Thermal Stability of Porous Anodic Alumina Formed in Electrolytes with Surfactant Additives

AbstractNanostructured anodic alumina membranes have been utilized as high-temperature stable supports for 150 nm thick continuous palladium films. The palladium has been deposited by vacuum evaporation onto the rotating substrate. The thermal stability of the resulting compound membranes has been demonstrated for temperatures up to 700ºC under a reducing atmosphere. Hydrogen permeation has been measured up to 280ºC, where the permeability has a value of 2.5·10-7 mol m-2 s-1 Pa-1. At the same time the selectivity factor over carbon dioxide is at least 33.

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Thermal Stability of Anodic Layers on Aluminum Alloys

Solid State Phenomena ◽

10.4028/www.scientific.net/ssp.230.14 ◽

2015 ◽

Vol 230 ◽

pp. 14-18 ◽

Cited By ~ 1

Author(s):

V. Sokol ◽

V. Shulgov

Keyword(s):

Electron Microscopy ◽

Thermal Stability ◽

Aluminum Alloy ◽

Aluminum Alloys ◽

Open Circuit Potential ◽

Alloy Composition ◽

Open Circuit ◽

Crack Growth Resistance ◽

Anodic Alumina ◽

Thermal Stability Of

The thermal stability of anodic alumina layers made by the open circuit potential measurements and electron microscopy is discussed. The crack growth resistance of the anodic alumina layers has been studied depending on the initial aluminum alloy composition and the anodization regimes.

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The Ordered Phase Formation in Ti-Al-Ga Alloys

Proceedings, annual meeting, Electron Microscopy Society of America ◽

10.1017/s0424820100069193 ◽

1970 ◽

Vol 28 ◽

pp. 440-441

Author(s):

Shiro Fujishiro ◽

Harold L. Gegel

Keyword(s):

Thermal Stability ◽

High Temperature ◽

Titanium Alloys ◽

Growth Kinetics ◽

Stoichiometric Composition ◽

Good Potential ◽

Alpha Titanium ◽

Cold Rolled ◽

Kinetics Of ◽

Thermal Stability Of

Ordered-alpha titanium alloys having a DO19 type structure have good potential for high temperature (600°C) applications, due to the thermal stability of the ordered phase and the inherent resistance to recrystallization of these alloys. Five different Ti-Al-Ga alloys consisting of equal atomic percents of aluminum and gallium solute additions up to the stoichiometric composition, Ti3(Al, Ga), were used to study the growth kinetics of the ordered phase and the nature of its interface.The alloys were homogenized in the beta region in a vacuum of about 5×10-7 torr, furnace cooled; reheated in air to 50°C below the alpha transus for hot working. The alloys were subsequently acid cleaned, annealed in vacuo, and cold rolled to about. 050 inch prior to additional homogenization

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Microstructure studies of tungsten silicide schottky contacts on Gaas

Proceedings, annual meeting, Electron Microscopy Society of America ◽

10.1017/s0424820100126445 ◽

1987 ◽

Vol 45 ◽

pp. 328-329

Author(s):

Yih-Cheng Shih ◽

E. L. Wilkie

Keyword(s):

Thermal Stability ◽

Field Effect Transistors ◽

Schottky Contact ◽

Schottky Contacts ◽

Excellent Thermal Stability ◽

Barrier Heights ◽

Gaas Substrates ◽

Film Adhesion ◽

Threshold Voltages ◽

Thermal Stability Of

Tungsten silicides (WSix) have been successfully used as the gate materials in self-aligned GaAs metal-semiconductor-field- effect transistors (MESFET). Thermal stability of the WSix/GaAs Schottky contact is of major concern since the n+ implanted source/drain regions must be annealed at high temperatures (∼ 800°C). WSi0.6 was considered the best composition to achieve good device performance due to its low stress and excellent thermal stability of the WSix/GaAs interface. The film adhesion and the uniformity in barrier heights and ideality factors of the WSi0.6 films have been improved by depositing a thin layer of pure W as the first layer on GaAs prior to WSi0.6 deposition. Recently WSi0.1 has been used successfully as the gate material in 1x10 μm GaAs FET's on the GaAs substrates which were sputter-cleaned prior to deposition. These GaAs FET's exhibited uniform threshold voltages across a 51 mm wafer with good film adhesion after annealing at 800°C for 10 min.

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