Alternating Current Phosphoric Acid Etching of Aluminium

2015 ◽  
Vol 20 (4) ◽  
pp. 51-56 ◽  
Author(s):  
João Paulo Fragomeni Stella ◽  
Andrea Becker Oliveira ◽  
Lincoln Issamu Nojima ◽  
Mariana Marquezan

OBJECTIVE: To assess four different chemical surface conditioning methods for ceramic material before bracket bonding, and their impact on shear bond strength and surface integrity at debonding.METHODS: Four experimental groups (n = 13) were set up according to the ceramic conditioning method: G1 = 37% phosphoric acid etching followed by silane application; G2 = 37% liquid phosphoric acid etching, no rinsing, followed by silane application; G3 = 10% hydrofluoric acid etching alone; and G4 = 10% hydrofluoric acid etching followed by silane application. After surface conditioning, metal brackets were bonded to porcelain by means of the Transbond XP system (3M Unitek). Samples were submitted to shear bond strength tests in a universal testing machine and the surfaces were later assessed with a microscope under 8 X magnification. ANOVA/Tukey tests were performed to establish the difference between groups (α= 5%).RESULTS: The highest shear bond strength values were found in groups G3 and G4 (22.01 ± 2.15 MPa and 22.83 ± 3.32 Mpa, respectively), followed by G1 (16.42 ± 3.61 MPa) and G2 (9.29 ± 1.95 MPa). As regards surface evaluation after bracket debonding, the use of liquid phosphoric acid followed by silane application (G2) produced the least damage to porcelain. When hydrofluoric acid and silane were applied, the risk of ceramic fracture increased.CONCLUSIONS: Acceptable levels of bond strength for clinical use were reached by all methods tested; however, liquid phosphoric acid etching followed by silane application (G2) resulted in the least damage to the ceramic surface.


2009 ◽  
Vol 28 (4) ◽  
pp. 419-425 ◽  
Author(s):  
Shinya HORIUCH ◽  
Kazuyuki KANEKO ◽  
Hiroko MORI ◽  
Emi KAWAKAMI ◽  
Takashi TSUKAHARA ◽  
...  

2020 ◽  
Vol 8 (3) ◽  
pp. 257 ◽  
Author(s):  
Jinman Lv ◽  
Binbin Hong ◽  
Yang Tan ◽  
Feng Chen ◽  
Javier Rodríguez Vázquez de Aldana ◽  
...  

Polymers ◽  
2020 ◽  
Vol 12 (12) ◽  
pp. 2902
Author(s):  
Phoebe Burrer ◽  
Hoang Dang ◽  
Matej Par ◽  
Thomas Attin ◽  
Tobias T. Tauböck

This study investigated the effect of over-etching and prolonged application time of a universal adhesive on dentin bond strength. Ninety extracted human molars were ground to dentin and randomly allocated into nine groups (G1–9; n = 10 per group), according to the following acid etching and adhesive application times. In the control group (G1), phosphoric acid etching was performed for 15 s followed by application of the universal adhesive Scotchbond Universal (3M) for 20 s, as per manufacturer’s instructions. In groups G2–5, both the etching and adhesive application times were either halved, doubled, quadrupled, or increased eightfold. In groups G6–9, etching times remained the same as in G2–5 (7.5 s, 30 s, 60 s, and 120 s, respectively), but the adhesive application time was set at 20 s as in the control group (G1). Specimens were then restored with a nanofilled composite material and subjected to microtensile bond strength testing. Bond strength data were statistically analyzed by ANOVA and Tukey’s post-hoc tests (α = 0.05). The relationship of bond strength with etching and adhesive application time was examined using linear regression analysis. Treatment of dentin with halved phosphoric acid etching and adhesive application times (G2) resulted in a significant bond strength decrease compared to the control group (G1) and all other test groups, including the group with halved acid etching, but 20 s of adhesive application time (G6). No significant differences in bond strength were found for groups with multiplied etching times and an adhesive application time of 20 s or more, when compared to the control group (G1). In conclusion, a universal adhesive application time of at least 20 s is recommended when bonding to over-etched dentin.


2015 ◽  
Vol 34 (2) ◽  
pp. 219-226 ◽  
Author(s):  
Hiroshi NOGAWA ◽  
Hiroyasu KOIZUMI ◽  
Osamu SAIKI ◽  
Haruto HIRABA ◽  
Mitsuo NAKAMURA ◽  
...  

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