21412 Indentation Crack Patterns and Fracture Toughness of Single-Crystalline Silicon Wafer Introduced by A Vickers Indenter

2010 ◽  
Vol 2010.16 (0) ◽  
pp. 483-484
Author(s):  
Masayoshi MIYASAKA ◽  
Satoshi SUTOH ◽  
Masayoshi TATENO ◽  
Yoshiki GOTOH
Keyword(s):  
Fracture Toughness ◽  
Silicon Wafer ◽  
Crystalline Silicon ◽  
Single Crystalline Silicon ◽  
Single Crystalline ◽  
Crack Patterns ◽  
Vickers Indenter ◽  
Indentation Crack

Pulsed Green-Laser Annealing for Single-Crystalline Silicon Film Transferred onto Silicon wafer and Non-alkaline Glass by Hydrogen-Induced Exfoliation

2007 ◽  
Vol 46 (1) ◽  
pp. 21-23 ◽  
Author(s):  
Norihito Kawaguchi ◽  
Ryusuke Kawakami ◽  
Ken-ichiro Nishida ◽  
Naoya Yamamoto ◽  
Miyuki Masaki ◽  
...  
Keyword(s):  
Silicon Wafer ◽  
Laser Annealing ◽  
Crystalline Silicon ◽  
Silicon Film ◽  
Green Laser ◽  
Single Crystalline Silicon ◽  
Single Crystalline

Fracture Characteristic of Single Crystalline Silicon Using Nano-Indentation and Finite Element Analysis

2006 ◽  
Vol 306-308 ◽  
pp. 601-606
Author(s):  
Seung Baek ◽  
Jae Mean Koo ◽  
Chang Sung Seok
Keyword(s):  
Fracture Toughness ◽  
Finite Element ◽  
Phase Transformation ◽  
Crystalline Silicon ◽  
Indentation Test ◽  
Indentation Load ◽  
Single Crystalline Silicon ◽  
Element Analysis ◽  
Single Crystalline ◽  
Nano Indentation

Nano-indentation test is used widely to determine the fracture toughness of brittle materials and to provide information on important material properties such as the Young’s modulus and hardness. In this study, using nano-indentation testing, atomic force microscope (AFM), and finite element method (FEM), we performed the indentation fracture toughness and fracture strength measurement for a (100) single crystalline silicon at different load states. In addition, the loads of the phase transformation events during unloading were estimated by the load-depth curves. The phase transformation load and micro-crack propagation events at pop-out during the unloading process depended on the maximum applied indentation load.

scholarly journals 21%-Efficient n-type Rear-junction PERT Solar Cell with Industrial Thin 156mm Cz Single Crystalline Silicon Wafer

2015 ◽  
Vol 77 ◽  
pp. 279-285 ◽  
Author(s):  
Jinyoun Cho ◽  
Hae-Na-Ra Shin ◽  
Jieun Lee ◽  
Yoonseok Choi ◽  
Jongchul Lee ◽  
...  
Keyword(s):  
Solar Cell ◽  
Silicon Wafer ◽  
Crystalline Silicon ◽  
Single Crystalline Silicon ◽  
Single Crystalline
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