Deformation Failure Mechanism and Stability Analysis of Red Layer Landslide—A Case Study of Caishuzu Landslide

2020 ◽  
Vol 10 (08) ◽  
pp. 721-729
Author(s):  
智勇 马
Keyword(s):  
Stability Analysis ◽  
Failure Mechanism

Application of Lock-in Thermography on PCB for Fault Localization and Validation of Failure Mechanism Due to External Discrete Component Variation

2010 ◽  
Author(s):  
William Ng ◽  
Kevin Weaver ◽  
Zachary Gemmill ◽  
Herve Deslandes ◽  
Rudolf Schlangen
Keyword(s):  
Failure Mechanism ◽  
Integrated Circuit ◽  
Printed Circuit Board ◽  
Hot Spot ◽  
Circuit Board ◽  
Discrete Component ◽  
Printed Circuit ◽  
Thermal Signature ◽  
Lock In

Abstract This paper demonstrates the use of a real time lock-in thermography (LIT) system to non-destructively characterize thermal events prior to the failing of an integrated circuit (IC) device. A case study using a packaged IC mounted on printed circuit board (PCB) is presented. The result validated the failing model by observing the thermal signature on the package. Subsequent analysis from the backside of the IC identified a hot spot in internal circuitry sensitive to varying value of external discrete component (inductor) on PCB.

Case Study in Fault Isolation of a Metal Short for Yield Enhancement

2010 ◽  
Author(s):  
Sarven Ipek ◽  
David Grosjean
Keyword(s):  
Failure Analysis ◽  
Failure Mechanism ◽  
Photon Emission ◽  
Fault Isolation ◽  
Yield Enhancement ◽  
Analysis Technique ◽  
Laser Signal ◽  
Signal Injection ◽  
Microscopy Techniques

Abstract The application of an individual failure analysis technique rarely provides the failure mechanism. More typically, the results of numerous techniques need to be combined and considered to locate and verify the correct failure mechanism. This paper describes a particular case in which different microscopy techniques (photon emission, laser signal injection, and current imaging) gave clues to the problem, which then needed to be combined with manual probing and a thorough understanding of the circuit to locate the defect. By combining probing of that circuit block with the mapping and emission results, the authors were able to understand the photon emission spots and the laser signal injection microscopy (LSIM) signatures to be effects of the defect. It also helped them narrow down the search for the defect so that LSIM on a small part of the circuit could lead to the actual defect.

Study on the Calculation Method of Soil-Nailing for High Soil Slope Based on the Logarithmic Spiral Slippery Fracture

2011 ◽  
Vol 261-263 ◽  
pp. 1709-1713
Author(s):  
Meng Yang ◽  
Xiao Min Liu
Keyword(s):  
Mathematical Model ◽  
Stability Analysis ◽  
Engineering Design ◽  
Calculation Method ◽  
Logarithmic Spiral ◽  
Soil Nailing ◽  
Soil Slope ◽  
Mode Pattern ◽  
Shear Function

This paper introduces a new failure mode pattern of soil slope – the logarithmic spiral slippery fracture. A mathematical model for the logarithmic spiral slippery fracture is established, taking the anti-shear function of the soil-nailing into consideration. The shear of soil-nailing, axial force, and the safety coefficients based on the limiting equilibrium method are derived, leading to an accurate stability analysis of the strengthening of soil slope. A case study shows that the anti-shear function of the soil-nailing can be significant and should not be ignored in engineering design.

A case study on the rockfall assessment and stability analysis along Lengpui-Aizawl highway, Mizoram, India

2020 ◽  
Vol 13 (24) ◽  
Author(s):  
Sahil Sardana ◽  
Pushpendra Sharma ◽  
Amit Kumar Verma ◽  
Trilok Nath Singh
Keyword(s):  
Stability Analysis
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