(Invited) Development of Novel Three-Dimensional Structuring of Integrated Circuits by Using Low Temperature Direct Bonding for CMOS Image Sensors

2014 ◽  
Keyword(s):  
Low Temperature ◽  
Integrated Circuits ◽  
Three Dimensional ◽  
Image Sensors ◽  
Cmos Image Sensors

Low Temperature Boron Activation in Amorphous Germanium for Three Dimensional Integrated Circuits (3D-ICs) using Ni-induced Crystallization

2019 ◽  
Vol 16 (10) ◽  
pp. 909-916
Author(s):  
Jin-Hong Park ◽  
Munehiro Tada ◽  
Hyun-Yong Yu ◽  
Duygu Kuzum ◽  
Yeul Na ◽  
...  
Keyword(s):  
Low Temperature ◽  
Integrated Circuits ◽  
Three Dimensional ◽  
Amorphous Germanium ◽  
3D Ics ◽  
Induced Crystallization

High-Density Large-Area-Array Interconnects Formed by Low-Temperature Cu/Sn–Cu Bonding for Three-Dimensional Integrated Circuits

2012 ◽  
Vol 59 (7) ◽  
pp. 1941-1947 ◽  
Author(s):  
M. R. Lueck ◽  
J. D. Reed ◽  
C. W. Gregory ◽  
A. Huffman ◽  
J. M. Lannon ◽  
...  
Keyword(s):  
Low Temperature ◽  
Integrated Circuits ◽  
Three Dimensional ◽  
High Density ◽  
Large Area ◽  
Area Array ◽  
Cu Bonding

Investigation of a Sequential Three-Dimensional Process for Back-Illuminated CMOS Image Sensors With Miniaturized Pixels

2009 ◽  
Vol 56 (11) ◽  
pp. 2403-2413 ◽  
Author(s):  
Perceval Coudrain ◽  
Pierre Magnan ◽  
Perrine Batude ◽  
Xavier Gagnard ◽  
CÉdric Leyris ◽  
...  
Keyword(s):  
Three Dimensional ◽  
Image Sensors ◽  
Cmos Image Sensors ◽  
Back Illuminated
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