Three-Dimensional Integration of Fully Depleted Silicon-on-Insulator Transistor Substrates for CMOS Image Sensors Using Au/SiO2 Hybrid Bonding and XeF2 Etching
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2016 ◽
Vol 184
(1-2)
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pp. 217-224
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2009 ◽
Vol 56
(11)
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pp. 2403-2413
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