Magneto-Acousto-Electrical Tomography for High Resolution Electrical Conductivity Contrast Imaging

2018 ◽  
Vol 8 (7) ◽  
pp. 1402-1407
Author(s):  
Yuanyuan Li ◽  
Guoqiang Liu ◽  
Zhishen Sun ◽  
Hui Xia ◽  
Zhengwu Xia
Author(s):  
Benjamin M. Siegel

The potential advantages of high voltage electron microscopy for extending the limits of resolution and contrast in imaging low contrast objects, such as biomolecular specimens, is very great. The results of computations will be presented showing that at accelerating voltages of 500-1000 kV it should be possible to achieve spacial resolutions of 1 to 1.5 Å and using phase contrast imaging achieve adequate image contrast to observe single atoms of low atomic number.The practical problems associated with the design and utilization of the high voltage instrument are, optimistically, within the range of competence of the state of the art. However, there are some extremely important and critical areas to be systematically investigated before we have achieved this competence. The basic electron optics of the column required is well understood, but before the full potential of an instrument capable of resolutions of better than 1.5 Å are realized some very careful development work will be required. Of great importance for the actual achievement of high resolution with a high voltage electron microscope is the fundamental limitation set by the characteristics of the high voltage electron beam that can be obtained from the accelerator column.


Author(s):  
C. Barry Carter

This paper will review the current state of understanding of interface structure and highlight some of the future needs and problems which must be overcome. The study of this subject can be separated into three different topics: 1) the fundamental electron microscopy aspects, 2) material-specific features of the study and 3) the characteristics of the particular interfaces. The two topics which are relevant to most studies are the choice of imaging techniques and sample preparation. The techniques used to study interfaces in the TEM include high-resolution imaging, conventional diffraction-contrast imaging, and phase-contrast imaging (Fresnel fringe images, diffuse scattering). The material studied affects not only the characteristics of the interfaces (through changes in bonding, etc.) but also the method used for sample preparation which may in turn have a significant affect on the resulting image. Finally, the actual nature and geometry of the interface must be considered. For example, it has become increasingly clear that the plane of the interface is particularly important whenever at least one of the adjoining grains is crystalline.A particularly productive approach to the study of interfaces is to combine different imaging techniques as illustrated in the study of grain boundaries in alumina. In this case, the conventional imaging approach showed that most grain boundaries in ion-thinned samples are grooved at the grain boundary although the extent of this grooving clearly depends on the crystallography of the surface. The use of diffuse scattering (from amorphous regions) gives invaluable information here since it can be used to confirm directly that surface grooving does occur and that the grooves can fill with amorphous material during sample preparation (see Fig. 1). Extensive use of image simulation has shown that, although information concerning the interface can be obtained from Fresnel-fringe images, the introduction of artifacts through sample preparation cannot be lightly ignored. The Fresnel-fringe simulation has been carried out using a commercial multislice program (TEMPAS) which was intended for simulation of high-resolution images.


Author(s):  
S. J. Pennycook

Using a high-angle annular detector on a high-resolution STEM it is possible to form incoherent images of a crystal lattice characterized by strong atomic number or Z contrast. Figure 1 shows an epitaxial Ge film on Si(100) grown by oxidation of Ge-implanted Si. The image was obtained using a VG Microscopes' HB501 STEM equipped with an ultrahigh resolution polepiece (Cs ∽1.2 mm, demonstrated probe FWHM intensity ∽0.22 nm). In both crystals the lattice is resolved but that of Ge shows much brighter allowing the interface to be located exactly and interface steps to be resolved (arrowed). The interface was indistinguishable in the phase-contrast STEM image from the same region, and even at higher resolution the location of the interface is complex. Figure 2 shows a thin region of an MBE-grown ultrathin super-lattice (Si8Ge2)100. The expected compositional modulation would show as one bright row of dots from the 2 Ge monolayers separated by 4 rows of lighter Si columns. The image shows clearly that strain-induced interdiffusion has occurred on the monolayer scale.


Geophysics ◽  
2001 ◽  
Vol 66 (1) ◽  
pp. 78-89 ◽  
Author(s):  
Donat Demanet ◽  
François Renardy ◽  
Kris Vanneste ◽  
Denis Jongmans ◽  
Thierry Camelbeeck ◽  
...  

As part of a paleoseismological investigation along the Bree fault scarp (western border of the Roer Graben), various geophysical methods [electrical profiling, electromagnetic (EM) profiling, refraction seismic tests, electrical tomography, ground‐penetrating radar (GPR), and high‐resolution reflection seismic profiles] were used to locate and image an active fault zone in a depth range between a few decimeters to a few tens of meters. These geophysical investigations, in parallel with geomorphological and geological analyses, helped in the decision to locate trench excavations exposing the fault surfaces. The results could then be checked with the observations in four trenches excavated across the scarp. Geophysical methods pointed out anomalies at all sites of the fault position. The contrast of physical properties (electrical resistivity and permittivity, seismic velocity) observed between the two fault blocks is a result of a differences in the lithology of the juxtaposed soil layers and of a change in the water table depth across the fault. Extremely fast techniques like electrical and EM profiling or seismic refraction profiles localized the fault position within an accuracy of a few meters. In a second step, more detailed methods (electrical tomography and GPR) more precisely imaged the fault zone and revealed some structures that were observed in the trenches. Finally, one high‐resolution reflection seismic profile imaged the displacement of the fault at depths as large as 120 m and filled the gap between classical seismic reflection profiles and the shallow geophysical techniques. Like all geophysical surveys, the quality of the data is strongly dependent on the geologic environment and on the contrast of the physical properties between the juxtaposed formations. The combined use of various geophysical techniques is thus recommended for fault mapping, particularly for a preliminary investigation when the geological context is poorly defined.


2004 ◽  
pp. 67-78 ◽  
Author(s):  
MARCIA K. SCHULMEISTER ◽  
JAMES J. BUTLER ◽  
EVAN K. FRANSEEN ◽  
DOUGLAS A. WYSOCKI ◽  
JAMES A. DOOLITTLE

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