OS09W0305 Sensitive strain monitoring of SiC fiber/epoxy composite using electrical resistance change

2003 ◽  
Vol 2003.2 (0) ◽  
pp. _OS09W0305-_OS09W0305
Author(s):  
Shifumi Aizawa ◽  
Toshio Ogasawara ◽  
Takeshi Ogawa
Keyword(s):  
Electrical Resistance ◽  
Epoxy Composite ◽  
Sensitive Strain ◽  
Resistance Change ◽  
Strain Monitoring ◽  
Sic Fiber ◽  
Electrical Resistance Change

Cyclic Behavior of Electrical Resistance Type Low Stiffness, Large Strain Sensor by Using Carbon Nanofiber/Flexible Epoxy Composite

2011 ◽  
Vol 462-463 ◽  
pp. 1200-1205 ◽  
Author(s):  
Yoshinobu Shimamura ◽  
Kyohei Kageyama ◽  
Keiichiro Tohgo ◽  
Tomoyuki Fujii
Keyword(s):  
Electrical Conductivity ◽  
Electrical Resistance ◽  
Carbon Nanofiber ◽  
Epoxy Composite ◽  
Large Strain ◽  
Conductive Polymer ◽  
Cyclic Behavior ◽  
Resistance Change ◽  
Sensing Applications ◽  
Electrical Resistance Change

Carbon nanofiber (CNF) has good electrical conductivity. Addition of a few percentages of carbon nanofiber to polymer yields electrical conductivity but hardly affects the mechanical properties of polymer. This conductive polymer may be useful for sensing applications such as strain sensors and chem-resist sensors. Many researchers have reported on the electrical conductivity, but the electrical resistance change under strain of the carbon nanofiller composites is not fully investigated. In this study, the electrical resistance change under strain of CNF/flexible-epoxy composites was investigated experimentally. More than 100% of quasi-static strain can be measured by using CNF/flexible-epoxy composite with Young’s modulus of less than 1MPa. Cyclic and unloading behaviors were also measured and discussed. It was found that the cyclic behavior was strongly affected by viscoelasticity and damage.

Electrical Resistance Change under Strain of CNF/Flexible-Epoxy Composite

2010 ◽  
Vol 19 (2) ◽  
pp. 123-138 ◽  
Author(s):  
Tetsuo Yasuoka ◽  
Yoshinobu Shimamura ◽  
Akira Todoroki
Keyword(s):  
Electrical Resistance ◽  
Epoxy Composite ◽  
Resistance Change ◽  
Electrical Resistance Change

Electrical Failure and Damage Analysis of Multi-Layer Metal Films on Flexible Substrate during Cyclic Bending Deformation

2011 ◽  
Author(s):  
Byoung-Joon Kim ◽  
Hae-A-Seul Shin ◽  
In-Suk Choi ◽  
Young-Chang Joo
Keyword(s):  
Fatigue Resistance ◽  
Electrical Resistance ◽  
Metal Film ◽  
Flexible Substrate ◽  
Resistance Change ◽  
Cyclic Bending ◽  
Capping Layer ◽  
Bending Strain ◽  
Cu Film ◽  
Electrical Resistance Change

Abstract The electrical resistance Cu film on flexible substrate was investigated in cyclic bending deformation. The electrical resistance of 1 µm thick Cu film on flexible substrate increased up to 120 % after 500,000 cycles in 1.1 % tensile bending strain. Crack and extrusion were observed due to the fatigue damage of metal film. Low bending strain did not cause any damage on metal film but higher bending strain resulted in severe electrical and mechanical damage. Thinner film showed higher fatigue resistance because of the better mechanical property of thin film. Cu film with NiCr under-layer showed poorer fatigue resistance in tensile bending mode. Ni capping layer did not improve the fatigue resistance of Cu film, but Al capping layer suppressed crack formation and lowered electrical resistance change. The NiCr under layer, Ni capping layer, and Al capping layer effect on electrical resistance change of Cu film was compared with Cu only sample.

A highly-deformable piezoresistive film composed of a network of carbon blacks and highly oriented lamellae of high-density polyethylene

RSC Advances ◽  
2015 ◽  
Vol 5 (39) ◽  
pp. 31074-31080 ◽  
Author(s):  
Shaodi Zheng ◽  
Jie Deng ◽  
Luqiong Yang ◽  
Danqi Ren ◽  
Wei Yang ◽  
...  
Keyword(s):  
Electrical Resistance ◽  
High Density Polyethylene ◽  
High Density ◽  
Resistance Change ◽  
Carbon Blacks ◽  
Electrical Resistance Change

The electrical resistance change of highly extensible films consisting of a network of carbon blacks in high-density polyethylene, with different regularity of stacked lamellae, is investigated.

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