Research on grinding performance of micro-structured CVD diamond wheel for BK7 optical glass

There is the grade as one of the selection criteria of a grinding wheel like WA whetstone or GC whetstone. The grade of grinding wheel is defined as an index which shows the strength of connection of a grain and a grain, and is usually estimated by bending strength. There are many papers about the relationship between the grade of a grinding wheel and the grinding performance. And, the relationship between the grade of a grinding wheel and the grinding performance is almost clear. Also, the relationship between mechanical properties of a grinding wheel and the grade is also clear. On the other hand, since the grain layer of a super abrasive grinding wheel is thin, it is difficult to apply the conventional evaluation test of the grade. And, the evaluation method of the grade which can be adapted the super abrasive grinding wheel is not established. In addition, since the grade of a super abrasive grinding wheel is a manufacture manufacturer's original standard, there is a minute difference by manufacturer. The super abrasive grinding wheel as well as the grinding wheel is conjectured that the grade influences the grinding performance. Namely, it is important to relate the grade and the mechanical properties of a grain layer. However, researches which relate the grade, the grinding performance and the mechanical properties of a super abrasive grinding wheel are not done so far. Therefore, this study examined the relationship between the mechanical properties of a grain layer of a super abrasive grinding wheel and the grade, the grinding performance. The final objective of this study is to evaluate the grinding performance from mechanical properties of a grain layer of a super abrasive grinding wheel. The purpose of this report is to clarify relationship between the grade and the grinding force in a resinoid bond diamond wheel. The specific experiment procedure is as follows. When carrying out surface grinding of the diamond sticks using a grinding wheel, the relationship of the grade and the grinding force was clarified. And based on the knowledge acquired in this experiment, relationship between the grade of a super abrasive grinding wheel and the grinding force was considered. As the results, it confirmed that the grade of a resinoid bond diamond wheel could be evaluated by the grinding force.

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Study on Grinding Performance of Soft Abrasive Wheel for Silicon Wafer

Key Engineering Materials ◽

10.4028/www.scientific.net/kem.416.529 ◽

2009 ◽

Vol 416 ◽

pp. 529-534 ◽

Cited By ~ 5

Author(s):

Ren Ke Kang ◽

Shang Gao ◽

Zhu Ji Jin ◽

Dong Ming Guo

Keyword(s):

Silicon Wafer ◽

Chemical Reaction ◽

Removal Rate ◽

Surface Damage ◽

Amorphous Layer ◽

Diamond Wheel ◽

Wafer Surface ◽

Abrasive Wheel ◽

Grinding Performance ◽

Diamond Abrasive

With the development of IC manufacturing technology, the machining precision and surface quality of silicon wafer are proposed much higher, but now the planarization techniques of silicon wafer using free abrasive and bonded abrasive have the disadvantage of poor profile accuracy, environmental pollution, deep damage layer, etc. A soft abrasive wheel combining chemical and medical effect was developed in this paper, it could get super smooth, low damage wafer surface by utilizing mechanical friction of abrasives and chemical reaction among abrasives, additives, silicon. A comparison experiment between #3000 soft abrasive wheel and #3000 diamond abrasive wheel was given to study on the grinding performance of soft abrasive wheel. The results showed that: wafer surface roughness ground by soft abrasive wheel was sub-nanometer and its sub-surface damage was only 0.01µm amorphous layer, which were much better than silicon wafer ground by diamond abrasive wheel, but material removal rate and grinding ratio of soft abrasive wheel were lower than diamond wheel. The wafer surface ground by soft abrasive wheel included Ce4+, Ce3+, Si4+, Ca2+ and Si, which indicated that the chemical reaction really occurred during grinding process.

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Effect of Dry Ice Blasting on Removal of Loading Carbon Chips on Wheel Surface

Key Engineering Materials ◽

10.4028/www.scientific.net/kem.656-657.220 ◽

2015 ◽

Vol 656-657 ◽

pp. 220-225 ◽

Cited By ~ 1

Author(s):

Kazuhito Ohashi ◽

Soziro Murakawa ◽

Shinya Tsukamoto

Keyword(s):

Diamond Wheel ◽

Working Environment ◽

Wheel Surface ◽

Dry Ice ◽

Removal Method ◽

Abrasive Grains ◽

Grinding Performance ◽

Dry Grinding ◽

Dry Ice Blasting ◽

The Impact

In dry grinding of hard carbon parts, the grinding performance of wheel is remarkably lost by carbon chips loading on wheel surface. The deterioration in grinding performance of wheel affects the grinding accuracy and efficiency. Generally, the grinding performance of loading wheel recovers by dressing. However, the dressing is not suitable from a viewpoint of the wheel life and the production cost because many abrasive grains having sharp edges under loading carbon chips on wheel surfaces are lost by dressing. In this study, we propose the application of dry ice blasting as a removal method of loading carbon chips. The dry ice is little influence on the working environment because of the quick sublimation of dry ice particles to carbon dioxide. In addition, the dry ice blasting might be suitable for the chip removal method because the dry ice doesn’t remain on wheel surfaces after blasting without the damage of wheel surfaces. The dry ice blasting tests of resinoid bond diamond wheel surface with no grinding performance by loading carbon chips are carried out, and the effects of dry ice blasting on removal of loading carbon chips are investigated, analyzing the protrusion height of abrasive grains, the impact pressure in the dry ice blasting and so on.

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Influence of a Grinding Atmosphere in the Combination Grinding of Steel and WC with a Diamond Wheel

Advanced Materials Research ◽

10.4028/www.scientific.net/amr.797.90 ◽

2013 ◽

Vol 797 ◽

pp. 90-95

Author(s):

Shinichi Ninomiya ◽

Manabu Iwai ◽

Kiyoshi Suzuki

Keyword(s):

Oxygen Concentration ◽

Gas Injection ◽

Diamond Wheel ◽

Grinding Force ◽

Experimental Results ◽

Surface Grinding ◽

Inert Gas ◽

Dry Ice ◽

Ice Particles ◽

Grinding Performance

Grinding experiments were carried out in wet, with MQL, in dry, with a spray of dry ice particles and various gases to examine influence of grinding atmospheres on the grinding performance in the combination surface grinding of steel and WC with a diamond wheel. From the experimental results, it was found that the grinding with inert gas injection which reduces an oxygen concentration at the grinding point would proceed a processing at more stable grinding force, resulting in less wear of the diamond abrasives.

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Grinding Performance of a Grain-Arranged Diamond Wheel against Industrial Pure Aluminum

Key Engineering Materials ◽

10.4028/www.scientific.net/kem.329.33 ◽

2007 ◽

Vol 329 ◽

pp. 33-38 ◽

Cited By ~ 5

Author(s):

Shigeki Okuyama ◽

Takayuki Kitajima ◽

Akinori Yui

Keyword(s):

Pure Aluminum ◽

Diamond Wheel ◽

General Purpose ◽

Surface Grinding ◽

Mirror Surface ◽

Fluid Type ◽

Wheel Wear ◽

Grinding Performance ◽

Grinding Fluid ◽

Table Speed

A grain-arranged diamond wheel is developed and grinding performance of the wheel against industrial pure aluminum, one of the most hard-to-grinding materials, is investigated. The developed wheel efficiently ground pure aluminum without adhesion even when general-purpose grinding fluid, Type A3-1, was used. Moreover, wheel wear was not observed during the experiment, and grinding energy was extremely low. By using the developed wheel, a mirror surface can be easily obtained by one-pass surface grinding with very low table speed.

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