Evolution Equation of Creep for Elastic-Plastic-Creep Constitutive Model of Lead-Free Solder

2004 ◽  
Vol 2004.17 (0) ◽  
pp. 785-786
Author(s):  
Ken-ichi OHGUCHI ◽  
Katsuhiko SASAKI ◽  
Masahiro ISHIBASHI
Keyword(s):  
Constitutive Model ◽  
Evolution Equation ◽  
Lead Free ◽  
Lead Free Solder ◽  
Elastic Plastic ◽  
Free Solder ◽  
Creep Constitutive Model ◽  
Plastic Creep

scholarly journals Application of Viscoplastic-Creep Separate Constitutive Model to Lead-Free Solder Alloy

2011 ◽  
Vol 77 (780) ◽  
pp. 1169-1177 ◽  
Author(s):  
Takeharu HAYASHI ◽  
Yoshinori EBIHARA ◽  
Tatsuhiko ASAI ◽  
Hirohiko WATANABE
Keyword(s):  
Constitutive Model ◽  
Solder Alloy ◽  
Lead Free ◽  
Lead Free Solder ◽  
Lead Free Solder Alloy ◽  
Free Solder

Thermal Fatigue Life Estimation of Lead-Free Solder Using Inelastic Constitutive Model

2002 ◽  
Vol 2002.6 (0) ◽  
pp. 283-284
Author(s):  
Hiroyuki TAKAHASHI ◽  
Takashi KAWAKAMI ◽  
Minoru MUKAI ◽  
Mineo KOBAYASHI ◽  
Nobutada OHNO ◽  
...  
Keyword(s):  
Fatigue Life ◽  
Constitutive Model ◽  
Thermal Fatigue ◽  
Lead Free ◽  
Lead Free Solder ◽  
Life Estimation ◽  
Thermal Fatigue Life ◽  
Fatigue Life Estimation ◽  
Free Solder

The Effects of Temperature Cyclic Loading on Lead-Free Solder Joints of Wafer Level Chip Scale Package by Taguchi Method

2008 ◽  
Vol 130 (1) ◽  
Author(s):  
Wen-Ren Jong ◽  
Hsin-Chun Tsai ◽  
Hsiu-Tao Chang ◽  
Shu-Hui Peng
Keyword(s):  
Low Temperature ◽  
Shear Strain ◽  
Solder Joints ◽  
Strain Range ◽  
Lead Free ◽  
Lead Free Solder ◽  
Wafer Level ◽  
Chip Scale Package ◽  
Free Solder ◽  
Plastic Creep

In this study, the effects of the temperature cyclic loading on three lead-free solder joints of 96.5Sn–3.5Ag, 95.5Sn–3.8Ag-0.7Cu, and 95.5Sn–3.9Ag-0.6Cu bumped wafer level chip scale package (WLCSP) on printed circuit board assemblies are investigated by Taguchi method. The orthogonal arrays of L16 is applied to examine the shear strain effects of solder joints under five temperature loading parameters of the temperature ramp rate, the high and low temperature dwells, and the dwell time of both high and low temperatures by means of three simulated analyses of creep, plastic, and plastic-creep behavior on the WLCSP assemblies. It is found that the temperature dwell is the most significant factor on the effects of shear strain range from these analyses. The effect of high temperature dwell on the shear strain range is larger than that of low temperature dwell in creep analysis, while the effect of high temperature dwell on the shear strain range is smaller than that of low temperature dwell in both plastic and plastic-creep analyses.

scholarly journals Anand constitutive model of lead-free solder joints in 3D IC device

2016 ◽  
Vol 738 ◽  
pp. 012050 ◽  
Author(s):  
Liang Zhang ◽  
Zhi-quan Liu ◽  
Yu-tong Ji
Keyword(s):  
Constitutive Model ◽  
Solder Joints ◽  
Lead Free ◽  
Lead Free Solder ◽  
3D Ic ◽  
Free Solder

Implementation of a High-Temperature Inelastic Constitutive Model in FEM and Application to Lead-Free Solder Joint Analysis

2002 ◽  
Vol 2002.15 (0) ◽  
pp. 771-772
Author(s):  
Mineo KOBAYASHI ◽  
Minoru MUKAI ◽  
Hiroyuki TAKAHASHI ◽  
Tomofumi ISHIKAWA ◽  
Takashi KAWAKAMI ◽  
...  
Keyword(s):  
High Temperature ◽  
Solder Joint ◽  
Constitutive Model ◽  
Lead Free ◽  
Joint Analysis ◽  
Lead Free Solder ◽  
Free Solder

scholarly journals Fatigue Life Estimation of Lead-Free Solder Joints Using Viscoplastic-Creep Separate Constitutive Model

2014 ◽  
Vol 3 (4) ◽  
pp. 218-224
Author(s):  
Takeharu HAYASHI ◽  
Hirohiko WATANABE ◽  
Yoshinori EBIHARA ◽  
Tatsuhiko ASAI
Keyword(s):  
Fatigue Life ◽  
Constitutive Model ◽  
Solder Joints ◽  
Lead Free ◽  
Lead Free Solder ◽  
Life Estimation ◽  
Fatigue Life Estimation ◽  
Free Solder

Evaluation of Time-Independent and Time-Dependent Strains of Lead-Free Solder by Stepped Ramp Loading Test

2007 ◽  
Author(s):  
Ken-Ichi Ohguchi ◽  
Katsuhiko Sasaki ◽  
Setsuo Aso
Keyword(s):  
Time Dependent ◽  
Lead Free ◽  
Loading Test ◽  
Material Constants ◽  
Dependent Strain ◽  
Creep Models ◽  
Free Solder ◽  
Creep Constitutive Model ◽  
Lead Free Solders ◽  
Plastic Creep

This paper proposes a method which can estimate essential material constants of an elasto-plastic-creep constitutive model for lead-free solders by conducting only a tensile test. The test employs a stepped ramp wave loading which repeats instantaneous straining and strain maintaining. The time-independent strains can be evaluated by using the stress-strain relations at the instantaneous straining parts, while the time-dependent strain can be evaluated by using the stress-time relations during the strain maintaining parts. Based on the results of the evaluations, the material constants of the elasto-plastic-creep models are estimated. Simulations of the viscoplastic deformations of Sn-3.0Ag-0.5Cu solder alloy were also conducted to verify the validity of the proposed method.

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