-step direct writing process enables easy, fast, and high-resolution fabrication. Furthermore, it reduces the sidewall roughness and decreases the induced scattering loss, which is a major source of waveguide loss. Couplers were added to improve the coupling efficiency and alignment tolerance, and will contribute to the feasibility of a plug-and-play optical system. Optical measurements show that the transmission loss is 1.03 ± 0.19 dB/cm. The absorption sensitivity was measured to be 4.8 dB per refractive index unit (dB/RIU) for saline solutions with various concentrations.


2013 ◽  
Vol 3 (1) ◽  
pp. 039999
Author(s):  
Francesco Chiadini ◽  
Vincenzo Fiumara ◽  
Antonio Scaglione ◽  
Akhlesh Lakhtakia

2013 ◽  
Vol 3 (1) ◽  
pp. 034599 ◽  
Author(s):  
Francesco Chiadini ◽  
Vincenzo Fiumara ◽  
Antonio Scaglione ◽  
Akhlesh Lakhtakia

2016 ◽  
Vol 2 (8) ◽  
pp. e1600027 ◽  
Author(s):  
Han Wang ◽  
Honglou Zhen ◽  
Shilong Li ◽  
Youliang Jing ◽  
Gaoshan Huang ◽  
...  

Three-dimensional (3D) design and manufacturing enable flexible nanomembranes to deliver unique properties and applications in flexible electronics, photovoltaics, and photonics. We demonstrate that a quantum well (QW)–embedded nanomembrane in a rolled-up geometry facilitates a 3D QW infrared photodetector (QWIP) device with enhanced responsivity and detectivity. Circular geometry of nanomembrane rolls provides the light coupling route; thus, there are no external light coupling structures, which are normally necessary for QWIPs. This 3D QWIP device under tube-based light-trapping mode presents broadband enhancement of coupling efficiency and omnidirectional detection under a wide incident angle (±70°), offering a unique solution to high-performance focal plane array. The winding number of these rolled-up QWIPs provides well-tunable blackbody photocurrents and responsivity. 3D self-assembly of functional nanomembranes offers a new path for high conversion efficiency between light and electricity in photodetectors, solar cells, and light-emitting diodes.


Photonics ◽  
2021 ◽  
Vol 8 (3) ◽  
pp. 79
Author(s):  
Siwei Sun ◽  
Ying Chen ◽  
Yu Sun ◽  
Fengman Liu ◽  
Liqiang Cao

Fiber-to-chip optical interconnects is a big challenge in silicon photonics application scenarios such as data centers and optical transmission systems. An edge coupler, compared to optical grating, is appealing to in the application of silicon photonics due to the high coupling efficiency between standard optical fibers (SMF-28) and the sub-micron silicon wire waveguides. In this work, we proposed a novel fiber–chip edge coupler approach with a large mode size for silicon photonic wire waveguides. The edge coupler consists of a multiple structure which was fulfilled by multiple silicon nitride layers embedded in SiO2 upper cladding, curved waveguides and two adiabatic spot size converter (SSC) sections. The multiple structure can allow light directly coupling from large mode size fiber-to-chip coupler, and then the curved waveguides and SSCs transmit the evanescent field to a 220 nm-thick silicon wire waveguide based on the silicon-on-insulator (SOI) platform. The edge coupler, designed for a standard SMF-28 fiber with 8.2 μm mode field diameter (MFD) at a wavelength of 1550 nm, exhibits a mode overlap efficiency exceeding 95% at the chip facet and the overall coupling exceeding 90%. The proposed edge coupler is fully compatible with standard microfabrication processes.


ICECom 2013 ◽  
2013 ◽  
Author(s):  
Francesco Chiadini ◽  
Antonio Scaglione ◽  
Vincenzo Fiumara ◽  
Akhlesh Lakhtakia

2020 ◽  
Vol 38 (12) ◽  
pp. 3147-3155
Author(s):  
Akihiro Noriki ◽  
Isao Tamai ◽  
Yasuhiro Ibusuki ◽  
Akio Ukita ◽  
Satoshi Suda ◽  
...  

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