Fundamental Study on Coating Wire Electrode for High Performance WEDM(Electrical machining)

Author(s):  
Masato MORITA ◽  
Toshiyuki YAMAUCHI ◽  
Akira OKADA ◽  
Yoshiyuki UNO ◽  
Toshiaki SHIMIZU
2012 ◽  
Vol 523-524 ◽  
pp. 287-292 ◽  
Author(s):  
Yasuhiro Okamoto ◽  
Yasuaki Kimura ◽  
Akira Okada ◽  
Yoshiyuki Uno ◽  
Jun Ohya ◽  
...  

Brittle materials, such as silicon, silicon carbide and sapphire have been conventionally sliced for wafers by a multi-wire saw method with slurry in industrial fields. Recently, the multi-wire saw method with a fixed diamond abrasive wire has been available as a commercial product at acceptable cost, and the high slicing performance is expected compared with the normal multi-wire saw method with slurry. However, there still remain some problems such as bad working environment with abrasives, cleaning cost of sliced wafers, crack generation on the sliced surface and a large kerf loss against a wafer thickness. On the other hand, the developed multi-wire EDM slicing method would accomplish the high performance slicing of silicon and silicon carbide with a narrow kerf width under a clean process environment. However, the thinner wire is challenging process with a normal round shape wire electrode. Therefore, the new wire electrode with track-shaped section was proposed in order to satisfy both the narrow kerf width and the high wire tension even in the case of thin wire electrode. In this study, the running control of wire electrode with a track-shaped section was experimentally investigated, and the possibility of proposed process was discussed.


2012 ◽  
Vol 66 (1) ◽  
pp. 367-374
Author(s):  
Kazuo YAMADA ◽  
Toshikatsu SEKI ◽  
Akira ONO ◽  
Takashi KAMIYA

2009 ◽  
Vol 43 (104) ◽  
pp. 179-186 ◽  
Author(s):  
Akira OKADA ◽  
Toshiyuki YAMAUCHI ◽  
Masayuki HIGASHI ◽  
Toshiaki SHIMIZU ◽  
Yoshiyuki UNO

Author(s):  
Dinesh P. R. Thanu ◽  
Roozbeh Danaei ◽  
Alexander Bermudez ◽  
Sergio A. Chan ◽  
Suzana Prstic

Nowadays microelectronic packaging has become a billion dollar business. Due to the increased material and production costs per package, manufacturing yield loss in this state-of-art business is expected to be at a bare minimum which is tough to persevere in a high volume manufacturing environment. Additionally, high performance and varied power computing needs in the electronic business demands microprocessors with different form factors and complex package designs. One of the most common joint which is extensively used in such a complicated package is the polymer to metal bonding. In the latest technology products involving high package warpage, interfacial bonding has to be strong enough to withstand the dynamic warpage and high mechanical stresses associated with it and hence the reliability of polymer to metal adhesion is critical. In this paper, fundamental mechanisms related to adhesion phenomena of polymer-metal interface are proposed. Adhesive failure modes related to polymer-metal bonding and key variables influencing the bonding of silicone based polymer material to nickel electroplated on copper in an integrated circuit heat spreader assembly are experimentally studied. Factors modulating polymer to metal bonding including interfacial chemistry, surface contamination and material roughness are evaluated.


2009 ◽  
Vol 63 (1) ◽  
pp. 493-499
Author(s):  
Masamichi TAKAHASHI ◽  
Kenzo SEKIJIMA ◽  
Junichi IZUMO

Author(s):  
Shunsuke TANAKA ◽  
Kimio MARUYAMA ◽  
Kiyoshi TAKEICHI ◽  
Tomohiro FURUTA

1990 ◽  
Vol 515 ◽  
pp. 91-123 ◽  
Author(s):  
Tsutomu Kawasaki ◽  
Makoto Niikura ◽  
Yuriko Kobayashi

2020 ◽  
Vol 49 (7) ◽  
pp. 2140-2195 ◽  
Author(s):  
Xiaofei Yang ◽  
Jing Luo ◽  
Xueliang Sun

This review article provides a comprehensive overview of solid-state Li–S batteries from the viewpoints of fundamental study and engineering design.


2017 ◽  
Vol 28 (7) ◽  
pp. 075401 ◽  
Author(s):  
Congyan Zhang ◽  
Ming Yu ◽  
George Anderson ◽  
Ruchira Ravinath Dharmasena ◽  
Gamini Sumanasekera

Procedia CIRP ◽  
2013 ◽  
Vol 6 ◽  
pp. 232-237 ◽  
Author(s):  
A. Kimura ◽  
Y. Okamoto ◽  
A. Okada ◽  
J. Ohya ◽  
T. Yamauchi

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