Dynamic Strain Conductivity of Compensated Silicon
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In this paper the strain thermal Hall effect has been investigated in initial n-Si(P) and strongly compensated n-Si(Ni) samples of different compensation degree, which have been subject to uniform hydrostatic compression (UHC) under a pulse pressure regime ranging from 0 to 7×108 Pa. An experimental investigation of the strain thermal effect in the n-Si(Ni) sample leads to an essential strain conductivity increase, which is largely controlled by density variations of majority carriers.
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2006 ◽
Vol 23
(8)
◽
pp. S259-S266
◽
2020 ◽
Vol 32
(10)
◽
pp. 04020296
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