Preparation of a New Class of Polyimide-Silica Hybrid Films by Sol-Gel Process.

1992 ◽  
Vol 24 (1) ◽  
pp. 107-113 ◽  
Author(s):  
Atsushi Morikawa ◽  
Yoshitake Iyoku ◽  
Masa-aki Kakimoto ◽  
Yoshio Imai
Keyword(s):  
Sol Gel ◽  
Hybrid Films ◽  
New Class ◽  
Sol Gel Process ◽  
Silica Hybrid

scholarly journals Preparation of Polyimide-Silica Hybrid Films Using Sol-Gel Process.

1992 ◽  
Vol 5 (2) ◽  
pp. 393-396 ◽  
Author(s):  
Atsushi Morikawa ◽  
Hidehiro Yamaguchi ◽  
Yoshitake Iyoku ◽  
Masa-aki Kakimoto ◽  
Yoshio Imai
Keyword(s):  
Sol Gel ◽  
Hybrid Films ◽  
Sol Gel Process ◽  
Silica Hybrid

Formation of Interconnected Globular Structure of Silica Phase in Polyimide-Silica Hybrid Films Prepared by the Sol-Gel Process

1994 ◽  
Vol 6 (7) ◽  
pp. 913-917 ◽  
Author(s):  
Atsushi Morikawa ◽  
Hidehiro Yamaguchi ◽  
M. Kakimoto ◽  
Yoshio Imai
Keyword(s):  
Sol Gel ◽  
Hybrid Films ◽  
Globular Structure ◽  
Silica Phase ◽  
Sol Gel Process ◽  
Silica Hybrid

Synthesis and cryogenic properties of polyimide–silica hybrid films by sol–gel process

Polymer ◽  
2005 ◽  
Vol 46 (19) ◽  
pp. 8373-8378 ◽  
Author(s):  
Yi-He Zhang ◽  
Yan Li ◽  
Shao-Yun Fu ◽  
John H. Xin ◽  
Walid A. Daoud ◽  
...  
Keyword(s):  
Sol Gel ◽  
Hybrid Films ◽  
Sol Gel Process ◽  
Silica Hybrid

scholarly journals Preparation and Performance of Nano-hybrids Synthesized from Polyimide and Silica

2009 ◽  
Vol 2 (1) ◽  
pp. 99-107 ◽  
Author(s):  
S. M. M. Alam
Keyword(s):  
Sol Gel ◽  
Tensile Modulus ◽  
Mechanical Analysis ◽  
Hybrid Films ◽  
Scanning Calorimetry ◽  
Chemical Structures ◽  
Sol Gel Process ◽  
Biphenyltetracarboxylic Dianhydride ◽  
Silica Hybrid

Polyimide (PI)-inorganic like silica hybrid films were successfully prepared to combine the good performances of silica like tensile modulus, thermal stability etc. into organic PI. Polyamic acid (PAA), precursor of PI, was prepared from 3, 3′, 4, 4′-biphenyltetracarboxylic dianhydride (BPDA), p-phenylediamine (PDA) and in-situ formed silica was formed into PAA from tetraethoxysilane (TEOS) through in-situ sol-gel process. The films were transparent and became translucent in presence of up to 10% inorganic contents. The chemical structures were characterized by Fourier transform infrared spectroscopy (FTIR). The morphology of the films was investigated by scanning electronic microscopy (SEM). Differential scanning calorimetry (DSC), thermogravimetry analysis (TGA), stress-strain tests and dynamic mechanical analysis (DMA) were used to evaluate the performances of the films. The results indicated that the glass-transition temperatures (Tg) and decomposition temperatures of the PI-silica hybrid films were higher than those of pristine PI. Tensile modulus, tensile strength of PI increased prominently in presence of small amount (1%) of silica in PI-silica hybrid. Keywords: Polyimide; Hybrid; Sol-gel process. © 2010 JSR Publications. ISSN: 2070-0237 (Print); 2070-0245 (Online). All rights reserved. DOI: 10.3329/jsr.v2i1.2733                 J. Sci. Res. 2 (1), 99-107 (2010)  

Proton conduction mechanisms in GPTMS/TEOS-derived organic/silica hybrid films prepared by sol-gel process

2020 ◽  
Vol 267 ◽  
pp. 116448
Author(s):  
Daniela A. Monteiro ◽  
Giovani Gozzi ◽  
Dante Luis Chinaglia ◽  
Osvaldo N. Oliveira ◽  
Fabio S. de Vicente
Keyword(s):  
Sol Gel ◽  
Proton Conduction ◽  
Hybrid Films ◽  
Conduction Mechanisms ◽  
Sol Gel Process ◽  
Organic Silica ◽  
Silica Hybrid

Atomic Oxygen Effects of Polyimide/Silica Hybrid Films in Low Earth Orbit Environment

2010 ◽  
Vol 177 ◽  
pp. 686-689 ◽  
Author(s):  
Shu Wang Duo ◽  
Mi Mi Song ◽  
Ying Luo ◽  
Ting Zhi Liu ◽  
Wei Min Gao
Keyword(s):  
Atomic Oxygen ◽  
Hybrid Film ◽  
Sol Gel ◽  
Polyimide Film ◽  
Low Earth Orbit ◽  
Earth Orbit ◽  
Hybrid Films ◽  
Oxygen Effects ◽  
Sol Gel Process ◽  
Silica Hybrid

To improve AO resistance of polyimide, a type of polyimide/silica (PI/SiO2) hybrid film was prepared by the sol-gel process. The coupling agent p-aminophenyltrimeth- oxysilane (APTMOS) was chosen to enhance the compatibility between the polyimide (PI) and silica (SiO2). AO resistance of the PI/SiO2 hybrid films were tested in the ground-based simulation AO facility. The erosion yield of the films was 4.7×10-26 cm3/atom, decreased by two orders of magnitude compared with the value of 3.0×10-24 cm3/atom of the polyimide film. Results from FTIR, XPS, AFM on AO treated polyimide/silica hybrid films indicate the formation of a passivating inorganic SiO2 layer. The layer significantly retards the penetration of oxygen atoms, preventing further degradation of the polymer in the bulk. The addition of SiO2 in polyimide does not significantly alter the optical properties of polyimide during AO exposure.

Interaction and Microstructure of Polyurethane/Silica Hybrid Films Prepared by Sol-Gel Process

2006 ◽  
Vol 37 (1) ◽  
pp. 39-47 ◽  
Author(s):  
Yong-Chun Chen ◽  
Shu-Xue Zhou ◽  
Hai-Hua Yang ◽  
Li-Min Wu
Keyword(s):  
Sol Gel ◽  
Hybrid Films ◽  
Sol Gel Process ◽  
Silica Hybrid
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