Abstract
Rapid advances in microelectronics require design and optimization of components and packages, for new and ever more demanding applications, in relatively short periods of time while satisfying electrical, thermal, and mechanical specifications, as well as cost and manufacturability expectations. In addition, reliability and durability have to be taken into consideration. As a consequence, some of the most sophisticated analytical, computational, and experimental methods are being used for development, optimization, and quantitative characterization of electronic packages. In this paper, a novel experimental-computational method, based on combined use of recent advances in laser-based optics and computational modeling, is described and its application is demonstrated by case studies of microelectronic components subjected to electro-thermo-mechanical loads. Results of these studies show that this methodology provides an effective engineering tool for nondestructive testing (NDT) applications in electronic packaging and provides indispensable quantitative data for development, optimization, and applications in electronic packaging.
Measurements and Stochastic FEA with Application in Thermomechanical Characterization of Electronic Packages