Metamorphism of the MacLean Lake and Central Metavolcanic belts, La Ronge domain, Trans-Hudson Orogen: pressure-temperature variations and tectonic implications

1998 ◽  
Vol 35 (8) ◽  
pp. 905-922 ◽  
Author(s):  
Haiming Yang ◽  
Kurt Kyser ◽  
Kevin Ansdell
Keyword(s):  
High Temperature ◽  
Thermal Gradient ◽  
Amphibolite Facies ◽  
Tectonic Zone ◽  
Thrust Sheet ◽  
Temperature Variations ◽  
High Thermal Gradient ◽  
Tectonic Implications ◽  
Peak Metamorphism ◽  
Peak Pressures

Metamorphic assemblages differ between the metasedimentary MacLean Lake belt and the adjacent Central Metavolcanic belt in the La Ronge domain, Trans-Hudson Orogen. The former consists of meta-arkoses, psammitic gneisses, metaconglomerates, and calc-silicate gneisses of upper amphibolite facies (600-740°C, 440-660 MPa) with local migmatization, whereas the latter is comprised mainly of metavolcanic and plutonic rocks, with minor metasedimentary schists of greenschist to lower amphibolite facies (480-630°C, 520-560 MPa). Petrographic evidence indicates that peak metamorphic conditions were reached towards the end of D1 deformation during which the Central Metavolcanic belt was thrust onto the MacLean Lake belt along the McLennan Lake tectonic zone, which separates the two belts. Peak metamorphic assemblages did not undergo retrograde alteration during D2 deformation, indicating that high temperature was maintained during D2 deformation. Differences in pressure (P) and temperature (T) between the northeastern and southwestern parts of the Central Metavolcanic belt may have resulted from tilting along strike after peak metamorphism. Peak temperatures increase gradually from the Central Metavolcanic belt to MacLean Lake belt across the McLennan Lake tectonic zone. Peak pressures in the two belts are similar, implying that the Central Metavolcanic belt thrust sheet was probably thin. The P-T data for the MacLean Lake belt indicate a relatively high thermal gradient (40-50°C/km), similar to that in the metasedimentary Kisseynew domain in the orogen.

Thermoelectric Properties of Directionally Solidified Bi2Te3 Alloys under High Thermal Gradient

2011 ◽  
Vol 197-198 ◽  
pp. 1109-1112 ◽  
Author(s):  
Song Ke Feng ◽  
Shuang Ming Li ◽  
Qing Yan Luo ◽  
Heng Zhi Fu
Keyword(s):  
Electrical Resistivity ◽  
High Temperature ◽  
Temperature Gradient ◽  
Seebeck Coefficient ◽  
Power Factor ◽  
Growth Rates ◽  
Thermal Gradient ◽  
Directionally Solidified ◽  
High Thermal Gradient ◽  
Bulk Alloys

Thermoelectric Bi2Te3bulk alloys were directionally solidified successfully at the pulling rate ranging from 1 μm/s to 50 μm/s under a high temperature gradient of 200 K/cm. Preferred crystal orientations of (0 1 5), (1 0 10) and (1 1 0) faces appeared at the pulling rate of 50 μm/s. In the Bi2Te3alloys directionally solidified at 5 μm/s, the maximum Seebeck coefficient of -253 μV/K was obtained and the maximum electrical resistivity of 2.26 mΩ•cm was measured at 300 K. Besides, the optimum Power Factor (PF) value reached 3.83×10-3W/K2m at 1 μm/s and the measured results show that the thermoelectric Bi2Te3 bulk alloys grown at low growth rates supply the large PF value at ambient temperate, while at high temperature, the alloy grown at 50 μm/s has a better PF value.

INVAR

Alloy Digest ◽  
1964 ◽  
Vol 13 (3) ◽  
Keyword(s):  
Corrosion Resistance ◽  
High Temperature ◽  
Physical Properties ◽  
Iron Alloy ◽  
Heat Treating ◽  
Temperature Variations ◽  
Nickel Iron ◽  
Dimensional Changes ◽  
Temperature Performance ◽  
Nickel Iron Alloy

Abstract INVAR is a 36% nickel-iron alloy having the lowest coefficient of expansion, recommended for applications requiring no dimensional changes with temperature variations. This datasheet provides information on composition, physical properties, hardness, elasticity, and tensile properties. It also includes information on low and high temperature performance, and corrosion resistance as well as forming, heat treating, machining, joining, and surface treatment. Filing Code: Fe-24. Producer or source: Carpenter.

High temperature studies of Urania in a thermal gradient

1969 ◽  
Vol 30 (1-2) ◽  
pp. 50-56 ◽  
Author(s):  
B.E. Fryxell ◽  
E.A. Aitken
Keyword(s):  
High Temperature ◽  
Thermal Gradient

Unsaturation Characterization of Polyolefins by NMR and Thermal Gradient NMR (TGNMR) with a High Temperature Cryoprobe

2012 ◽  
Vol 312 (1) ◽  
pp. 88-96 ◽  
Author(s):  
Zhe Zhou ◽  
Rongjuan Cong ◽  
Yiyong He ◽  
Manjiri Paradkar ◽  
Mehmet Demirors ◽  
...  
Keyword(s):  
High Temperature ◽  
Thermal Gradient

Experimental Study of Thermomigration in Lead-Free Nanoelectronics Solder Joints

2006 ◽  
Author(s):  
Mohd F. Abdulhamid ◽  
Cemal Basaran ◽  
Douglas C. Hopkins
Keyword(s):  
Experimental Study ◽  
Intermetallic Compound ◽  
Thermal Gradient ◽  
Solder Joints ◽  
Lead Free ◽  
Cold Side ◽  
High Thermal Gradient

The study of thermomigration on Sn-Ag-Cu solder sphere subjected to a high thermal gradient of 1100°C/cm is presented. After 286 hours, the hot end showed a thin and flat intermetallic compound (IMC) while the cold side showed a scallop-like Cu6Sn5 IMC. Small voids can be seen within the Cu6Sn5 IMC after 712 hours on the cold side, while the IMC on the opposite side showed no observable changes.

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