scholarly journals The Importance of Wafer Edge in Wafer Bonding Technologies and related Wafer Edge Engineering Methods

2021 ◽  
Author(s):  
Roy Knechtel ◽  
Uwe Schwarz ◽  
Sophia Dempwolf ◽  
Holger Klingner ◽  
Andy Nevin ◽  
...  
Keyword(s):  
Wafer Bonding ◽  
Wafer Edge

The Role of Wafer Edge in Wafer Bonding Technologies

2020 ◽  
Vol 98 (4) ◽  
pp. 103-114
Author(s):  
Roy Knechtel ◽  
Uwe Schwarz ◽  
Sophia Dempwolf ◽  
Andy Nevin ◽  
Holger Klingner ◽  
...  
Keyword(s):  
Wafer Bonding ◽  
Wafer Edge

The Role of Wafer Edge in Wafer Bonding Technologies

2020 ◽  
Vol MA2020-02 (22) ◽  
pp. 1633-1633
Author(s):  
Roy Knechtel ◽  
Uwe Schwarz ◽  
Sophia Dempwolf ◽  
Andy Nevin ◽  
Holger Klingner ◽  
...  
Keyword(s):  
Wafer Bonding ◽  
Wafer Edge

Investigation of Paramagnetic Defects in SiCN and SiCO-based Wafer Bonding

2020 ◽  
Author(s):  
L. Peng ◽  
S-W Kim ◽  
S. Iacovo ◽  
J. de Vos ◽  
B. Schoenaers ◽  
...  
Keyword(s):  
Wafer Bonding

High Precision Low Temperature Direct Wafer Bonding Technology for Wafer-Level 3D ICs Manufacturing

2016 ◽  
Vol 75 (9) ◽  
pp. 345-353 ◽  
Author(s):  
F. Kurz ◽  
T. Plach ◽  
J. Suss ◽  
T. Wagenleitner ◽  
D. Zinner ◽  
...  
Keyword(s):  
Low Temperature ◽  
High Precision ◽  
Wafer Bonding ◽  
Wafer Level ◽  
3D Ics ◽  
Direct Wafer Bonding ◽  
Bonding Technology

Chemical Mechanical Planarization Technology for Si Wafer Bonding

2019 ◽  
Vol 33 (10) ◽  
pp. 153-156
Author(s):  
JongHeun Lim ◽  
BoUn Yoon ◽  
KyungHyun Kim ◽  
YoungSun Ko ◽  
ChangJin Kang
Keyword(s):  
Wafer Bonding ◽  
Chemical Mechanical Planarization ◽  
Si Wafer

Silicon-to-silicon wafer bonding using evaporated glass

1998 ◽  
Vol 70 (1-2) ◽  
pp. 179-184 ◽  
Author(s):  
Steen Weichel ◽  
Roger de Reus ◽  
Michael Lindahl
Keyword(s):  
Silicon Wafer ◽  
Wafer Bonding
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