Silicon oxynitride from microwave plasma: fabrication and characterization

1989 ◽  
Vol 67 (4) ◽  
pp. 190-194 ◽  
Author(s):  
S. Blain ◽  
J. E. Klemberg-Sapieha ◽  
M. R. Wertheimer ◽  
S. C. Gujrathi

Plasma silicon nitride (P-SiN), oxynitride (P-SiON), and silicon dioxide (P-SiO2) films have been prepared from SiH4–NH3–N2O mixtures in a large volume microwave plasma (LMPR, 2.45 GHz) apparatus at TS = 280 °C. Film compositions, determined by X-ray photoelectron spectroscopy and nuclear elastic recoil detection analysis, reveal about 15 at.% hydrogen in P-SiN, <2% in P-SiO2, and intermediate values in P-SiON. Various physicochemical and electrical properties (density, refractive index, intrinsic stress, permittivity, and conductivity) vary systematically with film composition, O/(O + N), determined from the above analyses. The present microwave plasma enhanced chemical vapour deposition (PECVD) films compare favorably with the best PECVD and low pressure chemical vapour deposition (LPCVD) materials reported in the literature.

2007 ◽  
Vol 336-338 ◽  
pp. 1776-1779
Author(s):  
Chong Mu Lee ◽  
Kyung Ha Kim

Diamond-like carbon (DLC) films have been deposited by radio frequency plasma enhanced chemical vapour deposition (rf-PECVD) with different Ar-CH4 mixtures. Nanocrystalline diamond films have been deposited by microwave plasma-enhanced chemical vapour deposition (MPCVD), using Ar-H2-CH4 mixtures. X-ray photoelectron spectroscopy (XPS) and nanotribological investigation (by scanning force microscopy) have been used to compare the mechanical properties and structures of these films. Highly orientated and non-orientated microcrystalline diamond films and MPCVD-produced amorphous carbon have also been studied by way of comparison. The diamond films exhibit a linear relationship between roughness and the coefficient of friction. The DLC and amorphous carbon have higher friction coefficients than the best performing diamond film, but may more easily be deposited as smooth coating. Possible applications for these various carbon-based films include microelectromechanical components, for which smooth, hard coatings are required.


1985 ◽  
Vol 48 ◽  
Author(s):  
F. H. P. M. Habraken ◽  
A. E. T. Kuiper

ABSTRACTSilicon oxynitride films with various O/N concentration ratios were deposited in a Low Pressure Chemical Vapour Deposition process from SiH2Cl2, N2O and NH3 or ND3. The resulting films were analysed with respect to their chemical compositions using a number of high energy ion beam methods. The results of the analysis are related to the growth kinetics. It is suggested that the SiH2Cl2 decomposes more difficult on growth surfaces which contain more oxygen. The effect is attributed to the larger electronegativity of oxygen compared to nitrogen.


1999 ◽  
Vol 09 (PR8) ◽  
pp. Pr8-395-Pr8-402 ◽  
Author(s):  
B. Armas ◽  
M. de Icaza Herrera ◽  
C. Combescure ◽  
F. Sibieude ◽  
D. Thenegal

2001 ◽  
Vol 231 (1-2) ◽  
pp. 242-247 ◽  
Author(s):  
K. Shalini ◽  
Anil U. Mane ◽  
S.A. Shivashankar ◽  
M. Rajeswari ◽  
S. Choopun

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