Determination of Measurement Limit for Open Solder Bumps on a Flip-Chip Package Using a Laser Ultrasonic Inspection System

2006 ◽  
Vol 29 (1) ◽  
pp. 178-185 ◽  
Author(s):  
D.S. Erdahl ◽  
I.C. Ume
Keyword(s):  
Flip Chip ◽  
Ultrasonic Inspection ◽  
Inspection System ◽  
Laser Ultrasonic ◽  
Measurement Limit ◽  
Solder Bumps

scholarly journals Measurement Capability of Laser Ultrasonic Inspection System for Evaluation of Ball-Grid Array Package Solder Balls

2021 ◽  
Vol 18 (4) ◽  
pp. 183-189
Author(s):  
Vishnu V. B. Reddy ◽  
Jaimal Williamson ◽  
Suresh K. Sitaraman
Keyword(s):  
Flip Chip ◽  
Ultrasonic Inspection ◽  
Reference Sample ◽  
Ball Grid Array ◽  
Inspection System ◽  
Laser Ultrasonic ◽  
Fiber Array ◽  
Measurement Capability ◽  
Repeatability And Reproducibility ◽  
Ball Grid Array Packages

Abstract Laser ultrasonic inspection is a novel, noncontact, and nondestructive technique to evaluate the quality of solder interconnections in microelectronic packages. In this technique, identification of defects or failures in solder interconnections is performed by comparing the out-of-plane displacement signals, which are produced from the propagation of ultrasonic waves, from a known good reference sample and sample under test. The laboratory-scale dual-fiber array laser ultrasonic inspection system has successfully demonstrated identifying the defects and failures in the solder interconnections in advanced microelectronic packages such as chip-scale packages, plastic ball grid array packages, and flip-chip ball grid array packages. However, the success of any metrology system depends upon precise and accurate data to be useful in the microelectronic industry. This paper has demonstrated the measurement capability of the dual-fiber array laser ultrasonic inspection system using gage repeatability and reproducibility analysis. Industrial flip-chip ball grid array packages have been used for conducting experiments using the laser ultrasonic inspection system and the inspection data are used to perform repeatability and reproducibility analysis. Gage repeatability and reproducibility studies have also been used to choose a known good reference sample for comparing the samples under test.

Laser Ultrasonic Inspection of Solder Bumps in Flip Chip Packages Using Virtual Package Device as Reference

2010 ◽  
Author(s):  
I. Charles Ume ◽  
Jie Gong ◽  
Razid Ahmad ◽  
Abel Valdes
Keyword(s):  
Time Domain ◽  
Flip Chip ◽  
Electronic Device ◽  
Ultrasonic Inspection ◽  
Reference Method ◽  
Ultrasonic Waves ◽  
Quality Analysis ◽  
Inspection System ◽  
Solder Bumps

Flip chip package is widely used in the electronic device manufacturing industry. The top side of a flip chip device is manufactured with solder bumps. The device is then flipped on its top so that the solder bumps can be bonded to a substrate, forming the mechanical and electrical connection between the device and substrate. As a result, the solder bumps are sandwiched between the silicon die and the substrate, making them no longer visible for usual inspection. A novel solder joint inspection system capable of evaluating the quality of the hidden solder bumps on a flip chip package has been developed using laser ultrasound techniques. The system pulses a laser onto the top surface of a chip package to generate ultrasonic waves in the package and excite structural vibrations which can then be measured using an interferometer. Since defective solder bumps cause changes in the transient vibration response of a tested sample, quality of the tested sample can be assessed by correlating its vibration responses to that of a known good device. A limitation of this implementation is the necessity of a known-good reference chip package, which typically involves expensive testing using alternate methods. In this paper, the development of a method capable of generating a virtual reference chip package is presented. This method, called Hybrid Reference Method, uses a statistical approach to find which packages in a sample set are most similar and then averages their time domain signals to generate a virtual chip package, known as the Hybrid Reference Package. The signals associated with Hybrid Reference Package are then correlated with the time domain signals obtained from the packages under inspection to obtain a quality signature. Finally, defective and non-defective chip packages are separated by estimating a beta distribution that fits the quality signature histogram of the inspected packages and then determining a cutoff threshold for an acceptable quality signature. This method was applied to two types of flip chip packages where no pre-established known-good reference package was available. The results of this quality analysis were validated by comparison with electrical test and X-ray results.

scholarly journals Non-Contact Inspection of Railhead via Laser-Generated Rayleigh Waves and an Enhanced Matching Pursuit to Assist Detection of Surface and Subsurface Defects

Sensors ◽  
2021 ◽  
Vol 21 (9) ◽  
pp. 2994
Author(s):  
Imran Ghafoor ◽  
Peter W. Tse ◽  
Javad Rostami ◽  
Kim-Ming Ng
Keyword(s):  
Rayleigh Wave ◽  
Rayleigh Waves ◽  
Matching Pursuit ◽  
Ultrasonic Inspection ◽  
Research Work ◽  
Fem Simulation ◽  
Noise Removal ◽  
Inspection System ◽  
Laser Ultrasonic ◽  
Ultrasonic Technology

Laser ultrasonic technology can provide a non-contact, reliable and efficient inspection of train rails. However, the laser-generated signals measured at the railhead are usually contaminated with a high level of noise and unwanted wave components that complicate the identification of defect echoes in the signal. This study explores the possibility of combining laser ultrasonic technology (LUT) and an enhanced matching pursuit (MP) to achieve a fully non-contact inspection of the rail track. A completely non-contact laser-based inspection system was used to generate and sense Rayleigh waves to detect artificial surface horizontal, surface edge, subsurface horizontal and subsurface vertical defects created at railheads of different dimensions. MP was enhanced by developing two novel dictionaries, which include a finite element method (FEM) simulation dictionary and an experimental dictionary. The enhanced MP was used to analyze the experimentally obtained laser-generated Rayleigh wave signals. The results show that the enhanced MP is highly effective in detecting defects by suppressing noise, and, further, it could also overcome the deficiency in the low repeatability of the laser-generated signals. The comparative analysis of MP with both the FEM simulation and experimental dictionaries shows that the enhanced MP with the FEM simulation dictionary is highly efficient in both noise removal and defect detection from the experimental signals captured by a laser-generated ultrasonic inspection system. The major novelty contributed by this research work is the enhanced MP method with the developments of, first, an FEM simulation dictionary and, second, an experimental dictionary that is especially suited for Rayleigh wave signals. Third, the enhanced MP dictionaries are created to process the Rayleigh wave signals generated by laser excitation and received using a 3D laser scanner. Fourth, we introduce a pioneer application of such laser-generated Rayleigh waves for inspecting surface and subsurface detects occurring in train rails.

Automated Laser Ultrasonic Inspection of Hybrid Laser Arc Welding for Pipeline Construction

2010 ◽  
Author(s):  
Marvin B. Klein ◽  
Homayoon Ansari
Keyword(s):  
Arc Welding ◽  
Ultrasonic Testing ◽  
Technology Development ◽  
Ultrasonic Inspection ◽  
Inspection System ◽  
Laser Ultrasonic ◽  
Hybrid Laser Arc Welding ◽  
Pipeline Construction ◽  
Weld Inspection ◽  
Pipeline Welding

Hybrid laser arc welding (HLAW) is a technology that promises to increase the efficiency of welded fabrication. By incorporating automation, and integrating an automated inspection system, HLAW can produce high quality welds at higher production rates and lower costs compared to even the most advanced pipeline welding system that is in use today. As the HLAW technique is developed and implemented for pipeline construction, it is important to develop an associated automated technique for weld inspection. We have applied automated laser ultrasonic testing (ALUT) to the important requirement of the in-line monitoring of new HLAW welds in the field. Laser ultrasonic testing (LUT) offers the advantage of true in-process measurement, providing immediate information on weld integrity. In this paper, we will describe our efforts to apply LUT to pipeline girth weld inspection. The technology development process and the integration into an HLAW system will be described.

LASER ULTRASONIC INSPECTION SYSTEM WITH A 3D SURFACE PROFILOMETRY TO DETECT SURFACE CRACKS

2008 ◽  
Vol 22 (11) ◽  
pp. 1051-1056 ◽  
Author(s):  
SEUNG-KYU PARK ◽  
SUNG-HOON BAIK ◽  
HYUNG-KI CHA ◽  
YONG-MOO CHEONG ◽  
WOON-IL KIM ◽  
...  
Keyword(s):  
Surface Crack ◽  
Crack Detection ◽  
Detection System ◽  
Ultrasonic Inspection ◽  
Analysis Data ◽  
Inspection System ◽  
Surface Cracks ◽  
Laser Ultrasonic ◽  
Surface Profilometry ◽  
3D Surface

We have developed a nondestructive surface-crack detection system by using laser ultrasound and optical 3D surface profilometry. The system can robustly acquire crack information by using the laser ultrasonic analysis data with visual surface profiling data where both data are produced by the same line-shaped pulse laser beam. By the help of the visual 3D shape data for a surface crack, this ultrasonic inspection system can provide reliable surface crack information. In this paper, the hardware configuration of the combined nondestructive laser inspection system to detect surface cracks will be described. Also, the experimental results to detect multi surface cracks by using the developed system will be presented.

Quality Inspection of Flip Chip Solder Bumps Using Integrated Analytical, Numerical, and Experimental Modal Analyses

2008 ◽  
Vol 130 (3) ◽  
Author(s):  
Jin Yang ◽  
I. Charles Ume
Keyword(s):  
Modal Analysis ◽  
Manufacturing Industry ◽  
Flip Chip ◽  
Solder Bump ◽  
Dynamic Responses ◽  
Mode Shapes ◽  
Inspection System ◽  
Solder Bumps ◽  
Out Of Plane ◽  
Plane Displacement

Solder bump inspection of surface mount packages has been a crucial process in the electronics manufacturing industry. A solder bump inspection system has been developed using laser ultrasound and interferometric techniques. In this research, modal analysis is important to correlate the defects with dynamic responses of packaged electronic devices under pulsed laser loading. The effect of solder bump defects on the mode frequencies and mode shapes is reported in this paper. The objective is to develop a modal analysis approach, which integrates analytical, numerical, and experimental methods. In particular, this paper discusses the analytical modeling, numerical modeling, and transient out-of-plane displacement measurements for a 6.35×6.35×0.6mm3 PB18 flip chip mounted on a FR4 board.

Correlation Studies Between Laser Ultrasonic Inspection Data and Finite-element Modeling Results in Evaluation of Solder Joint Quality in Microelectronic Packages

2021 ◽  
Author(s):  
Vishnu Vardhan Busi Reddy ◽  
Saurabh Gupta ◽  
Jaimal Williamson ◽  
Suresh Sitaraman
Keyword(s):  
Finite Element ◽  
Flip Chip ◽  
Ultrasonic Inspection ◽  
Ball Grid Array ◽  
Reliability Testing ◽  
Thermal Cycles ◽  
Laser Ultrasonic ◽  
Correlation Studies ◽  
Microelectronic Packages ◽  
Ball Grid Array Packages

Abstract Laser Ultrasonic Inspection (LUI) is a non-destructive and non-contact technique to evaluate the quality of solder ball interconnections in area-array microelectronic packages. Dual-Fiber Array Laser Ultrasonic Inspection System was demonstrated identifying defects and failures in chip-scale packages, ball grid array packages, and flip-chip ball grid array packages. The location and severity of the defects and failures in packages have been identified accurately using this system. Further, it is important to establish the correlation between LUI results and the severity of the failures for failure mode analysis, which will enable us to eliminate the need for destructive testing and allow the study of failure evolution in a given sample under continued reliability testing. This paper discusses correlation studies between experimental LUI results and finite-element simulation results from the flip-chip ball grid array packages subjected to thermal cycling reliability testing. The correlation equations will help in predicting the severity of the failures at a given number of thermal cycles based on LUI results. Furthermore, the life of the microelectronic packages can be predicted accurately from LUI results at a fewer number of thermal cycles.

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