Electroless Copper Plating Using ZnO Thin Film Coated on a Glass Substrate

1994 ◽  
Vol 141 (5) ◽  
pp. L56-L58 ◽  
Author(s):  
Hajime Yoshiki ◽  
Valery Alexandruk ◽  
Kazuhito Hashimoto ◽  
Akira Fujishima
Keyword(s):  
Thin Film ◽  
Glass Substrate ◽  
Zno Thin Film ◽  
Copper Plating ◽  
Electroless Copper Plating ◽  
Electroless Copper

ChemInform Abstract: Electroless Copper Plating Using ZnO Thin Film Coated on a Glass Substrate.

ChemInform ◽  
2010 ◽  
Vol 25 (35) ◽  
pp. no-no
Author(s):  
H. YOSHIKI ◽  
V. ALEXANDRUK ◽  
K. HASHIMOTO ◽  
A. FUJISHIMA
Keyword(s):  
Thin Film ◽  
Glass Substrate ◽  
Zno Thin Film ◽  
Copper Plating ◽  
Electroless Copper Plating ◽  
Electroless Copper

Electroless copper plating on a glass substrate coated with ZnO film under UV illumination

1999 ◽  
Vol 462 (2) ◽  
pp. 259-263 ◽  
Author(s):  
Y.A. Yang ◽  
Y.B. Wei ◽  
B.H. Loo ◽  
J.N. Yao
Keyword(s):  
Glass Substrate ◽  
Copper Plating ◽  
Zno Film ◽  
Electroless Copper Plating ◽  
Uv Illumination ◽  
Electroless Copper

Application Of Electroless Copper Plating Technology For Thin Film Laminated Multilayer Wiring Board

1996 ◽  
Vol 445 ◽  
Author(s):  
T. Itabashi ◽  
H. Akahoshi ◽  
A. Takahashi ◽  
M. Suzuki ◽  
M. Maeda
Keyword(s):  
Thin Film ◽  
High Heat ◽  
Fabrication Process ◽  
Copper Metallization ◽  
Copper Plating ◽  
Electroless Copper Plating ◽  
Plating Method ◽  
Electroless Copper ◽  
Via Holes ◽  
Wiring Board

AbstractA thin film laminated high density multilayer wiring board was developed using electroless copper plating technology. The basic steps in the fabrication process are: laminating the high heat resistant polymer film, forming via holes by plasma etching and filling them by electroless copper metallization. The 25 μm diameter via holes can be completely filled with copper using the selective electroless plating method. This paper describes the fabrication process, focusing particularly on electroless copper plating.

scholarly journals Formation of Palladium Catalyst Containing Polysilsesquioxane Thin Film for Electroless Copper Plating

2015 ◽  
Vol 18 (7) ◽  
pp. 479-485
Author(s):  
Sayuri Teshima ◽  
Kouichiro Murahashi ◽  
Kuniaki Otsuka ◽  
Koji Mitamura ◽  
Seiji Watase ◽  
...  
Keyword(s):  
Thin Film ◽  
Palladium Catalyst ◽  
Copper Plating ◽  
Electroless Copper Plating ◽  
Electroless Copper

Electroless copper plating on nano-silver activated glass substrate: A single-step activation

2017 ◽  
Vol 319 ◽  
pp. 260-266 ◽  
Author(s):  
Attaphon Kaewvilai ◽  
Romchalee Tanathakorn ◽  
Apirat Laobuthee ◽  
Watcharee Rattanasakulthong ◽  
Aphichart Rodchanarowan
Keyword(s):  
Glass Substrate ◽  
Single Step ◽  
Copper Plating ◽  
Electroless Copper Plating ◽  
Nano Silver ◽  
Electroless Copper

Palladium thin film deposition on polyimide by CW Ar+ laser radiation for electroless copper plating

2001 ◽  
Vol 384 (2) ◽  
pp. 185-188 ◽  
Author(s):  
K. Kordás ◽  
S. Leppävuori ◽  
A. Uusimäki ◽  
Thomas F. George ◽  
L. Nánai ◽  
...  
Keyword(s):  
Thin Film ◽  
Laser Radiation ◽  
Thin Film Deposition ◽  
Film Deposition ◽  
Copper Plating ◽  
Electroless Copper Plating ◽  
Electroless Copper

ChemInform Abstract: Electroless Copper Plating on a Glass Substrate Coated with ZnO Film under UV Illumination.

ChemInform ◽  
2010 ◽  
Vol 30 (22) ◽  
pp. no-no
Author(s):  
Y. A. Yang ◽  
Y. B. Wei ◽  
B. H. Loo ◽  
J. N. Yao
Keyword(s):  
Glass Substrate ◽  
Copper Plating ◽  
Zno Film ◽  
Electroless Copper Plating ◽  
Uv Illumination ◽  
Electroless Copper

Electroless Copper Plating of Titanium Condenser Tubes for Biofouling Control

2016 ◽  
Vol 6 (1) ◽  
pp. 65-73
Author(s):  
Balakrishnan Anandkumar ◽  
Rani P. George ◽  
Alagarsamy Karthik ◽  
Dasnamoorthy Ramachandran ◽  
Uthandi Kamachi Mudali
Keyword(s):  
Copper Plating ◽  
Electroless Copper Plating ◽  
Electroless Copper ◽  
Biofouling Control

Novel fabrication of low-cost Ti–Cu alloy by electroless copper plating and vacuum sintering

Vacuum ◽  
2021 ◽  
pp. 110330
Author(s):  
Chunming Wang ◽  
Luming Zeng ◽  
Wucheng Ding ◽  
Tongxiang Liang
Keyword(s):  
Low Cost ◽  
Copper Plating ◽  
Vacuum Sintering ◽  
Electroless Copper Plating ◽  
Cu Alloy ◽  
Electroless Copper

Air-plasma surface modification of epoxy resin substrate to improve electroless copper plating of printed circuit board

Vacuum ◽  
2019 ◽  
Vol 170 ◽  
pp. 108967 ◽  
Author(s):  
Yan Hong ◽  
Xiangqing You ◽  
Yi Zeng ◽  
Yuanming Chen ◽  
Yunzhong Huang ◽  
...  
Keyword(s):  
Surface Modification ◽  
Epoxy Resin ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Copper Plating ◽  
Air Plasma ◽  
Electroless Copper Plating ◽  
Plasma Surface ◽  
Printed Circuit ◽  
Electroless Copper
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