Process development for laser powder bed fusion of pure copper

Author(s):  
Thomas Stoll ◽  
Pascal Trautnitz ◽  
Samuel Schmiedeke ◽  
Joerg Ernst Franke ◽  
Nahum Travitzky
2021 ◽  
pp. 102417
Author(s):  
Shuo Qu ◽  
Junhao Ding ◽  
Jin Fu ◽  
Mingwang Fu ◽  
Baicheng Zhang ◽  
...  

2019 ◽  
Vol 29 ◽  
pp. 100831 ◽  
Author(s):  
Cassidy Silbernagel ◽  
Leonidas Gargalis ◽  
Ian Ashcroft ◽  
Richard Hague ◽  
Michael Galea ◽  
...  

2021 ◽  
Vol 1161 ◽  
pp. 75-82
Author(s):  
Marcel Slodczyk ◽  
Alexander Ilin ◽  
Thomas Kiedrowski ◽  
Jens Schmiemann ◽  
Vasily Ploshikhin

A challenge in laser powder-bed fusion is to achieve high process speed while maintaining quality level of the melting tracks. One approach to increase productivity is to distribute available laser power over several laser spots, resulting in higher melting rate. Using multiple laser spots opens up new parameter spaces in comparison to the conventional single-spot exposure. In addition to classical process parameters, e.g. total laser power and scanning speed, the distribution of power to the specific spots and the respective spatial arrangement have an impact on resulting process quality and speed. Within the scope of this research work, a physically based model is presented to define multi-spot process strategies for the generation of desired melt pool dimensions. Diffractive optical elements are used in order to adjust power or spatial arrangement of multiple laser spots. Resulting melt pool has more width and less depth compared to single-spot generated melt pools. Simulations and experiments show an optimum in applied spot distance between laser spots to obtain higher melting rates.


Materials ◽  
2021 ◽  
Vol 14 (23) ◽  
pp. 7260
Author(s):  
Anna Martín Vilardell ◽  
Pavel Krakhmalev ◽  
Ina Yadroitsava ◽  
Igor Yadroitsev ◽  
Natalia Garcia-Giralt

The intensive cytotoxicity of pure copper is effectively kills bacteria, but it can compromise cellular behavior, so a rational balance must be found for Cu-loaded implants. In the present study, the individual and combined effect of surface composition and roughness on osteoblast cell behavior of in situ alloyed Ti6Al4V(ELI)-3 at.% Cu obtained by laser powder bed fusion was studied. Surface composition was studied using scanning electron microscopy, energy dispersive spectroscopy, and X-ray diffraction. Surface roughness measurements were carried out using confocal microscopy. In vitro osteoblast performance was evaluated by means of cell morphology observation of cell viability, proliferation, and mineralization. In vitro studies were performed at 1, 7, and 14 days of cell culture, except for cell mineralization at 28 days, on grounded and as-built (rough) samples with and without 3 at.% Cu. The addition of 3 at.% Cu did not show cell cytotoxicity but inhibited cell proliferation. Cell mineralization tends to be higher for samples with 3 at.% Cu content. Surface roughness inhibited cell proliferation too, but showed enhanced cell mineralization capacity and therefore, higher osteoblast performance, especially when as-built samples contained 3 at.% Cu. Cell proliferation was only observed on ground samples without Cu but showed the lowest cell mineralization.


2021 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Jieren Guan ◽  
Qiuping Wang ◽  
Chao Chen ◽  
Jingyu Xiao

Purpose The purpose of this paper is to analyze and investigate heat accumulation caused by temperature changes and interface microstructure effected by element diffusion. Design/methodology/approach Al/Cu bimetallic structure is initially manufactured through laser powder bed fusion process. To minimize trial and error, finite element modeling is adopted to simulate temperature changes on the Al-based and Cu-based substrate. Findings The results show that forming pure copper on Al-based substrate can guarantee heat accumulation, providing enough energy for subsequent building. The instantaneous laser energy promotes increase of diffusion activation energy, resulting in the formation of transition zone derived from interdiffusion between Al and Cu atoms. The interface with a thickness of about 22 µm dominated by Kirkendall effect moves towards Al-rich side. The interface microstructure is mainly composed of a-Al, a-Cu and CuAl2 phase. Originality/value The bonding mechanism of Al/Cu interface is atom diffusion-induced chemical reaction. The theoretical basis provides guidance for structural design and production application.


2022 ◽  
Vol 147 ◽  
pp. 107612
Author(s):  
G. Nordet ◽  
C. Gorny ◽  
Y. Mayi ◽  
J. Daligault ◽  
M. Dal ◽  
...  

2020 ◽  
Vol 194 ◽  
pp. 108952
Author(s):  
Alexander Großmann ◽  
Jan Mölleney ◽  
Tilman Frölich ◽  
Holger Merschroth ◽  
Julian Felger ◽  
...  

2022 ◽  
Vol 73 ◽  
pp. 924-938
Author(s):  
Martin Malý ◽  
Daniel Koutný ◽  
Libor Pantělejev ◽  
Laurent Pambaguian ◽  
David Paloušek

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