scholarly journals Finite Element Analysis of System-Level Electronic Packages for Space Applications

2015 ◽  
Vol 2015 ◽  
pp. 1-9
Author(s):  
Adrien Lambert ◽  
Ahsan Mian ◽  
Justin Hogan ◽  
Todd Kaiser ◽  
Brock LaMeres
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Cooling System ◽  
System Level ◽  
Primary System ◽  
Electronic Systems ◽  
Element Analysis ◽  
Space Applications ◽  
Flight Operations ◽  
Radiation Sensor

Thermal analysis was required in order to aid in the design and testing of a radiation tolerant computing (RTC) system using a radiation sensor. During development of the system, different test beds were employed in order to characterize the radiation sensor and its supporting electronic systems. The most common preliminary tests are high altitude balloon tests which allow the sensor to experience cosmic radiation at high altitudes, consistent with space flight operations. In this study, finite element analysis (FEA) was used to evaluate primary system architecture, system support structures, and the flight payload in order to determine if the system would survive preliminary and future testing. ANSYS FEA software was used to create thermal models which accurately simulated convective cooling, system heat generation, and solar radiation loading on the exterior of the payload. The results of the models were then used to optimize payload PC board (PCB) design to ensure that the internal electronic systems would be within acceptable operating temperatures.

Accelerating the Product Development of a Commercial Vehicle Radiator using Finite Element Analysis

2017 ◽  
Vol 9 (1) ◽  
Author(s):  
P.R. Roy ◽  
V. Hariram ◽  
M. Subramanian
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Product Development ◽  
Commercial Vehicle ◽  
Cooling System ◽  
Experimental Testing ◽  
Engine Oil ◽  
Operating Pressure ◽  
Element Analysis ◽  
Engine Cooling

Emissions such as Nox and CO resulting from the combustion of the diesel engines in the commercial vehicles leads to environmental degradation and ozone layer depletion. Alarming environment trend forces the government institutions to develop and enforce strict emission laws for the next generation transportation vehicles. Stricter emission laws mean higher operating pressure, temperature, reduced weight, tight packaging space, engine downsizing etc. Engine cooling systems are the critical components in the managing the engine cooling requirement of the commercial vehicle. Generally engine cooling system includes radiator, charge air cooler, engine oil cooler etc. Product development of thermal management system using the traditional design process takes more time, resource and money. To solve the complex design problem, numerical technique such as finite element analysis is performed upfront in the product development of the radiator to evaluate the structure behaviour under mechanical loading. In this paper, internal static pressure analysis of a radiator is presented to showcase the benefits of using the finite element technique earlier in the product design phase. Pressure cycle life at a critical joint of the radiator is calculated using strain-life approach. Finite element analysis aids in visualization of the hot spots in the design, comparing different design options with less turnaround time. Experimental testing and prototypes can be reduced. Risk of a product being failed is greatly minimized by performing the numerical simulation.

scholarly journals Hybrid Simulation Approach on MEMS Piezoresistive Microcantilever Sensor for Biosensing Applications

2009 ◽  
Vol 74 ◽  
pp. 283-286 ◽  
Author(s):  
Rosminazuin A. Rahim ◽  
Badariah Bais ◽  
Burhanuddin Yeop Majlis
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Circuit Simulation ◽  
Hybrid Simulation ◽  
Optimal Performance ◽  
System Level ◽  
Simulation Approach ◽  
Element Analysis ◽  
System Level Simulation ◽  
Stress Changes

This paper uses a hybrid simulation approach in CoventorWare design environment which combines finite element analysis and circuit simulation modeling to obtain the optimal performance of piezoresistive microcantilever sensor. A 250 μm x 100 μm x 1 μm SiO2 cantilever integrated with 0.2 μm thick Si piezoresistor were used in this study. A finite element analysis on piezoresistive microcantilever sensor was conducted in CoventorWare Analyzer environment which incorporates MemMech and MemPZR modules. The sensor sensitivity was obtained by measuring resistivity changes in piezoresistive material in response to surface stress changes of microcantilever. The simulation results were later integrated with system-level simulation solver called Architect to enable the optimization of the sensor circuit output. It involves a hybrid approach which uniquely combined FEM analysis and piezoresistive modeling using circuit simulation environment which results in optimal performance of MEMS piezoresistive microcantilever sensor.

scholarly journals Investigating the Effects of Cyclic Thermo-Mechanical Loading on Cyclic Plastic Behavior of a Ninety-Degree Back-to-Back Pipe Bend System

2019 ◽  
Vol 142 (2) ◽  
Author(s):  
Nak-Kyun Cho ◽  
Haofeng Chen ◽  
Donald Mackenzie ◽  
Dario Giugliano
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Mechanical Loading ◽  
Plastic Behavior ◽  
Confined Space ◽  
Element Analysis ◽  
Pipe Bend ◽  
Space Applications ◽  
Cyclic Plastic ◽  
Incremental Step

Abstract Pipe bends are generally employed for routing piping systems by connecting to straight pipes but back-to-back pipe bends are often necessary for confined space applications. In order to achieve safe operation under complex loading, it requires a thorough pipeline integrity assessment to be commenced. This paper investigates the effects of cyclic thermo-mechanical loading on cyclic plastic behavior of a 90-deg back-to-back pipe bend system, including temperature-dependent yield stress effects. Structural response interaction boundaries are determined for various different combinations of cyclic and steady loading. Constructed structural responses are verified by full cyclic incremental, step-by-step, finite element analysis. The numerical studies provide a comprehensive description of the cyclic plastic behavior of the pipe bends, and semi-empirical equations for predicting the elastic shakedown limit boundary are developed to aid pipeline designers in the effective assessment of the integrity of the pipe bends without a requirement for complex finite element analysis.

Mechanics Design for Stretchable, High Areal Coverage GaAs Solar Module on an Ultrathin Substrate

2014 ◽  
Vol 81 (12) ◽  
Author(s):  
Xiaoting Shi ◽  
Renxiao Xu ◽  
Yuhang Li ◽  
Yihui Zhang ◽  
Zhigang Ren ◽  
...  
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
System Level ◽  
Stretchable Electronics ◽  
Element Analysis ◽  
Solar Module ◽  
Strain Isolation ◽  
Areal Coverage

The trench design of substrate together with curvy interconnect formed from buckling provides a solution to stretchable electronics with high areal coverage on an ultrathin substrate, which are critically important for stretchable photovoltaics. In this paper, an improved trench design is proposed and verified by finite element analysis (FEA), through use of a heterogeneous design, to facilitate strain isolation and avoid possible fracture/delamination issue. A serpentine design of interconnect is also devised to offer ∼440% interconnect level stretchability, which is >3.5 times that of previous trench design, and could transform into 20% system-level stretchability, even for areal coverage as high as ∼90%.

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