Fabrication and characterization of ZnO nanowire structure on flexible substrate with different solution molarities

2010 ◽  
Author(s):  
Kyu-Hang Lee ◽  
Shin Hur ◽  
Wan-Doo Kim ◽  
Hongsoo Choi
2005 ◽  
Vol 128 (3) ◽  
pp. 236-245 ◽  
Author(s):  
Bivragh Majeed ◽  
Kieran Delaney ◽  
John Barton ◽  
Niall McCarthy ◽  
Sean C. O’Mathuna ◽  
...  

In this paper we describe the materials-related challenges in applying folded flex packaging technology to wireless sensor networks and propose solutions for implementing miniaturized 5mm cube platforms. The focus is to apply thin silicon stacking methods using thin flexible substrate interconnect and in particular to investigate the behavior of the selected materials. Both commercial and in-house polyimide substrates, in the thickness range 25μm down to 3μm (each with 4μm of sputtered copper) were analyzed for appropriate electrical, chemical, and mechanical properties. The characterization highlighted that in flex of thickness below 10μm, a dramatic decrease in stiffness occurs and the polyimide wrinkles due to stresses generated by the copper sputtering process. An evaluation determined that specific steps, such as polymer support ring formation, could be employed to eliminate impact of wrinkling on the process of developing the 5mm cube prototypes.


2012 ◽  
Vol 11 (1) ◽  
pp. 127-133 ◽  
Author(s):  
H. T. Hsueh ◽  
S. J. Chang ◽  
W. Y. Weng ◽  
C. L. Hsu ◽  
T. J. Hsueh ◽  
...  

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