Nanostructure and Morphology of Electrodeposited Copper Metallization during Room-Temperature Aging

The Sn whisker growth in Cu(top)-Sn(bottom) bilayer system upon room temperature aging was investigated by scanning electron microscope and X-ray diffraction techniques. The experimental observations indicate that the Sn whisker growth on the Cu surface in Cu-Sn bilayer system is different from that on the Sn surface in Sn-Cu bilayer system. When the Sn sublayer thickness is less than 0.5μm, the Sn whisker growth can take place in Cu-Sn system but not in Sn-Cu system. An explanation for Sn whisker growth in Cu-Sn bilayer system is given.

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Thermal cycling induced room temperature aging effect in Ni-rich NiTi shape memory alloy

Scripta Materialia ◽

10.1016/j.scriptamat.2015.11.007 ◽

2016 ◽

Vol 113 ◽

pp. 206-208 ◽

Cited By ~ 24

Author(s):

Xiebin Wang ◽

Jan Van Humbeeck ◽

Bert Verlinden ◽

Sergey Kustov

Keyword(s):

Shape Memory Alloy ◽

Thermal Cycling ◽

Shape Memory ◽

Room Temperature ◽

Aging Effect ◽

Niti Shape Memory Alloy ◽

Room Temperature Aging ◽

Temperature Aging

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On the room-temperature aging effects in YBa 2 Cu 3 O 6+δ

Physica C Superconductivity ◽

10.1016/j.physc.2015.05.008 ◽

2015 ◽

Vol 515 ◽

pp. 54-61 ◽

Cited By ~ 6

Author(s):

А.V. Fetisov ◽

G.А. Kozhina ◽

S.Kh. Estemirova ◽

V.Ya. Mitrofanov

Keyword(s):

Room Temperature ◽

Aging Effects ◽

Room Temperature Aging ◽

Temperature Aging

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Atomic Force Microscope Manifestation of Heat-Resistant Polymer Thermal Stability

Advanced Materials Research ◽

10.4028/www.scientific.net/amr.1073-1076.2267 ◽

2014 ◽

Vol 1073-1076 ◽

pp. 2267-2271

Author(s):

Tao Ping Chen ◽

Biao Qiu ◽

Na Wang ◽

Ru He

Keyword(s):

Thermal Stability ◽

Atomic Force Microscope ◽

Polymer Solution ◽

Room Temperature ◽

Branch Length ◽

Status Change ◽

Heat Resistant ◽

Atomic Force ◽

Room Temperature Aging ◽

Temperature Aging

Aimed at BH heat-resistant polymer, 4500mg/L solution is compounded by oilfield sewage, and then diluted into 1500mg/L solution by oilfield sewage again under room temperature, aging in the constant temperature box of 95°C finally. Test slides are made of different aging time BH heat-resistance polymer solution, whose thermal stability is manifested by atomic force microscope. Results show the aggregation degree of BH heat-resistant polymer solution are different after aging for 30d, 60d, 90d under 95°C. They gather largely before aging, are into a loose branch distribution. After aging for 30d, their aggregation degree declines, branch length becomes shorter. After aging for 60d, their aggregation status change greatly, are into "╫╫" shape comb distribution. After aging for 90d, they gather into about 10μm in diameter short fat wafer, and are not easy to expand.

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