Mechanical Properties of Epoxy Adhesive Under Thermal Aging and Their Chemical Degradation Behavior
2021 ◽
Vol 21
(8)
◽
pp. 4444-4449
Keyword(s):
Epoxy adhesive was analyzed under long term thermal aging and mechanical properties and chemical degradation were observed by X-ray photoelectron spectroscopy (XPS). Long term thermal exposure of epoxy causes a noticeable reduction in adhesive properties. We developed a predictive model of temperature and time dependent aging. The temperature dependent aging behavior of epoxy adhesive shows good agreement with conventional Arrhenius equations. Using XPS analysis, we also discovered a correlation between chemical degradation and the adhesive properties. Decay of C–C bonding ratio induced chain-scission of epoxy adhesive; increase of total numbers of C–O and C═O induced oxidation of epoxy adhesive during thermal exposure.
2017 ◽
Vol 704
◽
pp. 302-310
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2019 ◽
Vol 6
(11)
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pp. 1165h1
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Keyword(s):
2012 ◽
Vol 2012
◽
pp. 1-14
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2010 ◽
Vol 2010
(2)
◽
pp. 213-220
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2002 ◽
Vol 51
(12)
◽
pp. 1405-1410
Keyword(s):
2012 ◽
Vol 39
◽
pp. 55-62
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Keyword(s):