5 nm-Thick (AlCrTaTiZrRu)N0.5 Multi-Component Barrier Layer with High Diffusion Resistance for Cu Interconnects
2011 ◽
Vol 3
(2)
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pp. 289-293
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2011 ◽
Vol 205
(21-22)
◽
pp. 5064-5067
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Keyword(s):
2010 ◽
Vol 157
(6)
◽
pp. G154
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1985 ◽
Vol 9
(6)
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pp. 567-581
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Keyword(s):
2016 ◽
Vol 23
(2)
◽
pp. 49-55
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Keyword(s):
2007 ◽
Vol 84
(11)
◽
pp. 2450-2454
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2018 ◽
Vol 748
◽
pp. 258-264
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