Measurement system based on a high-speed camera and image processing techniques for testing of spacecraft subsystems

In this paper, a new yarn appearance measurement system based on machine vision is introduced. The yarn images are continuously captured by image acquisition system. To extract the main body of the yarn accurately, the yarn images are processed sequentially with threshold segmentation and morphological opening operation. Then the coefficient of variation (CV value) of diameter is calculated to characterize the yarn evenness. The measurement process achieves result (CV value) which can be compared with USTER evenness tester by image processing techniques. By comparing different methods which use different algorithms, a suitable method is chosen to be used in this new measurement system. Then a more accurate, more efficient and faster measurement system will meet requirements in the future.

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Development of a 3D dynamic measurement system using a high speed camera with white light scanning interference microscopy associated with real-time FPGA image processing

10.1117/12.726394 ◽

2007 ◽

Cited By ~ 1

Author(s):

Gyasi Johnson ◽

Paul Montgomery ◽

Freddy Anstotz ◽

Renaud Kiefer

Keyword(s):

Image Processing ◽

Real Time ◽

Measurement System ◽

White Light ◽

High Speed ◽

Dynamic Measurement ◽

Interference Microscopy ◽

High Speed Camera

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Development of Displacement Measurement System of Structures Using Image Processing Techniques

Journal of Control Automation and Systems Engineering ◽

10.5302/j.icros.2004.10.8.673 ◽

2004 ◽

Vol 10 (8) ◽

pp. 673-679

Keyword(s):

Image Processing ◽

Measurement System ◽

Displacement Measurement ◽

Image Processing Techniques ◽

Processing Techniques

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IC Assembly Product Inspection Using Image Processing Techniques

Applied Mechanics and Materials ◽

10.4028/www.scientific.net/amm.145.209 ◽

2011 ◽

Vol 145 ◽

pp. 209-213

Author(s):

Hsi Chieh Lee ◽

Shao Hsuan Chang

Keyword(s):

Image Processing ◽

Success Rate ◽

Measurement System ◽

Process Time ◽

Automatic Identification ◽

Circuit Boards ◽

Image Identification ◽

Image Processing Techniques ◽

Processing Techniques ◽

Product Specifications

In this study, we present an image identification and measurement system for examining and testing the packaged semiconductor specifications. Most semiconductor processes rely on measurement gauges or inspectors to examine the finished product specifications visually. Measurement gauges are costly; inspectors have to be trained professionally and their performance depends on the maturity of their skills, which requires enormous costs, time, and efforts. Therefore, an automatic identification and measurement system will not only reduce costs, but minimize the complexity of measurement, thereby upgrading the effectiveness of manpower significantly. Experiments were conducted using 1657 BMP images with 640 * 480 pixels taken with a semiconductor machine. These images are snapshots randomly taken from of a variety of the 7.2 cm * 4.8 cm Substrate circuit boards each includes 180 pieces of 30 * 6 IC packaged products. Promising results were derived where 1492 out of 1657 product images were successfully detected and measured. In addition to the 90.04% success rate for inspection, the process time is reduced significantly to about 1/6 as compared to human professionals.

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