ENHANCEMENT OF THERMOELECTRIC POWER FACTOR BY A SILICON SPACER IN MODULATION-DOPED Si-HMS-Si
Keyword(s):
The introduction of an un-doped silicon layer (spacer) enhances significantly the thermoelectric power factor in modulation-doped Si(Al)-MnSi1.7-Si(Al) sandwich structure. This un-doped silicon layer is inserted between the MnSi1.7 (HMS) and Al -doped silicon layers. With a proper spacer thickness, the electrical resistivity decreases sharply and is weakly dependent on temperature from 300 K to 683 K. As a result, the thermoelectric power factor can reach 0.973 × 10-3 W/m-K2 at 683 K, which is about ten times larger than that of an ordinary MnSi1.7 film without modulation doping.
2012 ◽
Vol 209
(7)
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pp. 1307-1312
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2015 ◽
Vol 29
(27)
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pp. 1550189
2011 ◽
Vol 25
(22)
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pp. 1829-1838
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2014 ◽
Vol 787
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pp. 210-214
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2016 ◽
Vol 15
(1)
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pp. 16-26
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