LASER ULTRASONIC INSPECTION SYSTEM WITH A 3D SURFACE PROFILOMETRY TO DETECT SURFACE CRACKS

2008 ◽  
Vol 22 (11) ◽  
pp. 1051-1056 ◽  
Author(s):  
SEUNG-KYU PARK ◽  
SUNG-HOON BAIK ◽  
HYUNG-KI CHA ◽  
YONG-MOO CHEONG ◽  
WOON-IL KIM ◽  
...  

We have developed a nondestructive surface-crack detection system by using laser ultrasound and optical 3D surface profilometry. The system can robustly acquire crack information by using the laser ultrasonic analysis data with visual surface profiling data where both data are produced by the same line-shaped pulse laser beam. By the help of the visual 3D shape data for a surface crack, this ultrasonic inspection system can provide reliable surface crack information. In this paper, the hardware configuration of the combined nondestructive laser inspection system to detect surface cracks will be described. Also, the experimental results to detect multi surface cracks by using the developed system will be presented.

2014 ◽  
Vol 941-944 ◽  
pp. 1922-1927
Author(s):  
Zhen Ya Chen ◽  
Xing Quan Shen ◽  
Zhi Jie Xin

The mechanism of surface cracks penetration testing are studied, as well as, the cracks’ width and depth of penetration testing formulas are given in the paper, which provide the basis for TC4 titanium alloy structure's penetration testing. The process of fluorescent penetrating testing is analyzed, and the result that detection experiments of TC4 titanium alloy structure's surface crack indicating the changes in the curvature is larger the structure is easier to produce surface cracks. The reason that the surface cracks of structure of TC4 titanium alloy is theoretical analyzed and experimental studied. In process of machining TC4 titanium, cutting parameters are important factors causing stress concentration, particularly, the larger cutting depth will generate surface cracks.


2021 ◽  
Vol 18 (4) ◽  
pp. 183-189
Author(s):  
Vishnu V. B. Reddy ◽  
Jaimal Williamson ◽  
Suresh K. Sitaraman

Abstract Laser ultrasonic inspection is a novel, noncontact, and nondestructive technique to evaluate the quality of solder interconnections in microelectronic packages. In this technique, identification of defects or failures in solder interconnections is performed by comparing the out-of-plane displacement signals, which are produced from the propagation of ultrasonic waves, from a known good reference sample and sample under test. The laboratory-scale dual-fiber array laser ultrasonic inspection system has successfully demonstrated identifying the defects and failures in the solder interconnections in advanced microelectronic packages such as chip-scale packages, plastic ball grid array packages, and flip-chip ball grid array packages. However, the success of any metrology system depends upon precise and accurate data to be useful in the microelectronic industry. This paper has demonstrated the measurement capability of the dual-fiber array laser ultrasonic inspection system using gage repeatability and reproducibility analysis. Industrial flip-chip ball grid array packages have been used for conducting experiments using the laser ultrasonic inspection system and the inspection data are used to perform repeatability and reproducibility analysis. Gage repeatability and reproducibility studies have also been used to choose a known good reference sample for comparing the samples under test.


2012 ◽  
Vol 532-533 ◽  
pp. 369-373
Author(s):  
Lie Xiang Xia ◽  
Yan Zhao ◽  
Yong Zhong Ma ◽  
Xiao Ning An

Currently, laser ultrasonic nondestructive testing is the best application prospect of nondestructive testing methods. This paper expounds the mechanism and the qualitative analysis of the common defects of the laser ultrasonic inspection and introduces the application of matching pursuit algorithm guided wave testing technology in signal processing. This paper focuses on the laser ultrasonic detection system and analysis of the detected data using the finite element method.


2019 ◽  
Author(s):  
Peilong Yuan ◽  
Lisha Huo ◽  
Tommaso Seresini ◽  
Yang Liu ◽  
Sevilia Sunetchiieva ◽  
...  

2012 ◽  
Vol 217-219 ◽  
pp. 2336-2340
Author(s):  
Chun Hua Guo

The surface of PC beam has been covered with cracks and flaws, it causes deficiencies to the safety of system. The inspection system includes inspection equipment and data off-line management. First discuss the theory of data acquisition. Then discuss the data off-line management, which include denoising, enhancement and segmentation. The denoising is based on anisotropic diffusion, which can preserve edge region of higher gradient, and smooth region of lower gradient. The enhancement is according to the characteristics of NSCT different domain, different operators are used in different subbands. The crack segmentation is based on Otsu method, which is according the convexity and concavity of histogram of detected image. The result shows that they can get good performance.


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