Electroless copper plating on a glass substrate coated with ZnO film under UV illumination

Uv Illumination ◽

ChemInform Abstract: Electroless Copper Plating on a Glass Substrate Coated with ZnO Film under UV Illumination.

ChemInform ◽

10.1002/chin.199922245 ◽

2010 ◽

Vol 30 (22) ◽

pp. no-no

Author(s):

Y. A. Yang ◽

Y. B. Wei ◽

B. H. Loo ◽

J. N. Yao

Keyword(s):

Glass Substrate ◽

Copper Plating ◽

Zno Film ◽

Uv Illumination ◽

ChemInform Abstract: Electroless Copper Plating Using ZnO Thin Film Coated on a Glass Substrate.

ChemInform ◽

10.1002/chin.199435297 ◽

2010 ◽

Vol 25 (35) ◽

pp. no-no

Author(s):

H. YOSHIKI ◽

V. ALEXANDRUK ◽

K. HASHIMOTO ◽

A. FUJISHIMA

Keyword(s):

Thin Film ◽

Glass Substrate ◽

Zno Thin Film ◽

Copper Plating ◽

Electroless copper plating on nano-silver activated glass substrate: A single-step activation

Surface and Coatings Technology ◽

10.1016/j.surfcoat.2017.04.018 ◽

2017 ◽

Vol 319 ◽

pp. 260-266 ◽

Cited By ~ 18

Author(s):

Attaphon Kaewvilai ◽

Romchalee Tanathakorn ◽

Apirat Laobuthee ◽

Watcharee Rattanasakulthong ◽

Aphichart Rodchanarowan

Keyword(s):

Glass Substrate ◽

Single Step ◽

Copper Plating ◽

Nano Silver ◽

Electroless Copper Plating Using ZnO Thin Film Coated on a Glass Substrate

Journal of The Electrochemical Society ◽

10.1149/1.2054935 ◽

1994 ◽

Vol 141 (5) ◽

pp. L56-L58 ◽

Cited By ~ 25

Author(s):

Hajime Yoshiki ◽

Valery Alexandruk ◽

Kazuhito Hashimoto ◽

Akira Fujishima

Keyword(s):

Thin Film ◽

Glass Substrate ◽

Zno Thin Film ◽

Copper Plating ◽

Innovations in Corrosion and Materials Science (Formerly Recent Patents on Corrosion Science) ◽

Electroless Copper Plating of Titanium Condenser Tubes for Biofouling Control

10.2174/235209490601160428152630 ◽

2016 ◽

Vol 6 (1) ◽

pp. 65-73

Author(s):

Balakrishnan Anandkumar ◽

Rani P. George ◽

Alagarsamy Karthik ◽

Dasnamoorthy Ramachandran ◽

Uthandi Kamachi Mudali

Keyword(s):

Copper Plating ◽

Electroless Copper ◽

Biofouling Control

Novel fabrication of low-cost Ti–Cu alloy by electroless copper plating and vacuum sintering

Vacuum ◽

10.1016/j.vacuum.2021.110330 ◽

2021 ◽

pp. 110330

Author(s):

Chunming Wang ◽

Luming Zeng ◽

Wucheng Ding ◽

Tongxiang Liang

Keyword(s):

Low Cost ◽

Copper Plating ◽

Vacuum Sintering ◽

Cu Alloy ◽

Air-plasma surface modification of epoxy resin substrate to improve electroless copper plating of printed circuit board

Vacuum ◽

10.1016/j.vacuum.2019.108967 ◽

2019 ◽

Vol 170 ◽

pp. 108967 ◽

Cited By ~ 2

Author(s):

Yan Hong ◽

Xiangqing You ◽

Yi Zeng ◽

Yuanming Chen ◽

Yunzhong Huang ◽

...

Keyword(s):

Surface Modification ◽

Epoxy Resin ◽

Printed Circuit Board ◽

Circuit Board ◽

Copper Plating ◽

Air Plasma ◽

Plasma Surface ◽

Printed Circuit ◽

Selective Electroless Copper Plating on Poly(ethylene terephthalate) Surfaces by Microcontact Printing

Journal of The Electrochemical Society ◽

10.1149/1.3306136 ◽

2010 ◽

Vol 157 (4) ◽

pp. D222 ◽

Cited By ~ 12

Author(s):

Shih-Chun Huang ◽

Ting-Chieh Tsao ◽

Li-Jen Chen

Keyword(s):

Ethylene Terephthalate ◽

Microcontact Printing ◽

Copper Plating ◽

Poly Ethylene Terephthalate ◽

Electroless Copper ◽

Poly Ethylene

Electroless Copper Plating Using Glyoxylic Acid as a Reducing Agent.

Journal of The Surface Finishing Society of Japan ◽

10.4139/sfj.42.913 ◽

1991 ◽

Vol 42 (9) ◽

pp. 913-917 ◽

Cited By ~ 4

Author(s):

Hideo HONMA ◽

Motoaki KOMATSU ◽

Tomoyuki FUJINAMI

Keyword(s):

Glyoxylic Acid ◽

Reducing Agent ◽

Copper Plating ◽

New and clean strategy for the determination of Cu2+ in electroless copper plating baths

Spectrochimica Acta Part A Molecular and Biomolecular Spectroscopy ◽

10.1016/j.saa.2006.10.057 ◽

2007 ◽

Vol 68 (1) ◽

pp. 150-155 ◽

Cited By ~ 10

Author(s):

Rutao Liu ◽

Wansong Zong ◽

Canzhu Gao ◽

Zhenxing Chi ◽

Lijun Zhang

Keyword(s):

Copper Plating ◽