Fundamental Study of Polymer to Metal Bonding in Integrated Circuit Packaging

2018 ◽  
Author(s):  
Dinesh P. R. Thanu ◽  
Roozbeh Danaei ◽  
Alexander Bermudez ◽  
Sergio A. Chan ◽  
Suzana Prstic
Keyword(s):  
Integrated Circuit ◽  
High Performance ◽  
Failure Modes ◽  
Form Factors ◽  
High Volume ◽  
Production Costs ◽  
Interfacial Chemistry ◽  
Fundamental Study ◽  
Metal Bonding ◽  
Polymer Metal

Nowadays microelectronic packaging has become a billion dollar business. Due to the increased material and production costs per package, manufacturing yield loss in this state-of-art business is expected to be at a bare minimum which is tough to persevere in a high volume manufacturing environment. Additionally, high performance and varied power computing needs in the electronic business demands microprocessors with different form factors and complex package designs. One of the most common joint which is extensively used in such a complicated package is the polymer to metal bonding. In the latest technology products involving high package warpage, interfacial bonding has to be strong enough to withstand the dynamic warpage and high mechanical stresses associated with it and hence the reliability of polymer to metal adhesion is critical. In this paper, fundamental mechanisms related to adhesion phenomena of polymer-metal interface are proposed. Adhesive failure modes related to polymer-metal bonding and key variables influencing the bonding of silicone based polymer material to nickel electroplated on copper in an integrated circuit heat spreader assembly are experimentally studied. Factors modulating polymer to metal bonding including interfacial chemistry, surface contamination and material roughness are evaluated.

Thermal Modeling of Plastic Ic Packages

1991 ◽  
Vol 226 ◽  
Author(s):  
A. Bar-Cohen ◽  
Devin E. Mix
Keyword(s):  
Integrated Circuit ◽  
High Performance ◽  
Failure Modes ◽  
Material Selection ◽  
Thermal Modeling ◽  
Temperature Fields ◽  
Analytical Models ◽  
Element Analysis ◽  
Component Reliability ◽  
Thermal Expansion Coefficients

AbstractThe successful design of plastic integrated circuit packages for high performance VLSI chips is a crucial element in the development of costeffective packaging technology. Unfortunately, however, most common plastic encapsulating and die-bonding materials provide relatively low thermal conductivities and large thermal expansion coefficients, as well as low mechanical strengths and a limited operating temperature range. These material properties combine to produce a large number of thermally induced package failure modes. Thus, insightful material selection and detailed design, based on extensive thermal modeling/analysis, must be performed to achieve acceptable levels of component reliability.This paper begins with a discussion of the temporal development of the temperature fields inside a plastic IC package and continues with the presentation of transient and steady-state, first-order analytical models for: the chip temperature, the temperature and gradient across the die bond, and the half-thickness encapsulant temperature. The values obtained for a typical PDIP package are discussed and compared to the results of a finite-element analysis of this package. The insights obtained from these analyses are used to develop material Figures-of-Merit that can be used in the selection of die-bond and encapsulant materials for plastic IC packages.

Assessment of Secondary Fiber Print-Through Effects on Class-A CFRP Parts Produced with Highly Cost Efficient Processes

2019 ◽  
Vol 809 ◽  
pp. 569-574
Author(s):  
Dominik Metzger ◽  
Joachim Meeß ◽  
Michael Heine ◽  
Thomas Henke
Keyword(s):  
Surface Layer ◽  
High Performance ◽  
High Volume ◽  
Production Costs ◽  
Laser Triangulation ◽  
Uneven Surface ◽  
Class A ◽  
Surface Distortion ◽  
Measuring Techniques ◽  
Cost Efficient

Cost-optimized materials and processes are the key to high-performance components at attractive production costs. This study shows that non crimp fabrics (NCF) used as inner layers of high performance Class-A cfrp parts can lead to unwanted print-through effects on Class-A composite surfaces, even though they are not the surface layer. This surface distortion that is expressed in scattered lines in the direction of inner NCF layers can lead to high reject rates and is normally first noticed in the painted state. The presented methodology is able to quantify this secondaryprint-through effect for cured composites as well as for the dry textile intermediates. The surface can be measured with conventional measuring techniques, such as laser triangulation or interferometers, and characterized with the standardized values Sz and Sz25. The results show that the visible and measurable more uneven surface of a 50k biaxial NCF leads to significantly higher Sz and Sz25 values in the dry textile and the cured component. Also the regularity of the measured textiles can be detected by determining the variation of different areas of a 800 by 800mm sized sample. The presented methodology has the potential to optimize the incoming goods inspection of high volume Class-A composite manufacturers, as well as the requirement-orientated and cost-efficient development of textile intermediates by suppliers.

scholarly journals Fundamental Study on the Development of Sprayed High Performance Fiber Reinforced Cementitious Composites for Impact-Blast Resistant

2017 ◽  
Author(s):  
Yun-Wang Choi ◽  
Byung-Keol Choi ◽  
Sung-Rok Oh ◽  
Man-Seok Park
Keyword(s):  
Compressive Strength ◽  
Fly Ash ◽  
High Performance ◽  
Drying Shrinkage ◽  
High Volume ◽  
Heat Of Hydration ◽  
Economic Feasibility ◽  
Fundamental Study ◽  
Binder Ratio ◽  
High Performance Fiber

In the recent concrete industry, high fluidity concrete is being widely used for the pouring of dense reinforced concrete. Normally, in the case of high fluidity concrete, it includes high binder contents, so it is necessary to replace part of the cement through admixtures such as fly ash to procure economic feasibility and durability. This study shows the mechanical properties and field applicability of high fluidity concrete that using mass of fly ash as alternative materials of cement. The high fluidity concrete mixed with 50% fly ash was measured to manufacture concrete that applies low water/binder ratio to measure the mechanical characteristics as compressive strength and elastic modulus. Also, in order to evaluate the field applicability, high fluidity concrete containing high volume fly ash was evaluated that fluidity, compressive strength, heat of hydration and drying shrinkage of concrete.

Scanning Electron Microscopy in Hybrid Microelectronics

1976 ◽  
Vol 34 ◽  
pp. 456-457
Author(s):  
S. Khadpe ◽  
R. Faryniak
Keyword(s):  
Integrated Circuits ◽  
Thick Film ◽  
Integrated Circuit ◽  
Failure Modes ◽  
Three Dimensional ◽  
Circuit Components ◽  
Hybrid Microcircuit ◽  
Electrical Connections ◽  
Scanning Electron

The Scanning Electron Microscope (SEM) is an important tool in Thick Film Hybrid Microcircuits Manufacturing because of its large depth of focus and three dimensional capability. This paper discusses some of the important areas in which the SEM is used to monitor process control and component failure modes during the various stages of manufacture of a typical hybrid microcircuit.Figure 1 shows a thick film hybrid microcircuit used in a Motorola Paging Receiver. The circuit consists of thick film resistors and conductors screened and fired on a ceramic (aluminum oxide) substrate. Two integrated circuit dice are bonded to the conductors by means of conductive epoxy and electrical connections from each integrated circuit to the substrate are made by ultrasonically bonding 1 mil aluminum wires from the die pads to appropriate conductor pads on the substrate. In addition to the integrated circuits and the resistors, the circuit includes seven chip capacitors soldered onto the substrate. Some of the important considerations involved in the selection and reliability aspects of the hybrid circuit components are: (a) the quality of the substrate; (b) the surface structure of the thick film conductors; (c) the metallization characteristics of the integrated circuit; and (d) the quality of the wire bond interconnections.

scholarly journals A thin, deformable, high-performance supercapacitor implant that can be biodegraded and bioabsorbed within an animal body

2021 ◽  
Vol 7 (2) ◽  
pp. eabe3097
Author(s):  
Hongwei Sheng ◽  
Jingjing Zhou ◽  
Bo Li ◽  
Yuhang He ◽  
Xuetao Zhang ◽  
...  
Keyword(s):  
High Performance ◽  
Electronic Devices ◽  
Form Factors ◽  
Time Frame ◽  
Water Soluble ◽  
Two Dimensional ◽  
Medical Electronics ◽  
Thin Structure ◽  
Shed Light

It has been an outstanding challenge to achieve implantable energy modules that are mechanically soft (compatible with soft organs and tissues), have compact form factors, and are biodegradable (present for a desired time frame to power biodegradable, implantable medical electronics). Here, we present a fully biodegradable and bioabsorbable high-performance supercapacitor implant, which is lightweight and has a thin structure, mechanical flexibility, tunable degradation duration, and biocompatibility. The supercapacitor with a high areal capacitance (112.5 mF cm−2 at 1 mA cm−2) and energy density (15.64 μWh cm−2) uses two-dimensional, amorphous molybdenum oxide (MoOx) flakes as electrodes, which are grown in situ on water-soluble Mo foil using a green electrochemical strategy. Biodegradation behaviors and biocompatibility of the associated materials and the supercapacitor implant are systematically studied. Demonstrations of a supercapacitor implant that powers several electronic devices and that is completely degraded after implantation and absorbed in rat body shed light on its potential uses.

Accelerated testing of super lightweight UHPC waffle deck under heavy vehicle simulator

2021 ◽  
Vol 16 (2-3) ◽  
pp. 61-74
Author(s):  
Sahar Ghasemi ◽  
Amir Mirmiran ◽  
Yulin Xiao ◽  
Kevin Mackie
Keyword(s):  
High Performance ◽  
Failure Modes ◽  
High Performance Concrete ◽  
High Strength ◽  
Heavy Vehicle ◽  
Wheel Load ◽  
Element Analysis ◽  
Vehicle Simulator ◽  
Pavement Testing ◽  
Heavy Vehicle Simulator

A super lightweight deck can enhance load rating and functionality of a bridge, especially those identified as structurally deficient. This study was aimed to develop and experimentally validate a novel bridge deck as an ultra-lightweight low-profile waffle slab of ultra-high-performance concrete (UHPC) with either carbon fiber reinforced polymer (CFRP) or high strength steel (HSS) reinforcement. The proposed system lends itself to accelerated bridge construction, rapid deck replacement in bridges with load restrictions, and bridge widening applications without the need to replace girders. Performance and failure modes of the proposed deck were initially assessed through extensive lab experiments and finite element analysis, which together confirmed that the proposed deck panel meets the AASHTO LRFD requirements. The proposed deck system is not susceptible to punching shear of its thin slab and fails in a rather ductile manner. To evaluate its long-term performance, the system was further tested under the dynamic impact of wheel load at the Accelerated Pavement Testing (APT) facility of the Florida Department of Transportation using a Heavy Vehicle Simulator (HVS).

PERFORMANCE AT THE EDGE: GALLIUM ARSENIDE AND SILICON ICs FOR OPTICAL ELECTRONICS

1991 ◽  
Vol 02 (03) ◽  
pp. 147-162 ◽  
Author(s):  
ROBERT G. SWARTZ
Keyword(s):  
Gallium Arsenide ◽  
Optical Communication ◽  
Optical Communications ◽  
Integrated Circuit ◽  
High Performance ◽  
Compound Semiconductor ◽  
Performance Curve ◽  
Semiconductor Technology ◽  
Market Trends ◽  
Circuit Technology

Compound semiconductor technology is rapidly entering the mainstream, and is quickly finding its way into consumer applications where high performance is paramount. But silicon integrated circuit technology is evolving up the performance curve, and CMOS in particular is consuming ever more market share. Nowhere is this contest more clearly evident than in optical communications. Here applications demand performance ranging from a few hundreds of megahertz to multi-gigahertz, from circuits containing anywhere from tens to tens of thousands of devices. This paper reviews the high performance electronics found in optical communication applications from a technology standpoint, illustrating merits and market trends for these competing, yet often complementary IC technologies.

Synthesis of High-Performance Hard Carbon from Waste Coffee Ground as Sodium Ion Battery Anode Material: A Review

2021 ◽  
Vol 1044 ◽  
pp. 25-39
Author(s):  
Hafid Khusyaeri ◽  
Dewi Pratiwi ◽  
Haris Ade Kurniawan ◽  
Anisa Raditya Nurohmah ◽  
Cornelius Satria Yudha ◽  
...  
Keyword(s):  
Electrochemical Performance ◽  
Electrode Material ◽  
High Performance ◽  
Production Costs ◽  
Sodium Ion ◽  
Carbon Anode ◽  
Sodium Ion Battery ◽  
Sodium Ion Batteries ◽  
Hard Carbon ◽  
Coffee Grounds

The battery is a storage medium for electrical energy for electronic devices developed effectively and efficiently. Sodium ion battery provide large-scale energy storage systems attributed to the natural existence of the sodium element on earth. The relatively inexpensive production costs and abundant sodium resources in nature make sodium ion batteries attractive to research. Currently, sodium ion batteries electrochemical performance is still less than lithium-ion batteries. The electrochemical performance of a sodium ion battery depends on the type of electrode material used in the manufacture of the batteries.. The main problem is to find a suitable electrode material with a high specific capacity and is stable. It is a struggle to increase the performance of sodium ion batteries. This literature study studied how to prepare high-performance sodium battery anodes through salt doping. The doping method is chosen to increase conductivity and electron transfer. Besides, this method still takes into account the factors of production costs and safety. The abundant coffee waste biomass in Indonesia was chosen as a precursor to preparing a sodium ion battery hard carbon anode to overcome environmental problems and increase the economic value of coffee grounds waste. Utilization of coffee grounds waste as hard carbon is an innovative solution to the accumulation of biomass waste and supports environmentally friendly renewable energy sources in Indonesia.

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