scholarly journals A dislocation density based viscoplastic constitutive model for lead free solder under drop impact

2017 ◽  
Vol 120 ◽  
pp. 236-244 ◽  
Author(s):  
Xu He ◽  
Yao Yao
Keyword(s):  
Dislocation Density ◽  
Constitutive Model ◽  
Drop Impact ◽  
Lead Free ◽  
Lead Free Solder ◽  
Free Solder

scholarly journals Application of Viscoplastic-Creep Separate Constitutive Model to Lead-Free Solder Alloy

2011 ◽  
Vol 77 (780) ◽  
pp. 1169-1177 ◽  
Author(s):  
Takeharu HAYASHI ◽  
Yoshinori EBIHARA ◽  
Tatsuhiko ASAI ◽  
Hirohiko WATANABE
Keyword(s):  
Constitutive Model ◽  
Solder Alloy ◽  
Lead Free ◽  
Lead Free Solder ◽  
Lead Free Solder Alloy ◽  
Free Solder

Thermal Fatigue Life Estimation of Lead-Free Solder Using Inelastic Constitutive Model

2002 ◽  
Vol 2002.6 (0) ◽  
pp. 283-284
Author(s):  
Hiroyuki TAKAHASHI ◽  
Takashi KAWAKAMI ◽  
Minoru MUKAI ◽  
Mineo KOBAYASHI ◽  
Nobutada OHNO ◽  
...  
Keyword(s):  
Fatigue Life ◽  
Constitutive Model ◽  
Thermal Fatigue ◽  
Lead Free ◽  
Lead Free Solder ◽  
Life Estimation ◽  
Thermal Fatigue Life ◽  
Fatigue Life Estimation ◽  
Free Solder

scholarly journals Anand constitutive model of lead-free solder joints in 3D IC device

2016 ◽  
Vol 738 ◽  
pp. 012050 ◽  
Author(s):  
Liang Zhang ◽  
Zhi-quan Liu ◽  
Yu-tong Ji
Keyword(s):  
Constitutive Model ◽  
Solder Joints ◽  
Lead Free ◽  
Lead Free Solder ◽  
3D Ic ◽  
Free Solder

Implementation of a High-Temperature Inelastic Constitutive Model in FEM and Application to Lead-Free Solder Joint Analysis

2002 ◽  
Vol 2002.15 (0) ◽  
pp. 771-772
Author(s):  
Mineo KOBAYASHI ◽  
Minoru MUKAI ◽  
Hiroyuki TAKAHASHI ◽  
Tomofumi ISHIKAWA ◽  
Takashi KAWAKAMI ◽  
...  
Keyword(s):  
High Temperature ◽  
Solder Joint ◽  
Constitutive Model ◽  
Lead Free ◽  
Joint Analysis ◽  
Lead Free Solder ◽  
Free Solder

scholarly journals Fatigue Life Estimation of Lead-Free Solder Joints Using Viscoplastic-Creep Separate Constitutive Model

2014 ◽  
Vol 3 (4) ◽  
pp. 218-224
Author(s):  
Takeharu HAYASHI ◽  
Hirohiko WATANABE ◽  
Yoshinori EBIHARA ◽  
Tatsuhiko ASAI
Keyword(s):  
Fatigue Life ◽  
Constitutive Model ◽  
Solder Joints ◽  
Lead Free ◽  
Lead Free Solder ◽  
Life Estimation ◽  
Fatigue Life Estimation ◽  
Free Solder

Cohesive Fracture Mechanics Based Finite Element Analysis to the Performance of Lead Free Solders in BGA Packaging Under Drop Impact

2012 ◽  
Author(s):  
Yao Yao
Keyword(s):  
Finite Element ◽  
Solder Alloy ◽  
Drop Impact ◽  
Lead Free ◽  
Lead Free Solder ◽  
Solder Interconnects ◽  
Solder Interconnect ◽  
Lead Free Solder Alloy ◽  
Free Solder ◽  
Lead Free Solders

Lead free solders are replacing lead rich solders in the electronic industry, the performance and safety of lead free solder joints in electric packaging under drop impact becomes a critical concern of semiconductor and electronic product manufacturers. Compared with the lead rich solder alloy, lead free solder alloy typically has higher rigidity and lower ductility. The presence of the Intermetallic Compound (IMC) layer can also affect the drop impact response of the solder interconnect, which may lead to quasi-brittle solder/IMC interfacial fracture. The traditional drop test is expensive and time consuming, and it is quite difficult to observe the full dynamic responses during the drop impact. In the present study, numerical analysis is performed to investigate drop impact effect on ball grid array (BGA) electronic packaging with the intention of predicting the performance of solders under drop impact and providing the fundamental understanding required to design a reliable electric packaging. A three dimensional finite element model is developed to simulate the solder interconnect and electronic packaging failure under board-level drop impact. An impact analysis procedure coupled with sub-modeling technique is established. The Cu6Sn5 and Cu3Sn IMC layers are incorporated in the solder interconnects model; cohesive fracture mechanics based method is applied to predict the crack initiation and propagation near the IMC/solder interface. A lead-free solder alloy constitutive relationship comprising elastic and rate dependent plastic effects is incorporated in the computational model. The mechanical shock is the main failure mechanism of solder joint during drop impact. The susceptible failure location is concluded at the interface between the solder and intermetallic compound based on the stress criteria. The developed model can be used to compare the drop impact performance of different components and solder alloys, which can guide the proper selection of component and optimize the layout of BGA electric packing. The behavior of electric packaging and different types of solder interconnects under drop impact can be predicted with corresponding material parameters determined from experiment.

Sign in / Sign up

Export Citation Format

Share Document